Formosa MS
SGFM161C-D2 THRU SGFM168C-D2
Chip Silicon Rectifier
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/02/10
Revised Date
2011/09/28
Revision
E
Page.
7
Page 1
DS-121425
Formosa MS
SGFM161C-D2 THRU SGFM168C-D2
Chip Silicon Rectifier
16.0A Surface Mount Super
Fast Rectifiers-50-600V
Features
•
Batch process design, excellent power dissipation offers
•
•
•
•
•
•
•
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space..
High current capability.
Super fast reovery time for switching mode application.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet enironmental standards of
MIL-STD-19500/228
Suffix "-H" indicates Halogen free parts, ex. SGFM161C-D2-H.
0.046(1.20)
0.032(0.80)
0.402(10.20)
0.386(9.80)
0.185(4.70)
0.169(4.30)
0.055(1.40)
0.047(1.20)
Package outline
D2PAK
0.370(9.40)
0.354(9.00)
0.012(0.30)
0.004(0.10)
0.024(0.60)
0.016(0.40)
0.192(4.8)
0.176(4.4)
Mechanical data
•
Epoxy:UL94-V0 rated flame retardant
•
Case : Molded plastic, TO-263 / D2PAK
•
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
0.205(5.20)
0.189(4.80)
0.063(1.60)
0.055(1.40)
0.108(2.70)
0.092(2.30)
Dimensions in inches and (millimeters)
•
Polarity : Indicated by cathode band
•
Mounting Position : Any
•
Weight : Approximated 1.46 gram
PIN 1
PIN 3
PIN 2
Maximum ratings and Electrical Characteristics
(AT
PARAMETER
Forward rectified current
Forward surge current
CONDITIONS
Ambient temperature = 50 C
O
T
A
=25
o
C unless otherwise noted)
Symbol
I
O
I
FSM
I
R
C
J
T
STG
-65
80
+175
MIN.
TYP.
MAX.
16.0
200
10
50
UNIT
A
A
8.3ms single half sine-wave superimposed on
rate load (JEDEC methode)
V
R
= V
RRM
T
J
= 25
O
C
V
R
= V
RRM
T
J
= 125 C
f=1MHz and applied 4V DC reverse voltage
O
Reverse current
Diode junction capacitance
Storage temperature
*1
V
RRM
(V)
50
100
200
400
600
µA
pF
O
C
SYMBOLS
SGFM161C-D2
SGFM162C-D2
SGFM164C-D2
SGFM166C-D2
SGFM168C-D2
V
RMS
*2
(V)
35
70
140
280
420
*3
V
R
(V)
50
100
200
400
600
*4
V
F
(V)
*5
t
rr
(ns)
Operating
temperature
T
J
, (
O
C)
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
0.975
35
1.30
1.70
-55 to +150
*4 Maximum forward voltage@I
F
=8.0A
*5 Reverse recovery time, note 1
Note 1. Reverse recovery time test condition, I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/02/10
Revised Date
2011/09/28
Revision
E
Page.
7
Page 2
DS-121425
Rating and characteristic curves (SGFM161C-D2 THRU SGFM168C-D2)
AVERAGE FORWARD CURRENT
AMPERES
FIG.1 - FORWARD CURRENT DERATING CURVE
24
20
16
12
8
4
0
25
50
75
100
125
150
PEAK FORWARD SURGE CURRENT (A)
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
240
200
160
120
80
40
0
1
10
100
T
J
=25 C
8.3ms Single Half
Sine Wave
JEDEC method
AMBIENT TEMPERATURE,(°C)
NUMBER OF CYCLES AT 60 HZ
INSTANTANEOUS FORWARD CURRENT,
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUR FORWARD
CHARACTERISTICS
TJ=25
O
C
SGFM161C-D2 ,SGFM162C-D2
SGFM164C-D2
INSTANTANEOUS REVERSE CURRENT,
uAMPERES
FIG. 4 - TYPICAL INSTANTANEOUS REVERSE
CHARACTERISTICS
100
100
T
J
=125°C
10
SGFM166C-D2
10
T
J
=100°C
1.0
1
0.1
SGFM168C-D2
0.1
T
J
=25°C
0.01
0.4
0.6
0.8
1.0
pulse width=300us
1% duty cycle
0.01
1.2
1.4
1.6
1.8
0
20
40
60
80
100
120
140
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE,(pF)
140
120
100
FIG. 6 - TEST CIRCUIT DIAGRAM AND REVERSE
RECOVERY TIME CHARACTERISTIC
50
W
NONINDUCTIVE
10
W
NONINDUCTIVE
trr
+0.5A
|
|
|
|
|
|
|
|
80
60
40
(+)
25Vdc
(approx.)
( )
1
W
NON-
INDUCTIVE
OSCILLISCOPE
(NOTE 1)
D.U.T.
( )
PULSE
GENERATOR
(NOTE 2)
(+)
0
-0.25A
-1.0A
20
0
.01
.05
.1
.5
1
5
10
50
100
NOTES: 1. Rise Time= 7ns max., Input Impedance= 1 megohm.22pF.
2. Rise Time= 10ns max., Source Impedance= 50 ohms.
1cm
SET TIME BASE FOR
50 / 10ns / cm
REVERSE VOLTAGE,(V)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/02/10
Revised Date
2011/09/28
Revision
E
Page.
7
Page 3
DS-121425
Formosa MS
SGFM161C-D2 THRU SGFM168C-D2
Chip Silicon Rectifier
Pinning information
Simplified outline
2
Symbol
2
1
3
1
3
Marking
Type number
SGFM161C-D2
SGFM162C-D2
SGFM164C-D2
SGFM166C-D2
SGFM168C-D2
Marking code
SF161C
SF162C
SF164C
SF166C
SF168C
Suggested solder pad layout
X1
PACKAGE
C
E
Y1
D2PAK
0.374(9.50)
0.098(2.50)
0.665(16.90)
0.425(10.80)
0.071(1.80)
0.449(11.40)
0.138(3.50)
L
X1
L
C
X2
Y1
Y2
X2
E
Y2
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/02/10
Revised Date
2011/09/28
Revision
E
Page.
7
Page 4
DS-121425
Formosa MS
SGFM161C-D2 THRU SGFM168C-D2
Chip Silicon Rectifier
Packing information
P
0
P
1
d
E
F
B
W
A
P
D
2
T
C
D
W
1
D
1
unit:mm
Item
Symbol
Tolerance
D2PAK
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D
1
D
D
1
D
2
E
F
P
P
0
P
1
T
W
W
1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
10.70
16.30
5.10
1.50
330.00
50.00
-
-
13.00
1.75
11.50
16.00
4.00
2.00
0.23
24.00
30.00
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Issued Date
2009/02/10
Revised Date
2011/09/28
Revision
E
Page.
7
Page 5
DS-121425
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