Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
BAS 3007A-RPP E6327
MA000787202
PG-SOT143-4-10
Material Group
noble metal
non noble metal
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
inorganic material
plastics
plastics
inorganic material
non noble metal
noble metal
< 10%
Substances
gold
arsenic
silicon
silicon
titanium
chromium
copper
gold
carbon black
antimonytrioxide
brominated resin
epoxy resin
silicondioxide
tin
silver
CAS#
if applicable
7440-57-5
7440-38-2
7440-21-3
7440-21-3
7440-32-6
7440-47-3
7440-50-8
7440-57-5
1333-86-4
1309-64-4
-
-
60676-86-0
7440-31-5
7440-22-4
Issued
Weight*
Weight
[mg]
0.005
0.000
0.160
0.001
0.005
0.015
4.981
0.125
0.101
0.151
0.189
1.576
4.287
0.217
0.122
Average
Mass
[%]
0.04
0.00
1.34
0.01
0.04
0.13
41.73
1.05
0.85
1.27
1.58
13.21
35.92
1.81
1.02
29. August 2013
11.93 mg
Sum
[%]
Average
Mass
[ppm]
392
4
1.38
13393
84
419
1257
41.91
1.05
417361
10502
8451
12677
15846
132051
52.83
1.81
1.02
359179
18149
10235
528204
18149
10235
1000000
419121
10502
13789
Sum
[ppm]
leadframe
wire
encapsulation
leadfinish
plating
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
Microcontroller MCU
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