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3MD04113

Description
Blank ceramics (not metallized)
File Size2MB,8 Pages
ManufacturerRMT Ltd.
Websitehttp://www.rmtltd.ru/
Download Datasheet View All

3MD04113 Overview

Blank ceramics (not metallized)

Thermoelectric Cooling Solutions
Performance Parameters
Type
ΔT
max
K
111
113
114
113
114
3MD04-113-XX
I
max
A
1.0
0.7
0.5
0.4
0.4
8.5
Q
max
W
1.46
0.95
0.76
0.64
0.52
U
max
V
AC R
Ohm
7.14
11.31
14.10
16.88
21.06
H
mm
3.8
4.7
5.3
5.9
6.8
3MD04-113-xx (N=113)
3MD04-113-05
3MD04-113-08
3MD04-113-10
3MD04-113-12
3MD04-113-15
Performance data are given for 300K, vacuum
Dimensions
Manufacturing options
A. TEC Assembly:
* 1. Solder SnSb (T
melt
=230°C)
2. Solder AuSn (T
melt
=280°C)
B. Ceramics:
C. Ceramics Surface Options:
1. Blank ceramics (not metallized)
2. Metallized (Au plating)
3. Metallized and pre-tinned with:
3.1 Solder 117 (In-Sn, T
melt
=117°C)
3.2 Solder 138 (Sn-Bi, T
melt
= 138°C)
3.3 Solder 143 (In-Ag, T
melt
= 143°C)
3.4 Solder 157 (In, T
melt
= 157°C)
3.5 Solder 183 (Pb-Sn, T
melt
=183°C)
3.6 Optional (specified by Customer)
46 Warshavskoe shosse. Moscow 115230
 Russia,
ph: +7-499-678-2082, fax: +7-499-678-2083, web:
www.rmtltd.ru
Copyright 2012. RMT Ltd. The design and specifications of products can be changed by RMT Ltd without notice.
D. Thermistor (optional)
Can be mounted to cold side
ceramics edge. Calibration is
available by request.
E. Terminal contacts
1. Blank, tinned Copper
2. Insulated Wires
3. Insulated, color coded
*
1.Pure Al
2
O
3
(100%)
2.Alumina (Al
2
O
3
- 96%)
3.Aluminum Nitride (AlN)
* - used by default
Page 1 of 8
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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