HCPL-4200
Optically Coupled 20 mA Current Loop Receiver
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS
6 fully
compliant options available;
-xxxE
denotes a
lead-free
product
Description
The HCPL-4200 optocoupler is designed to operate as a
receiver in equipment using the 20 mA Current Loop. 20
mA current loop systems conventionally signal a logic
high state by transmitting 20 mA of loop current (MARK),
and signal a logic low state by allowing no more than a
few milliamperes of loop current (SPACE). Optical cou-
pling of the signal from the 20 mA current loop to the
logic output breaks ground loops and provides for a very
high common mode rejection. The HCPL-4200 aids in the
design process by providing guaranteed thresholds for
logic high state and logic low state for the current loop,
providing an LSTTL, TTL, or CMOS compatible logic in-
terface, and providing guaranteed common mode re-
jection. The buffer circuit on the current loop side of the
HCPL-4200 provides typically 0.8 mA of hysteresis which
increases the immunity to common mode and differen-
tial mode noise. The buffer also provides a controlled
amount of LED drive current which takes into account
any LED light output degradation. The internal shield al-
lows a guaranteed 1000 V/μs common mode transient
immunity.
Features
x
Data output compatible with LSTTL, TTL and CMOS
x
20 K Baud data rate at 1400 metres line length
x
Guaranteed On and Off thresholds
x
LED is protected from excess current
x
Input threshold hysteresis
x
Three-state output compatible with data buses
x
Internal shield for high Common Mode Rejection
x
Safety approval
UL recognized -3750 V rms, for 1 minute
CSA approved
x
Optically coupled 20 mA current loop transmitter,
HCPL-4100, also available
Applications
x
Isolated 20 mA current
x
Loop receiver in:
Computer peripherals
Industrial control equipment
Data communications equipment
Functional Diagram
A 0.1 μF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
HCPL-4200 is UL Recognized with 3750 Vrms for 1 minute per UL1577.
Option
Part number
HCPL-4200
RoHS
Compliant
-000E
-300E
-500E
Non-RoHS
Compliant
No option
#300
#500
Package
300 mil
DIP-8
Surface Mount Gull Wing
X
X
X
X
Tape & Reel Quantity
50 per tube
50 per tube
X
1000 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
HCPL-4200-500E to order product of Gull Wing Surface Mount package in Tape and Reel packaging in RoHS compli-
ant.
Example 2:
HCPL-4200 to order product of 300 mil DIP package in tube packaging and non-RoHS compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Remarks: The notation ‘#XXX’ is used for existing products, while (new) products launched since 15th July 2001 and
RoHS compliant option will use ‘-XXXE’.
2
Package Outline Drawings –
8 Pin DIP Package (HCPL-4200)
9.65 ± 0.25
(0.380 ± 0.010)
8
7
A XXXX
YYWW RU
1
1.19 (0.047) MAX.
2
3
4
UL
RECOGNITION
6
5
7.62 ± 0.25
(0.300 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
DATE CODE
1.78 (0.070) MAX.
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
5° TYP.
3.56 ± 0.13
(0.140 ± 0.005)
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
1.080 ± 0.320
(0.043 ± 0.013)
0.65 (0.025) MAX.
2.54 ± 0.25
(0.100 ± 0.010)
DIMENSIONS IN MILLIMETERS AND (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
8 Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4200)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
(0.380 ± 0.010)
8
7
6
5
1.016 (0.040)
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
1
2
3
4
1.27 (0.050)
2.0 (0.080)
1.19
(0.047)
MAX.
1.780
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
0.254 - 0.051
+ 0.003)
(0.010 - 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
1.080 ± 0.320
(0.043 ± 0.013)
2.54
(0.100)
BSC
0.635 ± 0.130
(0.025 ± 0.005)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
3
Solder Reflow Thermal Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
3°C + 1°C/–0.5°C
30
SEC.
30
SEC.
SOLDERING
TIME
200°C
TEMPERATURE (°C)
200
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
Note: Non-halide flux should be used.
Figure 1a. Solder Reflow Thermal Profile.
Recommended Pb-Free IR Profile
t
p
T
p
T
L
TEMPERATURE
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
260 +0/-5 °C
217 °C
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
T
smax
T
smin
t
s
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
t
L
60 to 150 SEC.
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
smax
= 200 °C, T
smin
= 150 °C
Note: Non-halide flux should be used.
Figure 1b. Pb-Free IR Profile.
Regulatory Information
The HCPL-4200 has been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
4
Insulation and Safety Related Specifications
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking Path
(External Creepage)
Min. Internal Plastic Gap
(Internal Clearance)
Symbol
L(IO1)
L(IO2)
Value
7.1
7.4
0.08
Units
mm
mm
mm
Conditions
Measured from input terminals to output
terminals, shortest distance through air
Measured from input terminals to output
terminals, shortest distance path along body
Through insulation distance, conductor to
conductor, usually the direct distance
between the photoemitter and photodetector
inside the optocoupler cavity
DIN IEC 112/VDE 0303 PART 1
Material Group (DIN VDE 0110, 1/89, Table 1)
Tracking Resistance
(Comparative Tracking Index)
Isolation Group
CTI
200
IIIa
volts
Option 300 – surface mount classification is Class A in accordance with CECC 00802.
Absolute Maximum Ratings
(No Derating Required up to 70°C)
Storage Temperature .............................................................................................-55°C to +125°C
Operating Temperature ..........................................................................................-40°C to +85°C
Lead Solder Temperature .............................. 260°C for 10 s (1.6 mm below seating plane)
Supply Voltage – V
CC
..........................................................................................................0 V to 20 V
Average Input Current - I
I
...................................................................................-30 mA to 30 mA
Peak Transient Input Current - I
I
........................................................................................... 0.5 A
[1]
Enable Input Voltage – V
E
...........................................................................................-0.5 V to 20 V
Output Voltage – V
O
.......................................................................................................-0.5 V to 20 V
Average Output Current – I
O
...................................................................................................25 mA
Input Power Dissipation – P
I
..............................................................................................90 mW
[2]
Output Power Dissipation – P
O
......................................................................................210 mW
[3]
Total Power Dissipation – P .............................................................................................255 mW
[4]
Infrared and Vapor Phase Reflow Temperature
(Option #300) ..................................................................................... see Fig. 1, Thermal Profile
Recommended Operating Conditions
Parameter
Power Supply Voltage
Forward Input Current
(SPACE)
Forward Input Current
(MARK)
Operating Temperature
Fan Out
Logic Low Enable
Voltage
Logic High Enable
Voltage
Symbol
V
CC
I
SI
I
MI
T
A
N
V
EL
V
EH
Min.
4.5
0
14
0
0
0
2.0
Max.
20
2.0
24
70
4
0.8
20
Units
Volts
mA
mA
°C
TTL Loads
Volts
Volts
5
Embedded System
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