Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPS050N03L G
MA000812642
PG-TO251-3-311
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
inorganic material
non noble metal
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
phosphorus
nickel
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7723-14-0
7440-02-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
1.415
0.156
0.047
155.372
2.316
0.327
19.709
128.376
3.002
0.004
1.555
0.039
0.031
1.480
0.006
0.021
20.617
Average
Mass
[%]
0.42
0.05
0.01
46.47
0.69
0.10
5.89
38.38
0.90
0.00
0.46
0.01
0.01
0.44
0.00
0.01
6.16
29. August 2013
334.47 mg
Sum
[%]
0.42
Average
Mass
[ppm]
4231
465
140
46.53
0.69
464531
6924
976
58926
44.37
0.90
383819
8974
11
0.46
4648
116
93
0.46
4424
19
62
6.17
61641
61722
1000000
4633
4659
443721
8974
465136
6924
Sum
[ppm]
4231
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com