Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
TLE7368-3E
MA001114792
PG-DSO-36-51
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
copper
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-50-8
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
14.773
0.092
0.366
7.322
297.304
1.814
0.798
36.690
361.319
8.119
0.802
0.977
2.931
Average
Mass
[%]
2.01
0.01
0.05
1.00
40.54
0.25
0.11
5.00
49.28
1.11
0.11
0.13
0.40
28. August 2013
733.31 mg
Sum
[%]
2.01
Average
Mass
[ppm]
20146
125
499
9985
41.60
0.25
405429
2474
1088
50034
54.39
1.11
0.11
492726
11072
1093
1332
0.53
3997
5329
1000000
543848
11072
1093
416038
2474
Sum
[ppm]
20146
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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