74F322 datasheet, PDF - EEWORLD Datasheet

74F322: Description8-bit serial/parallel register with sign extend 3-State; File Size178KB，10 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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74F322 Overview

8-bit serial/parallel register with sign extend 3-State

74F322 Related Products

	74F322	54F322DM	54F322FM	54F322LM	74F322PC	74F322SJ	54F322
Description	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State	8-bit serial/parallel register with sign extend 3-State
Is it Rohs certified?	-	incompatible	incompatible	incompatible	-	incompatible	-
package instruction	-	DIP, DIP20,.3	DFP, FL20,.3	QCCN, LCC20,.35SQ	-	SOP, SOP20,.3	-
Reach Compliance Code	-	unknow	unknow	unknow	-	unknow	-
Other features	-	COMMON I/O PINS; SIGN EXTEND FUNCTION; TOTEMPOLE SERIAL SHIFT RIGHT OUTPUT	COMMON I/O PINS; SIGN EXTEND FUNCTION; TOTEMPOLE SERIAL SHIFT RIGHT OUTPUT	COMMON I/O PINS; SIGN EXTEND FUNCTION; TOTEMPOLE SERIAL SHIFT RIGHT OUTPUT	-	COMMON I/O PINS; SIGN EXTEND FUNCTION; TOTEMPOLE SERIAL SHIFT RIGHT OUTPUT	-
Counting direction	-	RIGHT	RIGHT	RIGHT	-	RIGHT	-
series	-	F/FAST	F/FAST	F/FAST	-	F/FAST	-
JESD-30 code	-	R-GDIP-T20	R-GDFP-F20	S-CQCC-N20	-	R-PDSO-G20	-
JESD-609 code	-	e0	e0	e0	-	e0	-
Load capacitance (CL)	-	50 pF	50 pF	50 pF	-	50 pF	-
Logic integrated circuit type	-	PARALLEL IN PARALLEL OUT	PARALLEL IN PARALLEL OUT	PARALLEL IN PARALLEL OUT	-	PARALLEL IN PARALLEL OUT	-
Maximum Frequency@Nom-Su	-	50000000 Hz	50000000 Hz	50000000 Hz	-	70000000 Hz	-
Number of digits	-	8	8	8	-	8	-
Number of functions	-	1	1	1	-	1	-
Number of terminals	-	20	20	20	-	20	-
Maximum operating temperature	-	125 °C	125 °C	125 °C	-	70 °C	-
Output characteristics	-	3-STATE	3-STATE	3-STATE	-	3-STATE	-
Output polarity	-	TRUE	TRUE	TRUE	-	TRUE	-
Package body material	-	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	-	PLASTIC/EPOXY	-
encapsulated code	-	DIP	DFP	QCCN	-	SOP	-
Encapsulate equivalent code	-	DIP20,.3	FL20,.3	LCC20,.35SQ	-	SOP20,.3	-
Package shape	-	RECTANGULAR	RECTANGULAR	SQUARE	-	RECTANGULAR	-
Package form	-	IN-LINE	FLATPACK	CHIP CARRIER	-	SMALL OUTLINE	-
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
power supply	-	5 V	5 V	5 V	-	5 V	-
Maximum supply current (ICC)	-	90 mA	90 mA	90 mA	-	90 mA	-
propagation delay (tpd)	-	10 ns	10 ns	10 ns	-	12 ns	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	-
Maximum seat height	-	5.08 mm	2.286 mm	1.905 mm	-	2.108 mm	-
Maximum supply voltage (Vsup)	-	5.5 V	5.5 V	5.5 V	-	5.5 V	-
Minimum supply voltage (Vsup)	-	4.5 V	4.5 V	4.5 V	-	4.5 V	-
Nominal supply voltage (Vsup)	-	5 V	5 V	5 V	-	5 V	-
surface mount	-	NO	YES	YES	-	YES	-
technology	-	TTL	TTL	TTL	-	TTL	-
Temperature level	-	MILITARY	MILITARY	MILITARY	-	COMMERCIAL	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	-
Terminal form	-	THROUGH-HOLE	FLAT	NO LEAD	-	GULL WING	-
Terminal pitch	-	2.54 mm	1.27 mm	1.27 mm	-	1.27 mm	-
Terminal location	-	DUAL	DUAL	QUAD	-	DUAL	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	-
width	-	7.62 mm	6.731 mm	8.89 mm	-	5.3 mm	-
minfmax	-	50 MHz	50 MHz	50 MHz	-	70 MHz	-
Base Number Matches	-	1	1	1	-	1	-

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