Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
BTM7710G
MA001364464
PG-DSO-28-22
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
Substances
silicon
phosphorus
zinc
iron
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
12.882
0.072
0.288
5.754
233.637
1.583
1.095
78.300
468.155
4.975
0.678
0.607
2.860
Average
Mass
[%]
1.59
0.01
0.04
0.71
28.81
0.20
0.14
9.66
57.73
0.61
0.08
0.07
0.35
27. July 2015
810.89 mg
Sum
[%]
1.59
Average
Mass
[ppm]
15886
89
355
7096
29.57
0.20
288126
1952
1350
96561
67.53
0.61
0.08
577339
6135
836
748
0.42
3527
4275
1000000
675250
6135
836
295666
1952
Sum
[ppm]
15886
wire
encapsulation
non noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
leadfinish
plating
glue
*deviation
Sum in total: 100.00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
京公网安备 11010802033920号
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