BC817-25QA; BC817-40QA
45 V, 500 mA NPN general-purpose transistors
Rev. 1 — 3 September 2013
Product data sheet
1. Product profile
1.1 General description
500 mA NPN general-purpose transistors in a leadless ultra small
DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible
and solderable side pads.
Table 1.
Product overview
Package
NXP
BC817-25QA
BC817-40QA
DFN1010D-3
(SOT1215)
JEITA
-
BC807-25QA
BC807-40QA
PNP complement
Type number
1.2 Features and benefits
General-purpose transistor
Two current gain selections
Low package height of 0.37 mm
AEC-Q101 qualified
1.3 Applications
General-purpose switching and amplification
Mobile applications
1.4 Quick reference data
Table 2.
Symbol
V
CEO
I
C
h
FE
Quick reference data
Parameter
collector-emitter voltage
collector current
DC current gain
BC817-25QA
BC817-40QA
[1]
Pulse test: t
p
300
s;
0.02.
Conditions
open base
V
CE
= 1 V; I
C
= 100 mA
[1]
Min
-
-
160
250
Typ
-
-
-
-
Max
45
500
400
600
Unit
V
mA
NXP Semiconductors
BC817-25QA; BC817-40QA
45 V, 500 mA NPN general-purpose transistors
2. Pinning information
Table 3.
Pin
1
2
3
4
B
E
C
C
Pinning
Symbol Description
base
emitter
collector
collector
E
sym123
Simplified outline
Graphic symbol
C
B
3. Ordering information
Table 4.
Type
number
Ordering information
Package
Name
Description
Version
SOT1215
BC817-25QA DFN1010D-3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals;
BC817-40QA
body: 1.1
1.0
0.37 mm
4. Marking
Table 5.
Marking codes
Marking code
11 01 00
10 11 00
Type number
BC817-25QA
BC817-40QA
Fig 1.
BC817-25QA_40QA
DFN1010D-3 (SOT1215) binary marking code description
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
2 of 15
NXP Semiconductors
BC817-25QA; BC817-40QA
45 V, 500 mA NPN general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
BM
P
tot
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
peak collector current
peak base current
total power dissipation
single pulse; t
p
1 ms
single pulse; t
p
1 ms
T
amb
25
C
[1]
[2]
[3]
[4]
Conditions
open emitter
open base
open collector
Min
-
-
-
-
-
-
-
-
-
-
55
65
Max
50
45
5
500
1
200
300
500
560
900
150
+150
+150
Unit
V
V
V
mA
A
mA
mW
mW
mW
mW
C
C
C
T
j
T
amb
T
stg
[1]
[2]
[3]
[4]
junction temperature
ambient temperature
storage temperature
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm
2
.
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
3 of 15
NXP Semiconductors
BC817-25QA; BC817-40QA
45 V, 500 mA NPN general-purpose transistors
(1) FR4 PCB, 4-layer copper, 1 cm
2
(2) FR4 PCB, single-sided copper, 1 cm
2
(3) FR4 PCB, 4-layer copper, standard footprint
(4) FR4 PCB, single-sided copper, standard footprint
Fig 2.
Power derating curves
6. Thermal characteristics
Table 7.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
[1]
[2]
[3]
[4]
Min
-
-
-
-
Typ
-
-
-
-
Max
417
250
223
139
Unit
K/W
K/W
K/W
K/W
[1]
[2]
[3]
[4]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for collector 1 cm
2
.
Device mounted on an FR4 PCB, 4-layer copper, tin-plated mounting pad for collector 1 cm
2
.
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
4 of 15
NXP Semiconductors
BC817-25QA; BC817-40QA
45 V, 500 mA NPN general-purpose transistors
FR4 PCB, single-sided copper, standard footprint
Fig 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
FR4 PCB, 4-layer copper, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC817-25QA_40QA
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 1 — 3 September 2013
5 of 15
京公网安备 11010802033920号
EEWORLD
