CDR12BP131AFUS datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> CDR12BP131AFUS

CDR12BP131AFUS: DescriptionCeramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP; CategoryPassive components capacitor; File Size147KB，9 Pages; ManufacturerAVX; Related ProductsFound20parts with similar functions to CDR12BP131AFUS

Download Datasheet Parametric View All

CDR12BP131AFUS Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP

CDR12BP131AFUS Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	CHIP
Reach Compliance Code	_compli
ECCN code	EAR99
Factory Lead Time	9 weeks
capacitance	0.00013 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	0.979 mm
JESD-609 code	e0
length	1.4 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	1%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	WAFFLE PACK
positive tolerance	1%
Rated (DC) voltage (URdc)	50 V
Guideline	MIL-PRF-55681
size code	0606
surface mount	YES
Temperature characteristic code	BP
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrie
Terminal shape	WRAPAROUND
width	1.4 mm
Base Number Matches	1

Preview

Download Datasheet

View All

Microwave MLC’s

CDR Series — MIL-PRF-55681 (RF/Microwave Chips)

MILITARY DESIGNATION PER MIL-PRF-55681

A 0J

CDR11/12

CDR13/14

CROSS REFERENCE: AVX/MIL-PRF-55681

Per MIL-C-55681

CDR11

CDR12

CDR13

CDR14

AVX

Style

AQ11

AQ12

AQ13

AQ14

Length (L)

.055±.015

(1.40±.381)

.055±.025

(1.40±.635)

.110±.020

(2.79±.508)

.110 +.035 -0.20

(2.79 +.889 -.508)

Width (W)

.055±.015

(1.40±.381)

.055±.015

(1.40±.381)

.110±.020

(2.79±.508)

.110±.020

(2.79±.508)

Thickness (T)

Max

Min

.057

(1.45)

.057

(1.45)

.102

(2.59)

.102

(2.59)

.020

(.508)

.020

(.508)

.030

(.762)

.030

(.762)

Termination Band (bw)

Max

Min

.020

(.508)

.020

(.508)

.025

(.635)

.025

(.635)

.005

(.127)

.005

(.127)

.005

(.127)

.005

(.127)

HOW TO ORDER

CDR12

MIL Style

CDR11, CDR12,

CDR13, CDR14

101

Capacitance

EIA Capacitance Code in pF.

First two digits = significant figures

or “R” for decimal place.

Third digit = number of zeros or

after “R” significant figures.

Capacitance

Tolerance Code

B = ±.1 pF

C = ±.25 pF

D = ±.5 pF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

Failure Rate

Level

Termination

Finish (Military

Designations)

Code

M = 1.0%

P = .1%

R = .01%

S = .001%

Voltage

Temperature

Limits

BG = +90±20 ppm/°C with and without

rated voltage from -55°C to + 125°C

BP = 0±30ppm/°C with and without

rated voltage from -55°C to +125°C

Rated Voltage

Code

A = 50V

B = 100V

C = 200V

D = 300V

E = 500V

PACKAGING

Standard Packaging Quanity

CDR11-12 = 100 pcs per waffle pack

CDR13-14 = 80 pcs per waffle pack

M = Palladium/Silver (CDR11 & 13 only)

N = Silver, Nickel, Gold (CDR11 & 13 only)

S = Solder Coated, Final (CDR12 & 14 only)

U = Base Metallization, Barrier Metal, Solder

Coated. (Solder M.P. 200°C or less)

(CDR12 & 14 only)

W = Base Metallization, Barrier Metal,

Tinned (Tin or Tin/Lead Alloy)

(CDR12 & 14 only)

Y = 100% Tin

(CDR12 & 14 only)

Z = Base Metallization, Barrier Metal

(TIn Lead Alloy With 4% Lead Min.)

(CDR12 & 14 only)

Not RoHS Compliant

TAPE & REEL:

All tape and reel specifications are in compliance with EIA RS481

(equivalent to IEC 286 part 3).

Sizes SQCA through SQCB, CDR11/12 through 13/14.

—8mm carrier

—7" reel: ≤0.040" thickness = 2000 pcs

≤0.075" thickness = 2000 pcs

—13" reel: ≤0.075" thickness = 10,000 pcs

LEAD-FREE COMPATIBLE

COMPONENT

For RoHS compliant products,

please select correct termination style.

131

Recommended Resources

DC tube amplifier working in Class B

Improved connection method of triode switch circuit circuit diagram

VMOS, IGBT inverter charging circuit diagram

Single-phase induction motor forward/reverse rotation circuit

80-channel AD590 temperature measurement on-off control circuit

555 burst audio circuit

CDR12BP131AFUS Similar Products

Part Number	Manufacturer	Description
CDR11BP131AFZS	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFZM	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFYR	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFYS	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFUP	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFUR	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFUM	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFYS	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFSM	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFZR	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFZS	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFZR	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFYP	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFZP	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFYM	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFYM	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFSS	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR11BP131AFMP	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFSR	ATC [American Technical Ceramics]	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP
CDR12BP131AFZP	AVX	Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, BP, 30ppm/Cel TC, 0.00013uF, Surface Mount, 0606, CHIP

Raspberry Pi Pico Video: ...; okhxyyo Special Edition for Assessment Centres

【ufun learning】uFUN+TB6612FNG control motor forward and reverse: [i=s]This post was last edited by Min丨Dayu on 2019-8-26 21:35[/i]This content is originally created by EEWORLD forum user Min Da. If you want to reprint or use it for commercial purposes, you must obt...; 闵丨大 Integrated technical exchanges

Has anyone used the SSD1963 display driver chip? I want a C driver based on the exception of STM32. I really don't understand it...: :looks:...; lxgree2013 NXP MCU

Urgently needed: Wince WiFi testing tool!: Does anyone know what tool software to use to test the WI-FI transmission rate in Windows? Where can I download it? Thank you!...; liyang203 Embedded System

Is there something wrong with this matrix button program?: In the example programs of other development boards I bought, there is this subroutine part: 1.uchar keyscan(void) //keyboard scanning function, using row and column inversion scanning method 2.{ 3. u...; zszhere MCU

Can STM32 support multi-tasking?: Can STM32 support multi-tasking? Without using an operating system. For example, while recording external pulses, the M3 core can also process real-time display, GPS data, GPRS wireless acquisition, a...; Tiaholia stm32/stm8

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components