Changes to Ordering Guide .......................................................... 16
9/04—Changed from Rev. 0 to Rev. A
Updated Format .................................................................. Universal
Change to Data Sheet Title ...............................................................1
Change to Features ............................................................................1
Change to Product Highlights .........................................................1
Changes to Specifications .................................................................3
Change to ADG9xx Evaluation Board section ........................... 13
Changes to Ordering Guide .......................................................... 14
8/03 Revision 0: Initial Version
Rev. C | Page 2 of 16
ADG918/ADG919
SPECIFICATIONS
V
DD
= 1.65 V to 2.75 V, GND = 0 V, input power = 0 dBm, all specifications T
MIN
to T
MAX
, unless otherwise noted. Temperature range for
B Version: −40°C to +85°C.
Table 1.
Parameter
AC ELECTRICAL CHARACTERISTICS
Operating Frequency
2
3 dB Frequency
3
Input Power
3
Insertion Loss
Symbol
Conditions
Min
dc
0 V dc bias
0.5 V dc bias
DC to 100 MHz; V
DD
= 2.5 V ± 10%
500 MHz; V
DD
= 2.5 V ± 10%
1000 MHz; V
DD
= 2.5 V ± 10%
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
DC to 100 MHz
500 MHz
1000 MHz
50% CTRL to 90% RF
50% CTRL to 10% RF
10% to 90% RF
90% to 10% RF
1000 MHz
900 MHz/901 MHz, 4 dBm
B Version
Typ
1
Max
2
4
7
16
0.7
0.8
1.25
Unit
GHz
GHz
dBm
dBm
dB
dB
dB
dB
dB
dB
dB
dB
dB
S
21
, S
12
Isolation—RFC to RF1/RF2
(CP Package)
Isolation—RFC to RF1/RF2
(RM Package)
Isolation—RF1 to RF2 (Crosstalk)
(CP Package)
Isolation—RF1 to RF2 (Crosstalk)
(RM Package)
Return Loss (On Channel)
3
S
21
, S
12
S
21
, S
12
S
21
, S
12
S
21
, S
12
S
11
, S
22
Return Loss (Off Channel)
3
ADG918
On Switching Time
3
Off Switching Time
3
Rise Time
3
Fall Time
3
1 dB Compression
3
Third Order Intermodulation Intercept
Video Feedthrough
4
DC ELECTRICAL CHARACTERISTICS
Input High Voltage
Input Low Voltage
Input Leakage Current
S
11
, S
22
57
46
36
55
43
34
55
41
31
54
39
31
21
22
22
18
17
16
t
ON
t
OFF
t
RISE
t
FALL
P
–1 dB
IP
3
28.5
0.4
0.5
0.8
60
49
43
60
47
37
58
44
37
57
42
33
27
27
26
23
21
20
6.6
6.5
6.1
6.1
17
36
2.5
10
9.5
9
9
dB
dB
dB
dB
dB
dB
ns
ns
ns
ns
dBm
dBm
mV p-p
V
V
V
V
μA
V
INH
V
INH
V
INL
V
INL
I
I
V
DD
= 2.25 V to 2.75 V
V
DD
= 1.65 V to 1.95 V
V
DD
= 2.25 V to 2.75 V
V
DD
= 1.65 V to 1.95 V
0 V ≤ V
IN
≤ 2.75 V
1.7
0.65 V
CC
0.7
0.35 V
CC
±1
± 0.1
Rev. C | Page 3 of 16
ADG918/ADG919
Parameter
CAPACITANCE
3
RF On Capacitance
CTRL Input Capacitance
POWER REQUIREMENTS
V
DD
Quiescent Power Supply Current
1
2
Symbol
C
RF
ON
C
CTRL
Conditions
f = 1 MHz
f = 1 MHz
Min
B Version
Typ
1
1.6
2
Max
Unit
pF
pF
1.65
I
DD
Digital inputs = 0 V or V
DD
0.1
2.75
1
V
μA
Typical values are at V
DD
= 2.5 V and 25°C, unless otherwise stated.
Point at which insertion loss degrades by 1 dB.
3
Guaranteed by design, not subject to production test.
4
The dc transience at the output of any port of the switch when the control voltage is switched from high to low or low to high in a 50 Ω test setup, measured with 1 ns
rise time pulses and 500 MHz bandwidth.
Rev. C | Page 4 of 16
ADG918/ADG919
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 2.
Parameter
V
DD
to GND
Inputs to GND
Continuous Current
Input Power
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
θ
JA
Thermal Impedance
LFCSP Package
θ
JA
Thermal Impedance (2-layer board)
θ
JA
Thermal Impedance (4-layer board)
Lead Temperature, Soldering (10 sec)
IR Reflow, Peak Temperature (<20 sec)
ESD
1
Rating
–0.5 V to +4 V
–0.5 V to V
DD
+ 0.3 V
1
30 mA
18 dBm
–40°C to +85°C
–65°C to +150°C
150°C
206°C/W
84°C/W
48°C/W
300°C
235°C
1 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
RF1 and RF2 off port inputs to ground: −0.5 V to V
[size=14px] Design and writing of uClinux device driver Reprinted: Design and writing of uClinux device driver 1 General steps for writing device driver (1) Determine the major device number of the de...
I want to enable I2C1 and use pins PF6 and PF7. I configured the pins according to I2C0. The code is as follows: [code]void i2c_gpio_config(void) { /* enable GPIOB clock */ rcu_periph_clock_enable(RCU...
I recently learned about low power consumption of MSP430F149, but I don't quite understand it. In what situations can low power consumption mode be used? For example, can low power consumption be used...
Do you often have to add brake fluid to your car's brakes? The fact that you need to pump out the brake fluid to make sure there is no gas in the brake fluid line may not be done by the car owner h...[Details]
Analog engineers have traditionally struggled with complexity when designing power supplies that required multiple outputs, dynamic load sharing, hot-swap, or extensive fault-handling capabilities....[Details]
introduction
In the discharge process of tokamak plasma physics, the study of rupture and sawtooth is of great significance. Rupture and sawtooth exist in most tokamaks. Rupture is a notew...[Details]
The reason for the light decay of white LEDs: the decline of phosphor performance
So far, the rapid decline of the luminous performance of white light LEDs, especially low-power white light LE...[Details]
For a long time, due to the limitation of hardware conditions, the display devices of traditional small handheld devices such as PDA are usually monochrome LCD, and the user interface is very simpl...[Details]
I. Introduction
Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
hint:
The number of speakers and their spacing limit the sound field of a portable stereo system.
Spatial audio attempts to artificially recreate the experience of listening to sounds i...[Details]
Since AC mains power may experience power outages, voltage sags and surges, continuous undervoltage and overvoltage, and frequency fluctuations during supply, these factors will affect the continuous ...[Details]
1 Basic Features
In computer control systems and various intelligent instruments and meters composed of single-chip microcomputers (or microprocessors), various external analog signals must be ...[Details]
Abstract: In order to realize wireless automatic alarm and monitoring of major safety places, based on the basic principle of pyroelectric infrared sensing, a detector for receiving infrared radia...[Details]
1 Overview
In the field of traditional lighting, the concepts and definitions of lamps and lamps are clear. Lamps and lamps have their own applicable product standards, supporting technical st...[Details]
summary
This article will briefly analyze the success and shortcomings of high-frequency DC-DC switching power supplies in the process of miniaturization (the second basic goal), and propose m...[Details]
There are many types and styles of digital voltmeters in design and development. Traditional digital voltmeters have their own characteristics. They are suitable for manual measurement on site. Tra...[Details]