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TQM829007-PCB

Description
TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC28
CategoryTopical application    Wireless rf/communication   
File Size717KB,12 Pages
ManufacturerTriQuint Semiconductor Inc. (Qorvo)
Websitehttp://www.triquint.com
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TQM829007-PCB Overview

TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC28

TQM829007-PCB Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals28
Minimum operating temperature-40 Cel
Maximum operating temperature85 Cel
Processing package description6 X 6 MM, ROHS COMPLIANT, PLASTIC, MO-220VJJC, QFN-28
stateActive
Communication typeRF AND BASEBAND CIRCUIT
jesd_30_codeS-PQCC-N28
jesd_609_codee4
Packaging MaterialsPLASTIC/EPOXY
ckage_codeHQCCN
packaging shapeSQUARE
Package SizeCHIP CARRIER, HEAT SINK/SLUG
seated_height_max1.12 mm
Rated supply voltage5 V
surface mountYES
Temperature levelINDUSTRIAL
terminal coatingGOLD OVER NICKEL
Terminal formNO LEAD
Terminal spacing0.7000 mm
Terminal locationQUAD
length6 mm
width6 mm
TQM829007
Applications
0.6-1.0GHz ¼W Digital Variable Gain Amplifier
3G / 4G Wireless Infrastructure
CDMA, WCDMA, LTE
Repeaters
ISM Infrastructure
28-pin 6x6mm leadless SMT package
Product Features
0.6-1.0 GHz Frequency Range
31.5 dB Maximum Gain at 0.9 GHz
31.5 dB Gain Range in 0.5 dB Steps
+40 dBm Output IP3
+24.3 dBm Output P1dB
2.1 dB Noise Figure at Max. Gain State
Fully Internally Matched Module
Integrated Blocking Capacitors, Bias Inductors
3-wire SPI Control Programming
Functional Block Diagram
28
27
26
25
24
23
LE 1
DATA 2
CLK 3
NC 4
GND 5
RFIN 6
GND 7
Vcc_AMP1/ 8
GND 9
AMP1
DC Biasing
DC Biasing
S
P
I
DSA
Matching
AMP2
22
21 GND
20 GND
19 GND
18 GND
17 GND
16 RFOUT
15 GND
GND 10
GND 11
GND 12
GND 13
Vcc_AMP2 14
Backside
Paddle - GND
General Description
The TQM829007 is a digital variable gain amplifier
(DVGA) featuring high linearity performance in a fully
integrated module. The amplifier module features the
integration of a low noise amplifier gain block, a digital-
step attenuator (DSA), along with a high linearity ¼W
amplifier. The module has the added features of integrating
all matching components with bias chokes and blocking
capacitors. The internal DSA offers 0.5 dB step, 6-bit, and
31.5 dB range and is controlled with a serial periphery
interface (SPI
TM
).
The TQM829007 features variable gain from 0 to 31.5 dB
at 0.9 GHz, has +40 dBm Output IP3, and +24.3 dBm
P1dB. The amplifier also has a very low 2.1 dB Noise
Figure (at maximum gain) allowing it to be an ideal DVGA
for both receiver and transmitter applications.
The
amplifier operates from a single +5V supply and is
available in a compact 28-pin 6x6 mm leadless SMT
package.
The TQM829007 is pin compatible with the TQM879006
(1.4-2.7GHz, 0.25W DVGA) and TQM879008 (1.5-2.7
GHz, 0.5W DVGA). This allows one to size the right type
of device for specific system level requirements as well as
making the DVGA family ideal for applications where a
common PCB layout is used for different frequency bands.
Data Sheet: Rev F 04/27/12
© 2012 TriQuint Semiconductor, Inc.
Pin Configuration
Pin #
Symbol
1
2
3
4, 22
6
8
14
16
28
All Other Pins
LE
DATA
CLK
NC
RFIN
VCC_AMP1
VCC_AMP2
RFOUT
VCC_SPI
GND
Ordering Information
Part No.
TQM829007
0.6-1.0 GHz Digital Variable Gain Amp
Fully Assembled Evaluation Board
TQM829007-PCB
Includes USB control board (EVH)
Standard T/R size = 2500 pieces on a 13” reel.
Description
-
1 of 12-
Disclaimer: Subject to change without notice
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TQM829007-PCB Related Products

TQM829007-PCB TQM829007
Description TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC28 TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PQCC28
Number of functions 1 1
Number of terminals 28 28
Minimum operating temperature -40 Cel -40 Cel
Maximum operating temperature 85 Cel 85 Cel
Processing package description 6 X 6 MM, ROHS COMPLIANT, PLASTIC, MO-220VJJC, QFN-28 6 X 6 MM, ROHS COMPLIANT, PLASTIC, MO-220VJJC, QFN-28
state Active Active
Communication type RF AND BASEBAND CIRCUIT RF AND BASEBAND CIRCUIT
jesd_30_code S-PQCC-N28 S-PQCC-N28
jesd_609_code e4 e4
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY
ckage_code HQCCN HQCCN
packaging shape SQUARE SQUARE
Package Size CHIP CARRIER, HEAT SINK/SLUG CHIP CARRIER, HEAT SINK/SLUG
seated_height_max 1.12 mm 1.12 mm
Rated supply voltage 5 V 5 V
surface mount YES YES
Temperature level INDUSTRIAL INDUSTRIAL
terminal coating GOLD OVER NICKEL GOLD OVER NICKEL
Terminal form NO LEAD NO LEAD
Terminal spacing 0.7000 mm 0.7000 mm
Terminal location QUAD QUAD
length 6 mm 6 mm
width 6 mm 6 mm

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