KAI-2093
1920 (H) x 1080 (V) Interline
CCD Image Sensor
Description
T h e K A I
−2
0 9 3 I m a g e S e n s o r i s a h i g h−p e r f o r m a n c e
multi−megapixel image sensor designed for a wide range of medical
imaging and machine vision applications.
The 7.4
mm
square pixels with microlenses provide high sensitivity
and the large full well capacity results in high dynamic range. The split
horizontal register offers a choice of single or dual output allowing
either 15 or 30 frame per second (fps). The architecture allows for
either progressive scan or interlaced readout. The imager features 5 V
clocking to facilitate camera design. The vertical overflow drain
structure provides antiblooming protection, and enables electronic
shuttering for precise exposure control.
Table 1. GENERAL SPECIFICATIONS
Parameter
Architecture
Total Number of Pixels
Number of Effective Pixels
Number of Active Pixels
Pixel Size
Active Image Size
Aspect Ratio
Number of Outputs
Saturation Signal
Output Sensitivity
Quantum Efficiency
−ABA
(490 nm)
−CBA
(R = 620 nm, G = 540 nm,
B = 460 nm)
Total Noise
Dark Current (Typical)
Dynamic Range
Maximum Pixel Clock Speed
Blooming Suppression
Smear
Image Lag
Frame Rate
Single Output, 20 MHz
Single Output, 35 MHz
Dual Output, 20 MHz
Dual Output, 37 MHz
Maximum Data Rate
Package
Cover Glass
Typical Value
Interline CCD, Progressive Scan or
Interlaced Readout
1984 (H)
×
1092 (V)
1928 (H)
×
1084 (V)
1920 (H)
×
1080 (V)
7.4
mm
(H)
×
7.4
mm
(V)
14.208 mm (H)
×
7.992 mm (V),
16.3 mm (Diagonal)
16:9
1 or 2
40,000 e
−
14
mV/e
−
40%
37%, 34%, 30%
40 e
−
rms
< 0.5 nA/cm
2
60 dB
40 MHz
100 X
< 0.03%
< 10 electrons
9 fps
15 fps
17 fps
30 fps
40 MHz/Channel (2 Channels)
32 pin CerDIP
Clear Glass or Quartz Glass with
AR Coating (2 sides)
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Figure 1. KAI−2093 Interline CCD
Image Sensor
Features
•
Progressive Scan (Non−interlaced)
•
HCCD and Output Amplifier Capable of
•
•
•
•
•
•
40 MHz Operation
5 V HCCD Clocking
Single or Dual Video Output Operation
28 Light Shielded Reference Columns per
Output
Only 2 Vertical CCD Clocks and 2
Horizontal CCD Clocks
Electronic Shutter
Low Dark Current
Applications
•
Intelligent Transportation Systems
•
Machine Vision
•
Surveillance
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
NOTE: Parameters above are specified at T = 40°C unless otherwise noted.
©
Semiconductor Components Industries, LLC, 2014
February, 2017
−
Rev. 2
1
Publication Order Number:
KAI−2093/D
KAI−2093
ORDERING INFORMATION
Table 2. ORDERING INFORMATION
−
KAI−2093 IMAGE SENSOR
Part Number
KAI−2093−AAA−CP−AE
KAI−2093−AAA−CP−BA
KAI−2093−ABA−CB−AE
KAI−2093−ABA−CB−B1
KAI−2093−ABA−CB−B2
KAI−2093−ABA−CK−AE
KAI−2093−ABA−CK−BA
KAI−2093−ABA−CP−AE
KAI−2093−ABA−CP−BA
KAI−2093−CBA−CB−AE
KAI−2093−CBA−CB−BA
Description
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Engineering Sample
Monochrome, No Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Standard Grade
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Grade 1
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Grade 2
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Quartz Cover Glass with AR Coating (Both Sides), Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Quartz Cover Glass with AR Coating (Both Sides), Standard Grade
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Engineering Sample
Monochrome, Telecentric Microlens, CERDIP Package (Sidebrazed),
Taped Clear Cover Glass (No Coatings), Standard Grade
Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Engineering Sample
Color (Bayer RGB), Telecentric Microlens, CERDIP Package (Sidebrazed),
Clear Cover Glass (No Coatings), Standard Grade
KAI−2093CM
Serial Number
KAI−2093M
Serial Number
Marking Code
KAI−2093
Serial Number
Table 3. ORDERING INFORMATION
−
EVALUATION SUPPORT
Part Number
KAI−2093−10−40−A−EVK
KAI−2093−12−20−A−EVK
Description
Evaluation Board, 10 Bit, 40 MHz (Complete Kit)
Evaluation Board, 12 Bit, 20 MHz (Complete Kit)
See the ON Semiconductor
Device Nomenclature
document (TND310/D) for a full description of the naming convention
used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
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2
KAI−2093
DEVICE DESCRIPTION
Architecture
4 light shielded rows
2 buffer rows
28 light shielded columns
28 light shielded columns
4 buffer columns
1920 x 1080
imaging pixels
4 empty pixels
4 buffer columns
2 buffer rows
4 light shielded rows
Video L
4 empty pixels
4
Video R
4
Single Output
Dual Output
4
28
28
4
4
960
1920
960
4
4
28
28
Figure 2. Sensor Architecture
There are 4 light shielded rows followed by 1084
photoactive rows and finally 4 more light shielded rows. The
first and last 2 photoactive rows are buffer rows giving a total
of 1080 lines of image data.
In the single output mode all pixels are clocked out of the
Video L output in the lower left corner of the sensor. The first
four empty pixels of each line do not receive charge from the
vertical shift register. The next 28 pixels receive charge from
the left light shielded edge followed by 1928 photoactive
pixels and finally 28 more light shielded pixels from the
right edge of the sensor. The first and last 4 photoactive
pixels are buffer pixels giving a total of 1920 pixels of image
data.
In the dual output mode the clocking of the right half of the
horizontal CCD is reversed. The left half of the image is
clocked out Video L and the right half of the image is clocked
out Video R. Each row consists of 4 empty pixels followed
by 28 light shielded pixels followed by 964 photoactive
pixels. When reconstructing the image, data from Video R
will have to be reversed in a line buffer and appended to the
Video L data.
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3
KAI−2093
Pin Description and Physical Orientation
VOUTR
18
15
VOUTL
VDDR
VSUB
VSUB
VDDL
GND
GND
GND
ESD
VSS
32
31
30
29
28
27
26
25
24
23
22
21
20
19
Pixel 1,
Pixel 1,1
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
fH2BL
fH1BL
fH1SL
fH2SL
fH2SR
fH1SR
fH1BR
fH2BR
fR
RD
OG
RD
GND
OG
Figure 3. Package Pin Designations
−
Top View
Table 4. PIN DESCRIPTION
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Label
fRL
fH2BL
fH1BL
fH1SL
fH2SL
GND
OG
RD
RD
OR
GND
fH2SR
fH1SR
fH1BR
fH2BR
fR
Pin
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Label
VSS
VOUTR
GND
fV2O
fV1
VSUB
GND
VDDR
VDDL
GND
VSUB
fV1
fV2E
ESD
VOUTL
VSS
The horizontal shift register is on the side of the sensor
parallel to the row of pins 1 through 16. In single output
mode the pixel closest to pin 1 will be read out first through
Video L, the pixel closest to pin 17 will be read out last. In
dual output mode the pixel closest to pin 16 will be read out
first through Video R.
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4
GND
fR
VSS
17
16
fV2
fV1
fV1
fV2
KAI−2093
IMAGING PERFORMANCE
Table 5. TYPICAL OPERATIONAL CONDITIONS
Description
Temperature
Integration Time
Operation
40°C
33 ms (40 MHz HCCD Frequency, 30 fps Frame Rate)
Nominal Voltages and Timing
Condition
NOTE: Image defects are excluded from performance tests.
Specifications
Table 6. OPTICAL SPECIFICATIONS
Description
Peak Quantum Efficiency
Peak Quantum Efficiency Wavelength
Quantum Efficiency at 540 nm
Microlens Acceptance Angle (horizontal)
Microlens Acceptance Angle (vertical)
Maximum Photoresponse Non-Linearity
Maximum Gain Difference between Outputs
Maximum Signal Error caused by Non-Linearity
Differences
Symbol
QE
MAX
lQE
QE(540)
qQEh
qQEv
NL
DG
DNL
31
±12
±25
Min.
33
Nom.
36
490
33
±13
±30
2
10
1
Max.
Units
%
nm
%
degrees
degrees
%
%
%
Notes
1
1
1
2
2
3, 4
3, 4
3, 4
1. For monochrome sensors.
2. Value is the angular range of incident light for which the quantum efficiency is at least 50% of QE
max
at a wavelength of
lQE.
Angles are
measured with respect to the sensor surface normal in a plane parallel to the horizontal axis (qQEh) or in a plane parallel to the vertical axis
(qQEv).
3. Value is over the range of 10% to 90% of photodiode saturation.
4. Value is for the sensor operated without binning.
Table 7. CCD SPECIFICATIONS
Description
Vertical CCD Charge Capacity
Horizontal CCD Charge Capacity
Photodiode Charge Capacity
Dark Current
Image Lag
Anti-Blooming Factor
Vertical Smear
Symbol
V
Ne
H
Ne
P
Ne
I
D
Lag
X
AB
Smr
100
35
Min.
45
Nom.
50
100
40
0.3
< 10
300
−75
−72
dB
1.0
50
Max.
Units
ke
−
ke
−
ke
−
nA/cm
2
e
−
2
3, 4, 5, 6
3, 4
1
Notes
1. This value depends on the substrate voltage setting. Higher photodiode saturation charge capacities will lower the antiblooming specification.
Substrate voltage will be specified with each part for nominal photodiode charge capacity.
2. This is the first field decay lag at 70% saturation. Measured by strobe illumination of the device at 70% of photodiode saturation, and then
measuring the subsequent frame’s average pixel output in the dark.
3. Measured with a spot size of 100 vertical pixels.
4. Measured with F/4 imaging optics and continuous green illumination centered at 550 nm.
5. A blooming condition is defined as when the spot size doubles in size.
6. Antiblooming factor is the light intensity which causes blooming divided by the light intensity which first saturates the photodiodes.
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