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D55342H07B117BRTF

Description
RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 117000 ohm, SURFACE MOUNT, 1206, CHIP
CategoryPassive components    The resistor   
File Size111KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet Parametric View All

D55342H07B117BRTF Overview

RESISTOR, THIN FILM, 0.25 W, 0.1 %, 50 ppm, 117000 ohm, SURFACE MOUNT, 1206, CHIP

D55342H07B117BRTF Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
package instructionSMT, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresNON-INDUCTIVE, LASER TRIMMABLE
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package height0.254 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingTR, Embossed, 7 Inch
Rated power dissipation(P)0.25 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance117000 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.1%
Operating Voltage100 V
E/H (Military M/D55342)
Vishay Thin Film
QPL MIL-PRF-55342 Qualified Thin Film Resistor Chips
FEATURES
Established reliability, “R” failure rate level (100 ppm), C = 2
High purity alumina substrate 99.6 % purity
Wraparound termination featuring a tenacious adhesion
layer covered with an electroplated nickel barrier layer for
+ 150 °C operating conditions
Very low noise and voltage coefficient
(< - 25 dB, 0.5 ppm/V)
Non-inductive
Laser-trimmed tolerances ± 0.1 %
Wraparound resistance less than 0.010
Ω
typical
In-lot tracking less than 5 ppm/°C
Complete MIL-testing available in-house
Antistatic waffle pack or tape and reel packaging available
Military/aerospace/QPL
SURFACE MOUNT
CHIPS
Actual Size
M55342/02
Thin Film Mil chip resistors feature all sputtered wraparound
termination for excellent adhesion and dimensional
uniformity. They are ideal in applications requiring stringent
performance requirements. Established reliability is assured
through 100 % screening and extensive environmental lot
testing. Wafer is sawed producing exact dimensions and
clean, straight edges.
Note
Specification changed
MIL-PRF-55342
by
DSCC
from
MIL-R-55342
to
CONSTRUCTION
TYPICAL PERFORMANCE
ABS
Passivation
Resistor film
Solder
coating
Nickel barrier
High ourity
alumina substrate
Adhesion layer
TCR
TOL
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
Test
Material
Absolute TCR
Absolute Tolerance
Stability:
ΔR
Absolute
Voltage Coefficient
Operating Temperature Range
Storage Temperature Range
Noise
Shelf Life Stability
SPECIFICATIONS
Passivated nichrome
± 25 ppm/°C to ± 300 ppm/°C TCR
± 0.1 %
± 0.1 %
± 0.5 ppm/V
- 55 °C to + 125 °C
- 55 °C to + 150 °C
- 25 dB
100 ppm
1 year at + 25 °C
- 55 °C to + 125 °C
+ 25 °C
2000 h at + 70 °C
CONDITIONS
www.vishay.com
50
For technical questions, contact:
thin-film@vishay.com
Document Number: 60018
Revision: 16-Sep-09
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