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SQS482EN_15

Description
Automotive N-Channel 30 V (D-S) 175 °C MOSFET
File Size572KB,14 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Download Datasheet View All

SQS482EN_15 Overview

Automotive N-Channel 30 V (D-S) 175 °C MOSFET

SQS482EN
www.vishay.com
Vishay Siliconix
Automotive N-Channel 30 V (D-S) 175 °C MOSFET
PRODUCT SUMMARY
V
DS
(V)
R
DS(on)
() at V
GS
= 10 V
R
DS(on)
() at V
GS
= 4.5 V
I
D
(A)
Configuration
PowerPAK
®
1212-8
FEATURES
30
0.0085
0.01
16
Single
D
• TrenchFET
®
Power MOSFET
• AEC-Q101 Qualified
d
• 100 % R
g
and UIS Tested
• Material categorization:
For definitions of compliance please see
www.vishay.com/doc?99912
3.30 mm
S
1
2
3
S
S
3.30 mm
G
4
D
8
7
6
5
D
D
D
G
Bottom View
Part Marking Code:
Q017
S
N-Channel MOSFET
ORDERING INFORMATION
Package
Lead (Pb)-free and Halogen-free
PowerPAK 1212-8
SQS482EN-T1-GE3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
a
Continuous Source Current (Diode Conduction)
a
Pulsed Drain
Current
b
L = 0.1 mH
T
C
= 25 °C
T
C
= 125 °C
Single Pulse Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipation
b
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
e, f
T
C
= 25 °C
T
C
= 125 °C
SYMBOL
V
DS
V
GS
I
D
I
S
I
DM
I
AS
E
AS
P
D
T
J
, T
stg
LIMIT
30
± 20
16
16
16
64
31
48
62
20
- 55 to + 175
260
mJ
W
°C
A
UNIT
V
THERMAL RESISTANCE RATINGS
PARAMETER
Junction-to-Ambient
Junction-to-Case (Drain)
PCB
Mount
c
SYMBOL
R
thJA
R
thJC
LIMIT
81
2.4
UNIT
°C/W
Notes
a. Package limited.
b. Pulse test; pulse width
300 μs, duty cycle
2 %.
c. When mounted on 1" square PCB (FR4 material).
d. Parametric verification ongoing.
e. See solder profile (www.vishay.com/doc?73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
f. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
S12-1860-Rev. B, 13-Aug-12
Document Number: 67074
1
For technical questions, contact:
automostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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