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BD5424EFS_10

Description
20 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO44
Categorysemiconductor    Other integrated circuit (IC)   
File Size670KB,20 Pages
ManufacturerROHM Semiconductor
Websitehttps://www.rohm.com/
Download Datasheet Parametric View All

BD5424EFS_10 Overview

20 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO44

BD5424EFS_10 Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals44
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage18 V
Minimum supply/operating voltage10 V
Rated bandwidth20 kHz
Rated output power20 dBm
Processing package description18.50 × 7.50 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, HTSSOP-A44
Lead-freeYes
EU RoHS regulationsYes
stateACTIVE
CraftsmanshipBCDMOS
packaging shapeRectangle
Package SizeSMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
surface mountYes
Terminal formGULL WING
Terminal spacing0.8000 mm
terminal coatingNOT SPECIFIED
Terminal locationpair
Packaging MaterialsPlastic/Epoxy
Temperature levelINDUSTRIAL
Consumer IC Typeaudio amplifier
Number of channels2
Middle Power Class-D Speaker Amplifiers
Analog Input / BTL Output
Class-D Speaker Amplifier
BD5424EFS
No.10075EBT04
●Description
BD5424EFS is a 20W + 20W stereo class-D power amplifier IC, developed for space-saving and low heat-generation
applications such as low-profile TV sets. The IC employs state-of-the-art Bipolar, CMOS, and DMOS (BCD) process technology
that eliminates turn-on resistance in the output power stage and internal loss due to line resistances up to an ultimate level.
With this technology, the IC has achieved high efficiency of 91% (10W + 10W output with 8Ω load), which is the top class in
the industry. The IC, in addition, employs a compact back-surface heat radiation type power package to achieve low power
consumption and low heat generation and eliminates necessity of installing an external radiator, up to a total output of 40W.
This product satisfies both needs for drastic downsizing, low-profile structures and powerful, high-quality playback of the
sound system.
●Features
1) A high efficiency of 91% (10W + 10W output with 8Ω load), which is the highest grade in the industry and low heat-generation.
2) An output of 20W + 20W (17V, with 8Ω load) is allowed without an external heat radiator.
3) Driving a lowest rating load of 3.6Ω is allowed.
4) Pop noise upon turning power on/off and power interruption has been reduced.
5) High-quality audio muting is implemented by soft-switching technology.
6) An output power limiter function limits excessive output to speakers.
7) High-reliability design provided with built-in protection circuits against high temperatures, against VCC shorting and
GND shorting, against reduced-voltage, and against applying DC voltage to speaker.
8) A master/slave function allowing synchronization of multiple devices reduces beat noises.
9) Adjustment of internal PWM sampling clock frequencies (350kHz to 500kHz) allows easy protective measures
against unwanted radio emission to AM radio band.
10) A compact back-surface heat radiation type power package is employed.
HTSSOP-A44 (5mm × 7.5mm × 1.0mm, pitch 0.8mm)
●Absolute
Maximum Ratings
A circuit must be designed and evaluated not to exceed absolute maximum rating in any cases and even momentarily, to prevent
reduction in functional performances and thermal destruction of a semiconductor product and secure useful life and reliability.
The following values assume Ta =25℃. For latest values, refer to delivery specifications.
Parameter
Supply voltage
Power dissipation
Input voltage for signal pin
Input voltage for control pin
Input voltage for clock pin
Operating temperature range
Storage temperature range
Maximum junction temperature
Symbol
V
CC
P
d
V
IN
V
CONT
V
OSC
T
opr
T
stg
T
jmax
Ratings
+20
2.0
4.5
-0.2 ~ +7.2
-0.2 ~ Vcc+0.2
-0.2 ~ +7.2
-40 ~ +85
-55 ~ +150
+150
Unit
V
W
W
V
V
V
Conditions
Pin 7, 8, 15, 16, 29, 30, 37, 38, 40
(Note 1, 2)
(Note 3)
(Note 4)
Pin 1, 44 (Note 1)
Pin 20, 24 (Note 1)
Pin 23 (Note 1)
(Note 1) A voltage that can be applied with reference to GND (pins 11, 12, 33, 34, and 43)
(Note 2) Pd and Tjmax=150℃ must not be exceeded.
(Note 3) 70mm × 70mm × 1.6mm FR4 One-sided glass epoxy board (Back copper foil 0%) installed.
If used under Ta=25℃ or higher, reduce 16mW for increase of every 1℃. The board is provided with thermal via.
(Note 4) 70mm × 70mm × 1.6mm FR4 Both-sided glass epoxy board (Back copper foil 100%) installed.
If used under Ta=25℃ or higher, reduce 36mW for increase of every 1℃. The board is provided with thermal via.
www.rohm.com
© 2010 ROHM Co., Ltd. All rights reserved.
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