25LS158W datasheet, PDF - EEWORLD Datasheet

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25LS158W: DescriptionMultiplexer, 4-Func, 2 Line Input, TTL, CDFP16,; Categorylogic logic; File Size118KB，2 Pages; ManufacturerRaytheon Company; Websitehttps://www.raytheon.com/

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25LS158W Overview

Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,

25LS158W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
package instruction	DFP, FL16,.3
Reach Compliance Code	unknown
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Logic integrated circuit type	MULTIPLEXER
Number of functions	4
Number of entries	2
Number of terminals	16
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL

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25LS158W Related Products

	25LS158W	25LS157W	25LS158W/883B	25LS157J/883B	25LS158N	25LS157W/883B
Description	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, PDIP16,	Multiplexer, 4-Func, 2 Line Input, TTL, CDFP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DFP, FL16,.3	DFP, FL16,.3	DFP, FL16,.3	DIP, DIP16,.3	DIP, DIP16,.3	DFP, FL16,.3
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	R-XDFP-F16	R-XDFP-F16	R-XDFP-F16	R-XDIP-T16	R-PDIP-T16	R-XDFP-F16
JESD-609 code	e0	e0	e0	e0	e0	e0
Logic integrated circuit type	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER	MULTIPLEXER
Number of functions	4	4	4	4	4	4
Number of entries	2	2	2	2	2	2
Number of terminals	16	16	16	16	16	16
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	70 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DFP	DFP	DFP	DIP	DIP	DFP
Encapsulate equivalent code	FL16,.3	FL16,.3	FL16,.3	DIP16,.3	DIP16,.3	FL16,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	FLATPACK	FLATPACK	IN-LINE	IN-LINE	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	YES
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	FLAT	FLAT	THROUGH-HOLE	THROUGH-HOLE	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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