DDLF-A15P-X-101 datasheet, PDF

DDLF-A15P-X-101: DescriptionD Type Connector, 15 Contact(s), Male, 0.109 inch Pitch, Solder Terminal, Hole .112-.124, Receptacle; CategoryThe connector The connector; File Size254KB，4 Pages; ManufacturerSingatron Enterprises Co

Download Datasheet Parametric View All

DDLF-A15P-X-101 Overview

D Type Connector, 15 Contact(s), Male, 0.109 inch Pitch, Solder Terminal, Hole .112-.124, Receptacle

Parameter Name	Attribute value
Maker	Singatron Enterprises Co
Reach Compliance Code	compli
ECCN code	EAR99
Other features	FERRITE FILTER
body width	0.494 inch
subject depth	0.432 inch
body length	1.541 inch
Body/casing type	RECEPTACLE
Contact to complete cooperation	AU ON NI
Contact completed and terminated	GOLD
Contact point gender	MALE
Contact material	BRASS
contact mode	STAGGERED
Contact resistance	8 mΩ
Contact style	RND PIN-SKT
Dielectric withstand voltage	1000VAC V
Filter function	YES
maximum insertion force	2.502 N
Insulation resistance	5000000000 Ω
Insulator color	BLACK
insulator material	GLASS FILLED POLYBUTYLENE TEREPHTHALATE
Manufacturer's serial number	DDLF
Plug contact pitch	0.109 inch
Match contact row spacing	0.112 inch
Installation option 1	HOLE .112-.124
Installation option 2	NON-THREADED
Installation method	STRAIGHT
Installation type	BOARD
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
PCB contact pattern	STAGGERED
PCB contact row spacing	2.8448 mm
Plating thickness	FLASH inch
Rated current (signal)	5 A
Guideline	UL
reliability	COMMERCIAL
Shell surface	NICKEL
Shell material	STEEL
Terminal length	0.165 inch
Terminal pitch	2.794 mm
Termination type	SOLDER
Total number of contacts	15
Evacuation force-minimum value	1.112 N
Base Number Matches	1

[Silicon Labs BG22-EK4108A Bluetooth Development Evaluation] + Development Board Firmware Upgrade: [i=s]This post was last edited by Beifang on 2022-1-13 12:20[/i]Development board firmware upgrade 1. Since there are multiple firmware upgrade prompts, I decided to upgrade it. Enter the launch page ...; 北方 Development Kits Review Area

American Nondestructive Testing Handbook Ultrasonic Volume (Volume 2): ...; wzt Test/Measurement

Assembly Language (4th Edition): Assembly language is a collection of mnemonics of machine instructions provided by various CPUs. People can use assembly language to directly control the hardware system to work. Assembly language is ...; arui1999 Download Centre

The mobile device everyone uses: I would like to ask what kind of handheld device do you all use for development? Can you introduce it? Using the win Ce system, there is a contact IC card reader and writer. Does anyone have any recom...; filmwind Embedded System

MSP 430: [b][size=24px]Msp430 AD and DA can work separately, but they are useless when put together. Please help me and give me a specific solution. The procedure is as follows: [/size][/b][size=24px][img]http...; Mr.ma Microcontroller MCU

Analysis of Output Characteristics of Variable Frequency Power Supply: [i=s] This post was last edited by paulhyde on 2014-9-15 09:19 [/i] Output characteristics of variable frequency power supply Analysis of the output characteristics of high-power variable frequency po...; dtcxn Electronics Design Contest

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components