856979
806/847 MHz Duplexer
Applications
For Band 20 LTE applications
LTE Band 20 handsets, data cards, mobile routers
Product Features
Usable bandwidth 30 MHz (each band)
Low loss
High attenuation
High Tx-Rx isolation
Single-ended-Balanced Rx operation
Ceramic chip-scale Package (CSP)
Small Size 2.5 x 2.00 x 0.56 mm
Hermetic
RoHS
compliant,
Pb-free
Functional Block Diagram
Top View
Gnd
7
Ant
6
Gnd
5
4
Rx
Out
Rx
Out
8
1
2
Gnd
3
Gnd
Tx in
General Description
856979 is a high-performance Temperature Compensated
Surface Acoustic Wave (TC SAW) duplexer designed to
meet the strict LTE requirements for use in Band 20.
The 856979 is specifically designed to meet the high
performance expectations of insertion loss, isolation and
linearity in LTE systems operating in Band 20 applications
under all operating conditions. The use of TC SAW
technology enables stable performance over the entire
temperature range.
Pin Configuration
Pin # SE-Balanced
1,8
3
6
2,4,5,7,9
Description
Rx output
Tx input
Antenna/Phasing inductor
Ground
Ordering Information
Part No.
Description
The 856979 uses common module packaging techniques to 856979
packaged part
achieve the industry standard 2.5 x 2.0 footprint. The 856979-EVB
evaluation board
duplexer exhibits excellent power handling capabilities.
Standard T/R size = 10,000 units/reel.
Data Sheet: Rev D 09/28/2012
© 2012 TriQuint Semiconductor, Inc.
- 1 of 9 -
Disclaimer: Subject to change without notice e
Connecting the Digital World to the Global Network
®
856979
806/847 MHz Duplexer
TX – Electrical Specifications
(1)
Specified Temperature Range:
(2)
-20 to +85 ºC
Parameter
(3)
Center Frequency
Maximum Insertion Loss
(5)
Amplitude Variation
(9)
Conditions
Ant-Tx Specification
832 – 862 MHz
832 – 862 MHz
10 – 771 MHz
771 – 791 MHz
791 – 821 MHz
821 – 825 MHz
925 – 960 MHz
1565.420 – 1573.374 MHz
1573.374 – 1577.466 MHz
1577.466 – 1585.420 MHz
1597.5515 – 1605.886 MHz
1664 - 1724
1805 – 1880 MHz
1884.5 – 1919.6 MHz
2110 – 2170 MHz
2400 – 2500 MHz
2500 – 2586 MHz
2586– 2620
2620– 2690
3328– 4310
4992– 6000
832 – 862 MHz
832 – 862 MHz
Min
-
-
-
30
33
43
3
28
38
40
40
43
35
30
30
30
35
35
35
30
20
15
8
8
50
54
45
50
40
20
20
-
-
Typical
(4)
847
2.5
0.6
35
37
48
15
33
43
45
45
48
47
45
43
40
42
40
40
38
31
22
10
10
53
56
50
55
45
48
45
50
50
Max
-
3.0
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Units
MHz
dB
dB p-p
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
Absolute Attenuation
(6)
Return Loss at Tx
Return Loss at Antenna
Tx-Rx Specification
791 – 821 MHz (Differential)
832.5 – 862 MHz (Differential)
(8)
791 – 821 MHz (Common-mode)
832.5 – 862 MHz (Common-mode)
1574 – 1577 MHz
1664 – 1724 MHz
2496 – 2586 MHz
Isolation
Tx Impedance (single-ended)
(7)
Ant Impedance (single-ended)
(7)
Notes:
1. All specifications are based on the TriQuint schematic for the main reference design shown on page 4
2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over
temperature
3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances
4. Typical values are based on average measurements at room temperature
5. Design goal is to meet 3.0 dB Max. Need SPC data to determine actual performance
6. Relative to zero dB
7. This is the optimum impedance in order to achieve the performance shown
8. Target minimum is based on future design revision goals
9. Over any 5 MHz in-band
Data Sheet: Rev D 09/28/2012
© 2012 TriQuint Semiconductor, Inc.
- 2 of 9 -
Disclaimer: Subject to change without notice e
Connecting the Digital World to the Global Network
®
856979
806/847 MHz Duplexer
RX – Electrical Specifications
(1)
Specified Temperature Range:
(2)
-20 to +85 ºC
Parameter
(3)
Center Frequency
Maximum Insertion Loss
Amplitude Variation
(8)
Conditions
Ant-Rx Specification
791–821 MHz
791–821 MHz
10 – 760 MHz
760 – 770 MHz
832 – 862 MHz
862 – 890 MHz
890 – 910 MHz
910 – 2500 MHz
2500 – 6000 MHz
791–821 MHz
791–821 MHz
791–821 MHz
791–821 MHz
Min
-
-
-
45
25
45
40
35
40
30
7.5
8
-7.0
-2.3
-
-
-
-
Typical
(4)
806
3.0
0.6
50
40
51
44
40
44
35
9
9.5
-
-
-106
-101
50
100
Max
-
3.5
1.5
-
-
-
-
-
-
-
-
-
8.0
0.5
-104
-100
-
-
Units
MHz
dB
dB p-p
dB
dB
dB
dB
dB
dB
dB
dB
dB
degree
dB
dBm
dBm
Absolute Attenuation
(5)
Return Loss at Rx
Return Loss at Antenna
Output phase balance
Output amplitude balance
(8)
IM2 product
(6) (a,b)
IM3 product
(6) (c,d)
ANT Impedance (single-ended )
(7)
Rx Impedance (balanced)
(7)
Notes:
1. All specifications are based on the TriQuint schematic for the main reference design shown on page 4
2. In production, devices will be tested at room temperature to a guardbanded specification to ensure electrical compliance over
temperature
3. Electrical margin has been built into the design to account for the variations due to temperature drift and manufacturing tolerances
4. Typical values are based on average measurements at room temperature
5. Relative to zero dB
6. All power levels are referenced to the antenna port. Two CW tones are applied at frequencies f1 and f2, and the resultant
intermodulation product in the Rx band is measured. The first tone is applied to the Tx port, in the range f1 = 832 to 862 MHz, at
+21.5 dBm (referenced to the antenna port). The second tone is -15 dBm, applied to the antenna port at f2, with the following four
cases:
a. f2 = 41 MHz
b. f2 = 2 * f1 - 41 MHz
c. f2 = f1 + 41 MHz
d. f2 = 3 * f1 - 41 MHz
The intermodulation product is measured at f1 - 41 MHz.
7. This is the optimum impedance in order to achieve the performance shown
8. Over any 5 MHz in-band
Data Sheet: Rev D 09/28/2012
© 2012 TriQuint Semiconductor, Inc.
- 3 of 9 -
Disclaimer: Subject to change without notice e
Connecting the Digital World to the Global Network
®
856979
806/847 MHz Duplexer
Reference Design –Ant- 50 SE In, Tx-50 SE Out , Rx-100Bal Out
Schematic
RX
Balanced
ANT
Single-ended
TX
Single-ended
Notes:
1.
Actual matching values may vary due to PCB layout and parasitic
PC Board
Mounting Configuration
2.40
0.95
0.275
0.45
1.90
0.19x45°
CHAMFER
0.525
0.275
0.45
Notes:
Top, middle & bottom layers: 1 oz copper
Substrates: FR4 dielectric, .031” thick
Finish plating: Nickel: 3-8µm thick, Gold: .03-.2µm thick
Hole plating: Copper min .0008µm thick
Notes:
1.
All dimensions are in millimeters.
2.
This footprint represents a recommendation only.
Bill of Material
Reference
Design
L1_ANT
L2 and L2 at Rx
SMA
PCB
Value
9.1 nH
4.3 nH
N/A
N/A
Description
er
Chip inductor, Wire wound, 0402, ±2%
Chip inductor, Wire-wound, 0402, ±3%
SMA connector
3-layer
Manufactur Part Number
MuRata
MuRata
Radiall USA
Inc.
Multiple
LQW15AN9N1G00
LQW15AN4N3C00
9602-1111-018
N/A
Data Sheet: Rev D 09/28/2012
© 2012 TriQuint Semiconductor, Inc.
- 4 of 9 -
Disclaimer: Subject to change without notice e
Connecting the Digital World to the Global Network
®
856979
806/847 MHz Duplexer
Tx - Typical Performance
(at room temperature)
Data Sheet: Rev D 09/28/2012
© 2012 TriQuint Semiconductor, Inc.
- 5 of 9 -
Disclaimer: Subject to change without notice e
Connecting the Digital World to the Global Network
®
京公网安备 11010802033920号
EEWORLD
