Memory Module Specifications
KHX16C9T3K2/16X
16GB (8GB 1G x 64-Bit x 2 pcs.)
DDR3-1600 CL9 240-Pin DIMM Kit
SPECIFICATIONS
CL(IDD)
Row Cycle Time (tRCmin)
Refresh to Active/Refresh
Command Time (tRFCmin)
Row Active Time (tRASmin)
Maximum Operating Power
UL Rating
Operating Temperature
Storage Temperature
9 cycles
49.5ns (min.)
260ns (min.)
36ns (min.)
2.460 W* (per module)
94 V - 0
0
o
C to 85
o
C
-55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
DESCRIPTION
Kingston's KHX16C9T3K2/16X is a kit of two 1G x 64-bit (8GB)
DDR3-1600 CL9 SDRAM (Synchronous DRAM) 2Rx8 memory
modules, based on sixteen 512M x 8-bit DDR3 FBGA compo-
nents per module. Each module kit supports
Intel
®
XMP
(Extreme Memory Profiles). Total kit capacity is 16GB. Each
module kit has been tested to run at DDR3-1600 at a low
latency timing of 9-9-9 at 1.5V. The SPDs are programmed to
JEDEC standard latency DDR3-1333 timing of 9-9-9 at 1.5V.
Each 240-pin DIMM uses gold contact fingers and requires
+1.5V. The JEDEC standard electrical and mechanical specifi-
cations are as follows:
FEATURES
•
•
•
•
•
•
•
•
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•
JEDEC standard 1.5V (1.425V ~ 1.575V) Power Supply
VDDQ = 1.5V (1.425V ~ 1.575V)
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 9, 8, 7, 6
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.827” (46.41mm) w/ heatsink, double sided
component
Continued >>
XMP TIMING PARAMETERS
•
•
JEDEC: DDR3-1333 CL9-9-9 @1.5V
XMP Profile #1: D3-1600 CL9-9-9 @1.5V
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Document No. 4806584-001.B00
03/06/13
Page 1
continued
HyperX
MODULE DIMENSIONS
T E C H N O L O G Y
30.00
Units: millimeters
133.35
18.80
15.80
11.00
8.00
0.00
0.00
54.70
MODULE WITH HEAT SPREADER
FOR MORE INFORMATION, GO TO WWW.KINGSTON.COM
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at
the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers
faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components.
Document No. 4806584-001.B00
Page 2
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