EEWORLDEEWORLDEEWORLD

Part Number

Search

BF135-48-B-0250-0700-0400-L-C

Description
Board Connector,
CategoryThe connector    The connector   
File Size134KB,1 Pages
ManufacturerGlobal Connector Technology
Environmental Compliance
Download Datasheet Parametric View All

BF135-48-B-0250-0700-0400-L-C Overview

Board Connector,

BF135-48-B-0250-0700-0400-L-C Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Reach Compliance Codecompliant
ECCN codeEAR99
Connector typeBOARD CONNECTOR
Contact to complete cooperationGOLD FLASH
Contact completed and terminatedTIN
Contact materialCOPPER ALLOY
JESD-609 codee3
Manufacturer's serial numberBF135
1
2
3
4
Global Connector Technology Ltd. - BF135: 2.0mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT, HORIZONTAL
A
4.00
5
6
7
8
DIMENSIONS
A
4.0
6.0
8.0
10.0
12.0
14.0
16.0
18.0
20.0
22.0
24.0
26.0
28.0
30.0
32.0
34.0
36.0
38.0
40.0
42.0
44.0
46.0
48.0
B
6.2
8.2
10.2
12.2
14.2
16.2
18.2
20.2
22.2
24.2
26.2
28.2
30.2
32.2
34.2
36.2
38.2
40.2
42.2
44.2
46.2
48.2
50.2
CONTACTS
6
8
10
12
14
16
A
2.00 Typ.
B
B±0.35
A±0.20
2.00
PIN 0.50 SQ (Typ.)
18
20
22
24
26
28
30
32
34
36
38
40
42
44
B
2.00
1.73
C±0.2
C
C
2.00
Typ. (Non-Accum)
D
1.27
E±0.2
D±0.2
D
E
46
2.00 Typ.
48
50
E
1.27
E
SPECIFICATIONS
规格
CURRENT RATING
电流额定值:
2.0 AMP
INSULATION RESISTANCE
绝缘电阻值:
1000 MΩ Min.
CONTACT RESISTANCE
接触电阻值:
20 mΩ Max.
DIELECTRIC WITHSTANDING
耐电压:
500 V AC
OPERATING TEMPERATURE
工½温度:
-40°C TO +105°C
CONTACT MATERIAL
端子物料:
COPPER ALLOY
INSULATOR MATERIAL
绝缘½物料
:
STANDARD
标准物料
: POLYAMIDE
聚醯胺
, NYLON 6T, UL 94V-0
OPTIONS
可选物料
: POLYESTER
聚酯
, LCP, UL 94V-0
SOLDERING PROCESS
可焊性
:
NYLON 6T (STANDARD
标准物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
:230°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
LCP (OPTION
可选物料
) -
IR REFLOW
回流焊
: 260°C for 10 sec.
WAVE
波峰焊
:250°C for 5-10 sec.
MANUAL SOLDER
人工焊接
: 350°C for 3-5 sec
MATES WITH
配套之母座
(SUBJECT TO PIN LENGTH
在端子长度适合的条件下
):
BF065
BF080
BF095
BF100
BF115
BF120
By
DETAIL
REV
DATE
LYH
DRAWING
RELEASE
A
31/10/07
PN
PCB
LAYOUT
B
20/04/09
CB
PACKING
OPTIONS
C
23/04/09
DR
SOLDER
TEMP.
D
05/08/09
SA
DIM.
POSITION
E
09/10/09
AJO
MATES WITH
UPDATED
F
18/06/13
0.90
RECOMMENDED PCB LAYOUT
B
E
Ordering Grid
BF135
XX
X
XXXX
XXXX
XXXX
X
X
REQUEST SAMPLES
AND QUOTATION
No. of Contacts
02 to 50
Contact Plating
A = Gold Flash All Over
(Standard)
B = Selective Gold Flash Contact Area/
Tin On Tail
C = Tin All Over
G = 10µ" Gold Contact Area/Tin On Tail
I = 30µ" Gold Contact Area/Tin On Tail
Dimension C (1/100mm)
(Post Length)
0400
=
4.00mm
(Standard)
Or specify Dimension C
eg 0250 = 2.50mm
F
G
Dimension D (1/100mm)
(Insulator to End of Pin)
0700 = 7.00mm
(Standard)
Or specify Dimension D
eg 0250 = 2.50mm
Packing Options
C = Tape and Reel with Cap
(Standard)
D = Tube
F = Tube with Cap
C
Insulator Material
N = Nylon 6T
(Standard)
L = LCP
Dimension E (1/100mm)
(Pin Curve to End of Pin)
0400
=
4.00mm
(Standard)
Or specify Dimension E
eg 0250 = 2.50mm
(Dimension E should be
equivalent to dim D minus 3.00mm)
F
G
Tolerances
(Except as noted)
Part Number:-
Date:-
Dimensions in mm
BF135
Description:-
31 OCT 07
H
X.°±5°
X.X ± 0.20
.X°±2°
X.XX ± 0.15 .XX°±1°
X.XXX ± 0.10 .XXX°±0.5°
Third Angle Projection
X. ± 0.30
2.0mm PITCH PIN HEADER, DUAL ROW,
SURFACE MOUNT, HORIZONTAL
GC
Scale
NTS
H
Sheet No.
E & OE
1/1
www.gct.co
Material
Drawn by
LYH
C
THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE
COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT
Revision
F
See Note
1
2
3
4
5
6
7
8
stm32hardfaultexception problem thanks
I made a small board with ucos+stm32 for analog acquisition of modbus. After a while, it can run normally when nothing is connected to the acquisition end and the acquisition result is zero. However, ...
zry113 stm32/stm8
Can the STM32 with FSMC support multiple SRAMs?
I want to connect 4 8Mbit SRAMs,is that ok?...
fs3328787 stm32/stm8
Windows mobile c++ group: 14753690.
Welcome to join the group. Windows mobile c++ group: 14753690....
czl1983 Embedded System
MSC driver optimization of VSF's USB slave protocol stack
[i=s]This post was last edited by versaloon on 2015-12-14 19:45[/i] The MSC part of the USB slave protocol stack in VSF was previously implemented using a round-robin architecture. Now that VSF has ad...
versaloon Embedded System
Question about C2000 NOP instruction
I don't understand the functional description of the NOP instruction on page 6-250 in the document SPRU430E "TMS320C28X CPU and Instruction Set Reference Guide". What exactly is done? From the OpCode,...
社会实践 Microcontroller MCU
The wide temperature version of RK3399K core board is now online
Since Feiling Embedded released the FET3399-C core board on New Year's Day 2020, the product has been widely praised and its excellent performance has been tested by the market. On this basis, in orde...
小螃蟹呀 ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1040  1100  578  585  1888  21  23  12  38  45 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号