EEWORLDEEWORLDEEWORLD

Part Number

Search

DFLS120L_15

Description
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
File Size73KB,4 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Download Datasheet View All

DFLS120L_15 Overview

1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER

DFLS120L
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
Patented Interlocking Clip Design for High Surge Current
Capacity
High Current Capability and Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 4)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: PowerDI 123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminal Connections: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.01 grams (approximate)
®
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current
Non-Repetitive Peak Forward Surge Current 8.3ms
single half sine-wave superimposed on rated load
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
F(AV)
I
FSM
Value
20
14
1.0
50
Unit
V
V
A
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Ambient (Note 2)
Thermal Resistance Junction to Soldering (Note 3)
Operating Temperature Range
Storage Temperature Range
Symbol
P
D
P
D
R
θ
JA
R
θ
JA
R
θ
JS
T
J
T
STG
Value
1.67
556
60
180
10
-55 to +125
-55 to +150
Unit
W
mW
°C/W
°C/W
°C/W
°C
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Notes:
1.
2.
3.
4.
5.
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
V
F
I
R
C
T
Min
20
Typ
0.20
0.30
0.32
0.26
75
Max
0.36
1.0
Unit
V
V
mA
pF
Test Condition
I
R
= 1.0mA
I
F
= 0.1A
I
F
= 0.7A
I
F
= 1.0A
V
R
= 5V, T
A
= 25°C
V
R
= 20V, T
A
= 25°C
V
R
= 10V, f = 1.0MHz
Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. T
A
= 25°C.
Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T
A
= 25°C.
Theoretical R
θJS
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see
EU Directive 2002/95/EC Annex Notes.
Short duration pulse test used to minimize self-heating effect.
PowerDI is a registered trademark of Diodes Incorporated.
DFLS120L
Document number: DS30444 Rev. 6 - 2
1 of 4
www.diodes.com
June 2011
© Diodes Incorporated
I found a blog with some great information about Xilinx.
Today I was bored and was browsing the Internet. Suddenly I found a good blog and would like to recommend it to you: [u][color=#006699][url=https://home.eeworld.com.cn/my/space.php?uid=126336&do=blog&...
clark FPGA/CPLD
Ask: about x86 system memory physical address and IO device address
Are the physical addresses of memory continuous? Do they start from 0? What about the addresses of IO devices? Will they overlap with the physical addresses of memory?...
cattyzeal Embedded System
iq format problem
I've been a little confused by _iq recently, and I'd like to ask for some advice from seniors. Here's the code: #ifndef GLOBAL_Q #define GLOBAL_Q 24 #endif #define OFFSET (_IQ12(0.05)) _iq x; _iq m; _...
喜鹊王子 DSP and ARM Processors
Discussion on whether FMD driver needs mutual exclusion?
I found that many NAND drivers do not add a CriticalSection for mutual exclusion processing for functions such as FMD_WriteSector. I personally understand that this may cause confusion in the operatio...
oliver22414 Embedded System
stm32 printf function implementation method
1. Configure the project properties. The detailed steps are as follows: 1. First, include "stdio.h" (standard input and output header file) in your main file. 2. Redefine in the main fileThe function ...
飓风狂飙 stm32/stm8
I want to learn 51, I hope you can recommend a development board, thank you.
I want to learn 51, I hope you can recommend a development board, thank you....
272464817 Embedded System

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 651  636  1347  2267  2601  14  13  28  46  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号