Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
leadfinish
plating
glue
solder
BSB044N08NN3 G
MA001355338
MG-WDSON-2-5
Material Group
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
plastics
noble metal
non noble metal
noble metal
non noble metal
plastics
< 10%
Substances
silicon
copper
nickel
nickel
silver
epoxy resin
silver
copper
silver
tin
epoxy resin
CAS#
if applicable
7440-21-3
7440-50-8
7440-02-0
7440-02-0
7440-22-4
-
7440-22-4
7440-50-8
7440-22-4
7440-31-5
-
Issued
Weight*
Weight
[mg]
6.356
74.415
0.211
0.211
0.840
0.254
1.561
0.011
0.066
2.119
0.327
Average
Mass
[%]
7.36
86.17
0.24
0.24
0.97
0.29
1.81
0.01
0.08
2.45
0.38
3. September 2015
86.37 mg
Sum
[%]
7.36
86.17
0.24
Average
Mass
[ppm]
73594
861570
2445
2445
1.21
9725
2942
2.10
18071
127
763
2.54
0.38
24528
3790
25418
3790
1000000
21013
12170
Sum
[ppm]
73594
861570
2445
passivation
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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