XTL1021
•
•
•
•
High Performance Crystal for Wireless Communications Devices
Excellent Frequency Stability and Reliability
Ultra Miniature Surface Mount Seam Weld Package
Complies with Directive 2002/95/EC (RoHS)
P b
16.00000 MHz
Crystal Unit
The XTL1021 is a very high stability 16.0 MHz crystal suitable for a wide range of communications
applications. The XTL1021’s excellent frequency stability supports operation from -40 to +85 °C.
The XTL1021 is specifically recommended for use with RFM’s TRC104 transceiver IC.
SM5032-4 Case
Electrical Characteristics
Characteristic
Nominal Frequency
Mode of Oscillation
Storage Temperature Range
Operating Temperature Range
Frequency Stability over Operating Temperature Range
Frequency Make Tolerance
Equivalent Series Resistance
Shunt Capacitance
Nominal Drive Level
Load Capacitance
Aging
Standard Shipping Quantity on 330 mm (13”) Reel
Lid Symbolization (in addition to Lot and/or Date Codes)
C
L
12
±2.0 ppm/year @ 25°C
3000
1021 YWWS
units
F
L
ESR
C
O
-50
-40
±10 ppm @ 25°C ±3°C
35
3
100
Ω
pF
µW
pF
Sym
F
O
Notes
Minimum
Typical
16.00000
Fundamental
Maximum
Units
MHz
+85
+85
°C
°C
±20 ppm (referred to the value at 25°C)
C r y s ta l E q u iv a le n t C ir c u it
1
C
O
E S R
3
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling.
Notes:
1.
2.
3.
US and international patents may apply.
The design, manufacturing process, and specifications of this device are subject to change without notice.
RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 1 of 4
XTL1021 - 2/3/10
SM5032-4 Case
4-Terminal Surface-Mount Seam Weld Case
5.0 x 3.2 mm Nominal Footprint
T o p V ie w
5 .0 ± 0 .1
3 .2 ± 0 .1
D o t in d ic a te s P in 3 lo c a tio n
Electrical Connections
Pin
1
2
3
4
Connection
IN/OUT
GND (lid)
IN/OUT
GND (lid)
0 .8
± 0 .1
S id e V ie w
1 .2
± 0 .1
0 .8
± 0 .1
1
1 .4
± 0 .2
B o tto m
V ie w
2
2 .4 ± 0 .2
1.7 ±0.1
1.2 ±0.1
1.2 ±0.1
4
P in s 2 a n d 4 a r e
c o n n e c te d to th e lid
D im e n s io n s a r e in m m
3
2.2 ±0.1
Footprint (mm)
Pin 3
Package Orientation in Carrier Tape
www.RFM.com E-mail: info@rfm.com
©2009-2010 by RF Monolithics, Inc.
Page 2 of 4
XTL1021 - 2/3/10
MCU
京公网安备 11010802033920号
EEWORLD
