Features
■
■
■
HIGH PERFORMANCE TERMINATION
NETWORK
Miniaturized circuitry and packaging
for space reduction
Designed for gigabit communication
networks
■
Controlled impedance
CAT16-PT4F4 - Concave Chip Array
Electrical Characteristics
Resistance
R1 .............................................100 ohms
TCR ........................................±200 ppm/˚C
Temperature Range .........-55 ˚C to +12 5˚C
Max. Operating Voltage ....................5 VDC
Max. Power Resistance ................ .0625 W
Solderability .....................>95 % Coverage
Product Dimensions
16
15
14
13
12
11
10
9
.30
±
.10 DIA.
(.012
±
.004)
.60
±
.10
(.024
±
.004)
1.60
±
.15
(.063
±
.060)
.45
±
.10
(.018
±
.004)
.40
±
.10
(.016
±
.004)
.40
±
.10
(.016
±
.004)
.80
±
.10
(.031
±
.004)
6.40
±
.15
(.253
±
.006)
1
DIMENSIONS ARE:
MM
(INCHES)
2
3
4
5
6
7
8
Packaging Specifications
4000 pcs - per 7 " reel
4.0
±
.10
(.157
±
.004)
0.9
±
0.1
(.035
±
.004)
2.00
±
0.20
(.079
±
.008)
2.0
±
.05
(.079
±
.002)
13
±
0.5
DIA.
(.512
±
.020)
60.0
±
1.0
DIA.
(2.36
±
.039)
12.0
±
0.2
(.472
±
.008)
21
±
0.5
(.827
±
.020)
15.4
±
1.0
(.606
±
.039)
13.0
±
0.3
(.512
±
.012)
178.0
±
2.0
(7.008
±
.080)
6.9
±
0.2
(.272
±
.008)
5.5
±
0.1
(.217
±
.004)
4.0
±.10
(.158
±.004)
1.5 +.10/-0
(.060 +.004/-0)
1.75
±
.10
(.069
±
.004)
Derating Curve
Rated power in percentage (%)
Land Pattern
Solder resist
100
80
60
40
20
0
-55
0
70
(°C) Ambient temperature
125
0.7 to 0.9
(.028 to .035)
Land
Chip resistor array CAT
2.0 to 2.2
(.079 to .087)
Schematic
0.4 to 0.45
(.016 to .0178)
0.80
(.032)
16
15
14
13
12
11
10
9
R1
R1
R1
R1
1
2
3
4
5
6
7
8
REV. 07/03
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
京公网安备 11010802033920号
EEWORLD
