Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature (200°C), C0G Dielectric, 10 – 200 VDC (Industrial Grade)
Packaging C-Spec Ordering Options Table
Termination Finish Options
Packaging Type/Options
Standard Packaging – Unmarked
3
Bulk Bag
Waffle Tray
2
7" Tape & Reel
C = 100% Matte Sn
L = SnPb (5% Pb min.)
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin minimum
13" Reel
7” Tape & Reel/2 mm pitch
4
7" Tape & Reel – 50 pieces
7" Tape & Reel – 100 pieces
7" Tape & Reel – 250 pieces
7" Tape & Reel – 500 pieces
7" Tape & Reel – 1,000 pieces
Blank
1
7292
TU
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7081
T050
T100
T250
T500
T1K0
7282
7130
Packaging
Ordering Code (C-Spec)
Moisture Sensitive Packaging
5
– Unmarked
3
Waffle Tray
2
7" Tape & Reel
7" Tape & Reel – 50 pieces
7" Tape & Reel – 100 pieces
7" Tape & Reel – 250 pieces
7" Tape & Reel – 500 pieces
7" Tape & Reel – 1,000 pieces
E = Gold (Au) 1.97 – 11.8 µin
F = Gold (Au) 30 – 50 µin
G = Gold (Au) 100 µin minimum
Contact KEMET
6
Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.
“Bulk Bag” packaging option is not available for Gold (Au) termination finish options and case sizes larger than 2225 (5664 Metric).
2
“Waffle Tray” packaging option is not available for case sizes larger than 2225 (5664 Metric).
3
The terms “Marked” and “Unmarked” pertain to laser marking option of components. All packaging options labeled as “Unmarked” will contain capacitors that
have not been laser marked. The option to laser mark is not available on these devices.
3
Reeling quantities are dependent upon chip size and thickness dimension. When ordering using the “T1K0” packaging option, 1812 thru 2225 case size devices
with chip thickness of ≥ 1.9 mm (nominal) may be shipped on multiple 7” reels or a single 13” reel. Additional reeling or packaging options may be available.
Contact KEMET for details.
4
The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case size
devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
5
Moisture sensitive packaging is required for Gold (Au) termination option “E” (1.97 – 11.8 µin)
6
Additional reeling or packaging options may be available. Contact KEMET for details.
1
1
Benefits
•
•
•
•
•
•
•
•
•
•
−55°C to +200°C operating temperature range
Lead (Pb)-Free, RoHS and REACH compliant
EIA 0402, 0603, 0805, 1206, 1210, 1812, and 2220 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, 50 V, 100 V, and 200 V
Capacitance offerings ranging from 0.5 pF up to 470 nF
Available capacitance tolerances of ±0.10 pF, ±0.25 pF,
±0.5 pF, ±1%, ±2%, ±5%, ±10% or ±20%
No piezoelectric noise
Extremely low ESR and ESL
High thermal stability
High ripple current capability
• Preferred capacitance solution at line frequencies and into the
MHz range
• No capacitance change with respect to applied rated DC voltage
• Negligible capacitance change with respect to temperature from
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
0.1%
1,000 megohm microfarads or 100 GΩ
(Rated voltage applied for 120 ±5 seconds @ 25°C)
Dielectric Withstanding Voltage (DWV)
Dissipation Factor (DF) Maximum Limit @ 25ºC
Insulation Resistance (IR) Minimum Limit @ 25°C
DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic
Level Control (ALC). The ALC feature should be switched to “ON.”
1
2
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
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Embedded System
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