EEWORLDEEWORLDEEWORLD

Part Number

Search

S1010CPC3164F20

Description
Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size118KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Related ProductsFound9parts with similar functions to S1010CPC3164F20
Download Datasheet Parametric View All

S1010CPC3164F20 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT

S1010CPC3164F20 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerState of the Art Inc.
package instructionSMT, 1010
Reach Compliance Codecompli
ECCN codeEAR99
structureChi
JESD-609 codee4
Manufacturer's serial number1010
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Package height0.46 mm
Package length2.57 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.41 mm
method of packingBULK
Rated power dissipation(P)0.5 W
Rated temperature70 °C
resistance3160000 Ω
Resistor typeFIXED RESISTOR
series1010(STD)-THICKFILM
size code1010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceSilver (Ag)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage75 V
Base Number Matches1
1010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
39.2°C/W
500 mW
75 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 1010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.131
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.101 (.099 - .109)
.095 (.095 - .101)
.018 (.015 - .023)
.015 (.010 - .020)
.015 (.010 - .020)
.071 (.067 - .075)
.0105 grams
2.57
2.41
0.46
0.38
0.38
1.80
(2.52 - 2.77)
(2.41 - 2.57)
(0.38 - 0.58)
(0.25 - 0.51)
(0.25 - 0.51)
(1.70 - 1.91)
.101
.065
.033
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08

S1010CPC3164F20 Similar Products

Part Number Manufacturer Description
S1010CPG3164F20 State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPG3164F20-TR State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPX3164F20 State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP
S1010CPZ3164F20 State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPX3164F20-TR State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP
S1010CPC3164F20-TR State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPZ3164F20-TR State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPY3164F20-TR State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
S1010CPY3164F20 State of the Art Inc Fixed Resistor, Metal Glaze/thick Film, 0.5W, 3160000ohm, 75V, 1% +/-Tol, 200ppm/Cel, Surface Mount, 1010, CHIP, ROHS COMPLIANT
Help with porting ad5941 to stm32f407
May I ask all the seniors Can anyone share the case of using ad5941 with stm32?...
阿宏 ADI Reference Circuit
Design of JPEG Image Compression Based on DSP
I. Introduction The JPEG algorithm is a digital image compression coding algorithm with the characteristics of high compression ratio and low distortion, and has been determined as an international st...
Jacktang DSP and ARM Processors
Telnet problem under vxworks
The target machine has a telnet server component, which is downloaded and run. The host (XP) can log in from DOS. However, if the RLOGIN/telnet password protection component is added, there is no resp...
less_than Real-time operating system RTOS
Where does the program run during 2407 hardware emulation?
I am a novice. I used to use an ad, which did not require hardware simulation. The program was directly downloaded to the program RAM through the serial port for debugging and running. Now when 2407 i...
ZUNZHONG Microcontroller MCU
How to partition Nand Flash when the system does not have BinFS
I didn't use BinFS, but after I loaded the Flash driver, I found that there was a drive letter under My Device, which was consistent with the folder value set in my registry, and the size was about 24...
abncat Embedded System
Explanation of the parameters and terms of the power module
[align=left][color=rgb(85, 85, 85)][font=微软雅黑][size=12px]In the power module technical manual provided by the manufacturer, there are generally a lot of parameter data. The main parameter terms are ex...
tgd343310381 Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2515  621  897  2037  830  51  13  19  42  17 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号