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Structure
Product Name
Silicon Monolithic Integrated Circuit
Power supply for CCD camera / White LED driver / RGB LED driver
of mobile phone
Type
BD6023AGU
A system power supply for the CCD camera module
Built-in white LED driver for the LCD back light and RGB LED driver
Features
o
○Absolute
Maximum Ratings (Ta=25 C)
Parameter
Symbol
Rating
Maximum Applied Voltage 1
VMAX1
20(*1)
Maximum Applied Voltage 2
VMAX2
16(*2)
Maximum Applied Voltage 3
VMAX3
15(*3)
Maximum Applied Voltage 4
VMAX4
-13.5(*4)
Maximum Applied Voltage 5
VMAX5
6(*5)
Power Dissipation
Pd
2500(*6)
Operating Temperature Range
Topr
-30 to 85
Storage Temperature Range
Tstg
-55 to 150
(*1) VPLUS11, VPLUS12, VPLUS2 pin (*2) CAMP pin
(*3) LEDR, LEDG, LEDB, BKLED, FLED1, FLED2 pin
(*4) VNEG11, VNEG12, CAMN pin
(*5) Except *1~ *4 pin
o
o
(*6) Power dissipation deleting is 20mW/ C, when it’s used in over 25 C.
It’s deleting is on the board that is ROHM’s standard.
o
○Recommended
operating conditions (Ta=-30 to 85 C)
Unit
V
V
V
V
V
mW
o
C
o
C
Condition
Rating
Min.
Typ.
Max.
VBAT power supply voltage
VBAT
2.7
3.6
4.5
VIO power supply voltage
VIO
1.62
3.0
3.3
This product isn’t designed to protect itself against radioactive rays.
Parameter
Symbol
Unit
V
V
Condition
REV. C
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○Electrical
Characteristics
o
Unless otherwise specified, Ta=25 C, VBAT=3.6V, VIO=1.8V/3.0V, VCC=2.45V
Parameter
Circuit Current
VBAT Circuit current 1
VBAT Circuit current 2
VBAT Circuit current 3
VBAT Circuit current 5
Symbol
IQ1
IQ2
IQ3
IQ5
Min.
-
-
-
-
Spec
Typ.
0.5
0.1
6.2
11
Max.
3.0
3.0
9.3
16
Unit
µA
µA
µA
µA
Condition
RSTB=0V
RSTB=0V, VIO=0V
REGVCC ON (Energy save mode)
REGVCC ON (Energy save mode)
REG1 ON (Energy save mode)
REG2 ON (Energy save mode)
REGVCC ON (Normal Mode)
SWREG1 ON (Vo=14V, Io=1mA)
VBAT Circuit current 8
IQ8
-
26
39
mA
SWREG3 ON (Vo=-10V, Io=1mA)
(Add 30h=01h, Add 80h=01h)
REGCP ON, REGCN ON
SWREG1
(DC/DC for white LED and power supply for Camera )
FLED1 drive current 3
I
FLED13
27.0
30.0
33.0
FLED2 drive current 3
I
FLED23
27.0
30.0
33.0
BKLED drive current 3
I
BKLED3
27.0
30.0
33.0
SWREG2
(DC/DC for RGB LED )
LEDR Drive current
I
LEDR22
135
150
165
(
Large current)
LEDG Drive current
I
LEDG22
135
150
165
(
Large current)
LEDB Drive current
I
LEDB22
135
150
165
(
Large current)
REGCP
(15V/13V LDO)
Output voltage 1
Output voltage 2
REGCN
VO151
VO152
14.5
12.5
15.0
13.0
15.5
13.5
mA
mA
mA
mA
mA
mA
Add=80h Data=1Eh
Add=80h Data=3Eh
Add=90h Data=1Eh
Add=A0h Data=0Ch
Add=50h Data=1Eh
Add=A0h Data=0Ah
Add=60h Data=1Eh
Add=A0h Data=09h
Add=70h Data=1Eh
V
V
Io=60mA, REGCPVSEL=0,
VPLUS12=16V
Io=60mA, REGCPVSEL=1,
VPLUS12=14V
(-8V/-7.5/-7V LDO)
VO81
VO82
VO83
-8.5
-8.0
-7.5
-8.0
-7.5
-7.0
-7.5
-7.0
-6.5
V
V
V
Io=100mA, VNEG12=-10V
REGCNVSEL1=0, REGCNVSEL2=0
Io=100mA, VNEG12=-10V
REGCNVSEL1=1/0, REGCNVSEL2=1
Io=100mA, VNEG12=-9V
REGCNVSEL1=1, REGCNVSEL2=0
Output voltage 1
Output voltage 2
Output voltage 3
Constant current drive
CURSENS pin control
voltage 3
REG1
(3.0V/3.1V LDO)
Output voltage 1
Output voltage 2
REG2
(1.8V/2.5V LDO)
Output voltage 1
Output voltage 2
I
CUR3
VO11
VO12
VO21
VO22
0.57
2.94
3.04
1.74
2.45
0.60
3.00
3.10
1.80
2.50
0.63
3.06
3.16
1.86
2.55
V
V
V
V
V
Add=E0h, Data=FFh
Io=150mA, REG1VSEL=0, REG1MD=1
Io=150mA, REG1VSEL=1, REG1MD=1
Io=100mA, REG2VSEL=L, REG2MD=1
Io=100mA, REG2VSEL=H, REG2MD=1
REV. C
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○External
dimensions
Type
○Terminals
PIN
A1
A2
T1
GND2
VBAT1
LEDR
GND3
LEDB
CAMN
GND5
CAMP
T2
VPLUS2
GND1
VBAT2
TRSW2
LEDG
GND4
VNEG12
GND6
GND7
VPLUS12
SENSN2
SENSP2
PIN Name
PIN
C9
C10
D1
D2
D9
D10
E1
E2
E9
E10
F1
F2
F9
F10
G1
G2
G9
G10
H1
H2
H9
H10
PIN Name
TESTO
REG2O
REG1CNT
REG2CNT
VBAT3
VBAT4
CUR
CURSENS
IREF
REG1O
LEDCTL
REGVCCCNT
SENSP3
VREF
RSTB
CLK
VBAT5
VBAT6
DATA
STRB
VNEG11
TRSW3
PIN
J1
J2
J3
J4
J5
J6
J7
J8
J9
J10
K1
K2
K3
K4
K5
K6
K7
K8
K9
K10
-
-
VIO
TESTI
REG2VSEL
VCC
FLED2
FLED1
TRSW1
SENSP1
SENSN1
GND8
T4
GND11
VBAT8
BKLED
GND10
VBAT7
GND9
VPLUS11
SENSN3
T3
-
-
PIN Name
BD6023GU
A
A3
A4
A5
A6
LOT No.
A7
A8
A9
A10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
C1
C2
VCSP85H5 (64PIN)
○Block
diagram
(Unit : mm)
VBAT1½8
SWREG1
PWM
Comp
+ -
+
-
Current
Limiter
Over Voltage
DET
-
+
- +
ERR
Amp
ERR
Amp
- +
OSC
OSC
+ -
Current
Limiter
Over Voltage
DET
-
+
Driver
SWREG2
PWM
Comp
TRSW1
Driver
TRSW2
SENSP2
SENSN2
VPLUS2
SENSP1
+
-
SENSN1
VPLUS11
VPLUS12
SEL
LEDB
LEDG
LEDR
SEL
BKLED
FLED1
TESTO
VREF
IREF
Reference
Voltage
Reference
Current
LDO
2.45V
VREF
FLED2
IREF
SWREG3
Current
Limiter
SENSP3
-
+
VCC
SENSN3
Power
Supply
Driver
-
+
REGVCCCNT
VIO
REG1CNT
REG2CNT
REG2VSEL
Level
TRSW3
Over Voltage
DET
PWM
Comp
-
+
OSC
ERR
Amp
-
+
VNEG11
VNEG12
REGCP
VPLUS12
CPU I/F
VNEG12
Control
CPU I/F
LDO
15V/13V
CLK
DATA
STRB
RSTB
LEDCTL
TESTI
T1
T2
T3
T4
Shift
CAMP
REGCN
LDO
-8V/-7.5V/-7V
CAMN
Logic
CPU I/F
REG1
LDO
3.0V/3.1V
REG1O
REG2
CPU I/F
LDO
1.8V/2.5V
REG2O
+
-
8BIT
DAC
CUR
CURSENS
GND1½11
REV. C
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○Cautions
on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc.,
can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If
any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical
safety measures including the use of fuses, etc.
(2) Power supply and GND line
Design PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. Pay
attention to the interference by common impedance of layout pattern when there are plural power supplies and
GND lines. Especially, when there are GND pattern for small signal and GND pattern for large current included the
external circuits, please separate each GND pattern. Furthermore, for all power supply terminals to ICs, mount a
capacitor between the power supply and the GND terminal. At the same time, in order to use a capacitor, thoroughly
check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity
dropout at a low temperature, thus determining the constant.
(3) GND voltage
Make setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.
Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electric
transient.
(4) Short circuit between terminals and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting
can break down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or
between the terminal and the power supply or the GND terminal, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input terminals
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the
parasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of
the input terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input
terminals a voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not
apply a voltage to the input terminals when no power supply voltage is applied to the IC. In addition, even if the power
supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the
guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a
degradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or
higher, the thermal shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is
aimed at isolating the LSI from thermal runaway as much as possible, is not aimed at the protection or guarantee
of the LSI. Therefore, do not continuously use the LSI with this circuit operating or use the LSI assuming its
operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation
(Pd) in actual states of use.
(10) LDO
Use each output of LDO by the independence. Don’t use under the condition that each output is short-circuited
because it has the possibility that a operation becomes unstable.
(11) DC/DC converter
Please select the low DCR inductors to decrease power loss for DC/DC converter.
(12) Other cautions on use
Please consult supplementary documents such as technical notebook, function manual and application design guide
of this LSI.
REV. C
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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The Products specified in this document are intended to be used with general-use electronic
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