Placement efficiency of Chip Resistor Array is two, four or eight times of the flat type chip resistor
■
Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
B
V
8
V
4
7
2
J
V
Product Code
Thick Film
Chip Resistor
Networks
1
2
3
N
V
S
Chip Resistor Array
Type: inches
0201 Array
0402 Array
0603 Array
0402 Array
0603 Array
0805 Array
Convex
Terminal
Concave
Terminal
No. of Terminal
4 4 Terminal
8 8 Terminal
H 16 Terminal
Schematics
Packaging Methods
Resistance Value
Resistance
Packaging
Type
Isolated The first two digits are Tolerance Code
V
type
significant figures of
J
±5
%
Embossed Carrier Taping
EXBS8V
Nil 4 mm pitch
resistance value and
0 Jumper
the third one denotes
Punched Carrier Taping EXB14V, 18V,
the number of zeros
X 2 mm pitch
24V, 28V, N8V
following. Jumper is
Punched Carrier Taping EXB2HV, 34V,
expressed by R00
V 4 mm pitch
38V, V4V, V8V
Example: 222: 2.2 k
■
Construction (Example : Concave Terminal)
■
Schematics
●
Isolated type
14V, 24V, 34V, V4V
2 resistors
4
3
8
18V, 28V, N8V, 38V, V8V, S8V
4 resistors
7
6
5
Protective coating
1
2
1
2
3
4
Alumina substrate
Electrode (Outer)
Electrode (Between)
2HV
8 resistors
16 15 14 13 12 11 10
9
Thick film
resistive element
Electrode (Inner)
1
2
3
4
5
6
7
8
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Mar. 2008
Chip Resistor Array
■
Dimensions in mm (not to scale)
(1) Convex Terminal type
A1
EXB14V, 24V, 34V
B
G
A1
A2
EXB28V, 38V
B
G
T
L
EXB2HV
B
G
G
W
P
B
T
G
W
B
G
W
P
L
A1 A2
T
P
L
Type
(inches)
EXB14V (0201 2)
EXB24V (0402 2)
EXB28V (0402 4)
EXB2HV (0402 8)
EXB34V (0603 2)
EXB38V (0603 4)
Dimensions (mm)
L
0.80
±0.10
1.00
±0.10
2.00
±0.10
3.80
±0.10
1.60
±0.20
3.20
±0.20
W
0.60
±0.10
1.00
±0.10
1.00
±0.10
1.60
±0.10
1.60
±0.15
1.60
±0.15
T
0.35
±0.10
0.35
±0.10
0.35
±0.10
0.45
±0.10
0.50
±0.10
0.50
±0.10
A1
0.35
±0.10
0.40
±0.10
0.45
±0.10
0.35
±0.10
0.65
±0.15
0.65
±0.15
A2
—
—
0.35
±0.10
0.35
±0.10
—
0.45
±0.15
B
0.15
±0.10
0.18
±0.10
0.20
±0.10
0.30
±0.10
0.30
±0.20
0.30
±0.20
P
(0.50)
(0.65)
(0.50)
(0.50)
(0.80)
(0.80)
G
0.15
±0.10
0.25
±0.10
0.25
±0.10
0.30
±0.10
0.30
±0.20
0.35
±0.20
B
Mass (Weight)
[g/1000 pcs.]
0.5
1.2
2.0
9.0
3.5
7.0
( ) Reference
(2) Concave Terminal type
A1
EXBV4V
B
G
A1
A2
EXBN8V, V8V, S8V
B
G
T
G
W
G
B
P
L
T
P
L
Type
(inches)
EXBN8V (0402 4)
EXBV4V (0603 2)
EXBV8V (0603 4)
EXBS8V (0805 4)
Dimensions (mm)
L
2.00
±0.10
1.60
+0.20
–0.10
3.20
+0.20
–0.10
5.08
+0.20
–0.10
B
W
W
1.00
±0.10
1.60
+0.20
–0.10
1.60
+0.20
–0.10
2.20
+0.20
–0.10
T
0.45
±0.10
0.60
±0.10
0.60
±0.10
0.70
±0.20
A1
0.30
±0.10
0.60
±0.10
0.60
±0.10
0.80
±0.15
A2
0.30
±0.10
—
0.60
±0.10
0.80
±0.15
B
0.20
±0.15
0.30
±0.15
0.30
±0.15
0.50
±0.15
P
(0.50)
(0.80)
(0.80)
(1.27)
G
0.30
±0.15
0.45
±0.15
0.45
±0.15
0.55
±0.15
Mass (Weight)
[g/1000 pcs.]
3.0
5.0
10
30
( ) Reference
(3) Flat Terminal type
A1
A2
EXB18V
G
T
G
W
P
L
B
B
Type
(inches)
EXB18V (0201 4)
Dimensions (mm)
L
1.40
±0.10
W
0.60
±0.10
T
0.35
±0.10
A1
0.20
±0.10
A2
0.20
±0.10
B
0.10
±0.10
P
(0.40)
G
0.20
±0.10
Mass (Weight)
[g/1000 pcs.]
1.0
( ) Reference
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
■
Ratings
Item
Resistance Range
Resistance Tolerance
14V,24V,V4V,34V
Specifications
10 to 1 M :E24 series
J: ±5 %
4 terminal
Item
14V,18V
(1)
Limiting Element Voltage
2HV
Max. Rated Continuous
24V,28V,N8V,38V,34V,V4V,V8V
Working Voltage
S8V
Specifications
12.5 V
25 V
50 V
100 V
25 V
50 V
200 V
±200 10
-6
/°C(ppm/°C)
(
)
Number of Terminals
18V,28V,N8V,38V,V8V,S8V
8 terminal
2HV
14V,24V,V4V,34V
16 terminal
2 terminal
T.C.R.
Max. Over-load Voltage
(2)
14V,18V
2HV
S8V
24V,28V,N8V,38V,34V,V4V,V8V
100 V
Number of Resistors
18V,28V,N8V,38V,V8V,S8V
4 terminal
2HV
14V,28V,N8V
18V
Power Rating at 70 °C
24V,V4V,34V,V8V,38V
S8V
2HV
8 terminal
0.031 W/element
0.031 W/element
(0.1 W/package)
0.063 W/element
0.1 W/element
0.063 W/element
(0.25 W/package)
Category Temperature Range
(Operating Temperature Range)
14V,18V
Jumper Array
S8V
14V,18V
S8V
–55 °C to 125 °C
0.5 A
2A
1A
4A
Rated Current
2HV,24V,28V,N8V,38V,34V,V4V,V8V
1 A
Max, Overload Current
2HV,24V,28V,N8V,38V,34V,V4V,V8V
2 A
(1) Rated Continuous Working Voltage (RCWV) shall be determined from RCWV= Power Rating Resistance Value, or Limiting Element Voltage (max.
RCWV) listed above, whichever less.
(2) Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=2.5 Power Rating or max. Overload (Voltage) listed above whichever less.
100
Rated Load (%)
–55
°C
70
°C
Power Derating Curve
For resistors operated in ambient temperature above
70 °C, power rating shall be derated in accordance
with the figure on the right.
80
60
40
20
0
–60 –40 –20 0
125
°C
20 40 60 80 100 120 140 160 180
Ambient Temperature (°C)
■
Packaging Methods (Taping)
●
Standard Quantity
Type
EXB14V, 18V
EXB24V, 28V
EXBN8V
EXB2HV
EXB34V, 38V
EXBV4V, V8V
EXBS8V
Embossed Carrier Taping
Punched Carrier Taping
4 mm
5000 pcs./reel
2500 pcs./reel
2 mm
10000 pcs./reel
Kind of Taping
Pitch (P
1
)
Quantity
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2006
Chip Resistor Array
●
Carrier Tape
Punched Carrier
Embossed Carrier
φD
0
P
1
P
2
P
0
E
Unit (mm)
F
B
T
T
A
P
1
(2 mm pitch)
φD
1
(Only Emboss)
W
Type
EXB14V
EXB18V
EXB24V
EXB28V
EXBN8V
EXB2HV
EXB34V
EXB38V
EXBV4V
EXBV8V
EXBS8V
A
0.70
+0.10
–0.05
B
0.95
+0.05
–0.10
W
F
E
P
1
P
2
P
0
φD
0
T
φD
1
1.60
±0.10
1.20
±0.10
2.00
±0.10
0.52
±0.05
1.20
±0.10
2.20
±0.10
4.10
±0.15
8.00
±0.20
3.50
±0.05
1.75
±0.10
2.00
±0.05
4.00
±0.10
1.50
+0.10
–0
_
0.70
±0.05
1.95
±0.20
1.95
±0.15
3.60
±0.20
1.95
±0.20
3.60
±0.20
2.80
±0.20
5.70
±0.20
12.00
±0.30
5.50
±0.20
4.00
±0.10
0.84
±0.05
1.60 max. 1.50
+0.10
–0
Unit (mm)
T
●
Taping Reel
Type
EXB14V,18V
EXB24V,28V
EXBN8V
EXB2HV
EXB34V,38V
EXBV4V,V8V
EXBS8V
φA
φB
φC
W
T
φC
φB
180.0
+0
60 min. 13.0
±1.0
–3.0
9.0
±1.0
11.4
±1.0
13.0
±1.0
15.4
±2.0
φA
W
■
Land pattern design
Recommended land pattern design for Network chip is shown below.
Conductor
f
Solder Resist
a
d
a
b
c
b
c
(Not to scale)
Type
14V
24V
Dimensions
a
0.30
0.5
b
0.30
0.35 to 0.40
c
0.30
0.30
Unit (mm)
d
0.80 to 0.90
1.4 to 1.5
Type
18V
V4V,V8V
34V,38V
S8V
Dimensions
a
b
c
(Not to scale)
Unit (mm)
f
0.20 to 0.30 0.15 to 0.20 0.15 to 0.20 0.80 to 0.90
0.7 to 0.9
0.7 to 0.9
1 to 1.2
0.4 to 0.45 0.4 to 0.45
0.4 to 0.5
0.4 to 0.5
2 to 2.4
2.2 to 2.6
3.2 to 3.8
0.5 to 0.75 0.5 to 0.75
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2008
Chip Resistor Array
f
a
f
a
b
d c d c d
b
b
d c d c d c d c d c d c d
b
Type
28V
N8V
(Not to scale)
Dimensions
Unit (mm)
a
b
c
d
f
0.40
0.525
0.25
0.25
1.40
0.45 to 0.50 0.35 to 0.38
0.25
0.25
1.40 to 2.00
Type
2HV
a
1.00
(Not to scale)
Dimensions
Unit (mm)
b
c
d
f
0.425
0.25
0.25
2.00
■
Recommended Soldering Conditions
Recommendations and precautions are described below.
●
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Peak
Temperature
Preheating
Heating
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Time
Preheating
150 °C to 180 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
●
Flow soldering
· We do not recommend flow soldering, because a solder bridge may form.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to Fixed Resistors
shown on page ER3 of this catalog.
1. Take measures against mechanical stress during and after mounting of Chip Resistor Array (hereafter called the
resistors) so as not to damage their electrodes and protective coatings.
Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.
2. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations
of the resistors when installed in your products before use.
Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired.
3. Do not use halogen-based or other high-activity flux. Otherwise, the residue may impair the resistors' performance
and/or reliability.
4. When soldering with a soldering iron, never touch the resistors' bodies with the tip of the soldering iron. When using a
soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 350 °C max.).
5. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing
problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder.
6. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors'
protective coatings and bodies may be chipped, affecting their performance.
7. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
A smartwatch is a wrist-worn device that has a two-way connection to a smartphone via Bluetooth, baseband chips or Wi-Fi. It receives electronic communications such as texts or voice calls, must show ...
The 1.5T mobile hard disk exchanged with E coins has arrived! ! Thanks to EE, and even more to the administrator: Xu Linglong. For an engineering guy, the computer files and data are the result of a l...
[i=s]This post was last edited by zca123 on 2014-3-6 11:36[/i] [backcolor=rgb(238, 238, 238)][font=Tahoma, Helvetica, SimSun, sans-serif][size=12px]Document download address: [url]https://download.eew...
Features of TL431: TL431 precision adjustable reference power supply has the following features: voltage regulation value is continuously adjustable from 2.5 to 36V; original error of reference voltag...
The double-tube counter-attack power supply, when the rear tube is not turned on (power supply does not work), 400V is input at J33, and the voltage across the electrolytic capacitor slowly rises to a...
1. Principle 1. Infrared emission protocol There are many infrared communication protocols. This experiment uses the NEC protocol. This protocol uses PWM modulation and uses pulse width to represen...[Details]
Today, under the guidance of a low-level expert, I learned how to configure the PWM module! Woof! First open the file configured last time, as follows: Then, we need to use TIM1 to set PWM: Then,...[Details]
Because the STM32 HAL library only has millisecond-level delay for HAl_Delay(), in order to achieve accurate microsecond-level delay, Systick has to be modified. However, since it is used internally ...[Details]
LAN8720 configuration: IP: 192.168.192.30 Gateway: 192.168.192.1 A high frequency of ARP packets is detected The content of the packet asks for the mac address of 192.168.192.1, and asks the resp...[Details]
From last year to now, competition in the photovoltaic inverter industry has become increasingly fierce. In addition to the introduction of new products, various marketing and promotion methods hav...[Details]
Superconductors have physical properties such as zero resistance effect, Meissner effect and Josephson effect, which make them have broad application prospects and unparalleled advantages in many b...[Details]
Kevin Jensen ams Semiconductor
Sensors
and lighting expert. Let's learn more about the relevant content with the network communication editor.
Everything is becoming "smart" these ...[Details]
When Amazon quietly launched a product called Elastic Computing Cloud 12 years ago, the Internet industry in China, across the ocean, also ushered in an unprecedented development opportunity. Let's...[Details]
According to TechRadar, given rumors that
Google
is developing a Pixel Watch
,
the
recently renamed Wear OS
smartwatch
operating system may soon be able to show its full cap...[Details]
The independent watchdog of STM32 is driven by a dedicated internal 40Khz low-speed clock, that is, it is still effective even if the main clock fails. Here we need to note that the clock of the inde...[Details]
The pins of stm32 have two uses: GPIO (general purpose io) and AFIO (alternate function io) For some pins (depending on the chip), neither of these two uses exists. For example, in 64-pin products, O...[Details]
I have encountered many problems when tinkering with LD driver recently. I will record them one by one below. Otherwise, who will remember who in five hundred years? 1. Configuration issues of multi-...[Details]
/*----------------------------------------------- Name: IIC protocol PCF8591 AD/DA conversion Content: Use DA input, digital tube display output digital quantity, LED display analog voltage size ...[Details]