Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPD90N06S4-07
MA000472046
PG-TO252-3-11
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
inorganic material
noble metal
non noble metal
non noble metal
inorganic material
non noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
phosphorus
silver
tin
lead
phosphorus
iron
copper
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7723-14-0
7440-22-4
7440-31-5
7439-92-1
7723-14-0
7439-89-6
7440-50-8
Issued
Weight*
Weight
[mg]
2.466
0.140
0.042
139.706
4.075
1.441
25.223
117.468
3.740
0.091
0.000
0.060
0.048
2.297
0.028
0.095
94.488
Average
Mass
[%]
0.63
0.04
0.01
35.69
1.04
0.37
6.44
30.01
0.96
0.02
0.00
0.02
0.01
0.59
0.01
0.02
24.14
29. August 2013
391.41 mg
Sum
[%]
0.63
Average
Mass
[ppm]
6300
357
107
35.74
1.04
356930
10410
3682
64442
36.82
0.96
300117
9555
232
0.02
1
154
123
0.62
5869
73
242
24.17
241406
241721
1000000
6146
233
368241
9555
357394
10410
Sum
[ppm]
6300
wire
encapsulation
leadfinish
plating
solder
heatspreader
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com