CDIP-24, Tube
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Parts packaging code | CDIP |
| package instruction | DIP, |
| Contacts | 24 |
| Manufacturer packaging code | CF24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 4 ns |
| JESD-30 code | R-CDIP-T24 |
| JESD-609 code | e0 |
| length | 30.861 mm |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 1KX4 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| Maximum seat height | 4.445 mm |
| surface mount | NO |
| technology | BICMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 10.16 mm |
京公网安备 11010802033920号
EEWORLD
