Infrared LED
L9725-01
High output power LED of compact SMD type
Features
High radiant output power
Compact
/
surface mount type package
High reliability
Low price
Compatible with lead-free reflow soldering
(RoHS compliance)
Applications
Optical switches
Automobile use
Absolute maximum ratings (Ta=25 °C unless otherwise noted)
Parameter
Reverse voltage
Forward current
Derating rate of forward current
Pulse forward current
Derating rate of pulse
forward current
Power dissipation
Operating temperature
Storage temperature
Reflow soldering condition
Symbol
V
R
I
F
-
I
FP
-
Pd
Topr
Tstg
Tsol
Condition
Specification
5
80
0.7
0.5
4.6
150
-30 to +90
-40 to +125
Peak temperature 250 °C, 2 times
Unit
V
mA
mA/°C
A
mA/°C
mW
°C
°C
-
Ta > 25 °C
Pulse width=10
μs
Duty ratio=1%
Ta > 25 °C
JEDEC level 4
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the
product within the absolute maximum ratings.
Electrical and optical characteristics (Ta=25 °C )
Parameter
Peak emission wavelength
Spectral half-width
Radiant
fl
ux
Forward voltage
Pulse forward voltage
Reverse current
Cutoff frequency
Symbol
λp
Δλ
φe
V
F
V
FP
I
R
fc
Condition
I
F
=50 mA
I
F
=50 mA
I
F
=50 mA
I
F
=50 mA
I
FP
=500 mA
V
R
=5 V
I
F
=30 mA ± 4 mAp-p
Min.
840
-
18
-
-
-
25
Typ.
870
45
23
1.45
2.3
-
40
Max.
900
70
29
1.75
3.5
5
-
Unit
nm
nm
mW
V
V
μA
MHz
www.hamamatsu.com
1
Infrared LED
L9725-01
Emission spectrum
100
(Typ. Ta=25 °C, I
F
=50 mA)
Radiant flux vs. pulse forward current
1000
(Typ. Ta=25 °C, tw=100 μs, 0.1%)
80
Relative light output (%)
Radiant flux (mW)
100
60
40
10
20
0
700
800
900
1000
1
10
100
1000
Wavelength (nm)
KLEDB0357EA
Pulse forward current (mA)
KLEDB0358EA
Pulse forward current vs. pulse forward voltage
1000
(Typ. Ta=25 °C, tw=100 μs, 0.1%)
Directivity
0°
30°
(Typ. Ta=25 °C)
30°
Pulse forward curren (mA)
100
60°
60°
10
90°
100
80
60
40
20
0
20
40
60
80
90°
100
Relative light output (%)
KLEDB0360EA
1
1.0
1.5
2.0
2.5
Pulse forward voltage (V)
KLEDB0359EA
2
Infrared LED
L9725-01
Light output vs. ambient temperature
3
2
(Typ. I
F
=50 mA)
Allowable forward current vs. ambient temperature
120
(Typ.)
100
Relative light output (dB)
1
0
-1
-2
-3
-4
-5
-40
Relative forward current (%)
80
60
40
20
-20
0
20
40
60
80
100
0
-40
-20
0
20
40
60
80
100
Ambient temperature (°C)
KLEDB0361EA
Ambient temperature (°C)
KLEDB0362EA
Allowable forward current vs. duty ratio
10000
(Typ. Ta=25 °C)
Recommended solder reflow conditon
300
Peak temperature 250 °C max.
Allowable forward current (mA)
250
Pulse width=1 μs
Pulse width=10 μs
Temperature (°C)
1000
200
150
100
Pulse width=100 μs
100
50
10
0.01
0
0.1
1
10
100
0
50
100
150
200
250
300
350
400
Duty ratio (%)
KLEDB0363EA
Time (s)
· After unpacking, store this device in an environment
at a temperature from 5 to 30 °C and a humidity below
60%, and perform reflow soldering on this device within
72 hours.
· Thermal stress applied to the device during reflow
soldering differs depending on the PC boards and
reflow oven being used.
· When setting the reflow conditions, make sure that
the reflow soldering process does not degrade device
reliability.
KLEDB0370EA
3
Infrared LED
L9725-01
Dimensional outline (unit: mm, tolerance unless otherwise noted: ± 0.1)
3.5 ± 0.2
3.2
2.2
0.8
2.8
0.8
0.8
Silicone resin
2.4
0.5
1.0 0.8
2.7
4.5
1.5
2.6
0.4
0.8 ± 0.2
1.0
1.5
3.1
0.8 ± 0.2
1.9 ± 0.2
0.85
Recommended land pattern
Anode
Anode
Cathode
Cathode
Electrode
Distance from emission area center
to package center: X, Y≤±0.2
Packing: reel (1000 pcs/reel)
KLEDA0095EA
Information described in this material is current as of July, 2012.
Product specifications are subject to change without prior notice due to improvements or other reasons. Before assembly into final products, please contact
us for the delivery specification sheet to check the latest information.
Type numbers of products listed in the delivery specification sheets or supplied as samples may have a suffix "(X)" which means preliminary specifications or
a suffix "(Z)" which means developmental specifications.
The product warranty is valid for one year after delivery and is limited to product repair or replacement for defects discovered and reported to us within that
one year period. However, even if within the warranty period we accept absolutely no liability for any loss caused by natural disasters or improper product
use.
Copying or reprinting the contents described in this material in whole or in part is prohibited without our prior permission.
www.hamamatsu.com
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 8152-375-0, Fax: (49) 8152-265-8
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Thorshamnsgatan 35 16440 Kista, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1 int. 6, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
China: Hamamatsu Photonics (China) Co., Ltd.: 1201 Tower B, Jiaming Center, No.27 Dongsanhuan Beilu, Chaoyang District, Beijing 100020, China, Telephone: (86) 10-6586-6006, Fax: (86) 10-6586-2866
Cat. No. KLED1061E01 Jul. 2012 DN
4
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