Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
6EDL04I06PT
MA001120098
PG-DSO-28-17
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
Substances
silicon
zinc
phosphorus
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7440-66-6
7723-14-0
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
3.034
0.288
0.072
5.754
233.637
0.995
1.693
71.650
490.831
4.913
0.678
0.246
0.983
Average
Mass
[%]
0.37
0.04
0.01
0.71
28.68
0.12
0.21
8.79
60.24
0.60
0.08
0.03
0.12
7. May 2015
814.77 mg
Sum
[%]
0.37
Average
Mass
[ppm]
3724
353
88
7062
29.44
0.12
286751
1221
2077
87939
69.24
0.60
0.08
602415
6030
832
302
0.15
1206
1508
1000000
692431
6030
832
294254
1221
Sum
[ppm]
3724
wire
encapsulation
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
Embedded System
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