MMBD2004S
HIGH VOLTAGE SURFACE MOUNT DUAL SWITCHING DIODE
Features
•
•
•
•
•
•
•
•
Fast Switching Speed: Maximum of 50ns
High Reverse Breakdown Voltage: 300V
Low Leakage Current: Maximum of 100nA when V
R
= 240V at
Room Temperature
Surface Mount Package Ideally Suited for Automated Insertion
Dual Series Configuration
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
•
•
•
•
•
•
•
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
e3
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Polarity: See Diagram
Weight: 0.008 grams (approximate)
SOT23
Top View
Internal Schematic
Ordering Information
(Note 4)
Part Number
MMBD2004S-7-F
MMBD2004SQ-7-F
Notes:
Qualification
Commercial
Automotive
Case
SOT23
SOT23
Packaging
3000/Tape & Reel
3000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KXX
Kxx = Product Type Marking Code (KA9 or KAE)
YM = Date Code Marking
Y = Year ex: Z = 2012
M = Month ex: 9 = September
Date Code Key
Year
Code
Month
Code
2001
M
Jan
1
2002
N
Feb
2
2003
P
Mar
3
…..
…..
Apr
4
2012
Z
May
5
YM
2013
A
Jun
6
2014
B
Jul
7
2015
C
Aug
8
2016
D
Sep
9
2017
E
Oct
O
2018
F
Nov
N
2019
G
Dec
D
MMBD2004S
Document number: DS30281 Rev. 12 - 2
1 of 4
www.diodes.com
August 2012
© Diodes Incorporated
MMBD2004S
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Repetitive Peak Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 5)
Peak Repetitive Forward Current (Note 5)
Non-Repetitive Peak Forward Surge Current
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
FRM
@ t = 1.0µs
@ t = 1.0s
I
FSM
Value
300
240
170
225
625
4.0
1.0
Unit
V
V
V
mA
mA
A
Thermal Characteristics
Characteristic
Power Dissipation (Note 5)
Thermal Resistance Junction to Ambient Air (Note 5)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
350
357
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Reverse Current (Note 6)
Total Capacitance
Reverse Recovery Time
Notes:
Symbol
V
(BR)R
V
F
I
R
C
T
t
rr
Min
300
⎯
⎯
Max
⎯
0.87
1.0
100
5.0
50
Unit
V
V
nA
µA
pF
ns
⎯
⎯
Test Condition
I
R
= 100µA
I
F
= 20mA
I
F
= 100mA
V
R
= 240V
V
R
= 240V, T
J
= +150°C
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 30mA,
I
rr
= 3.0mA, R
L
= 100Ω
5. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
6. Short duration pulse test used to minimize self-heating effect.
500
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
1,000
P
D
, POWER DISSIPATION (mW)
400
100
300
10
200
1.0
100
0.1
0
0.01
0
1,600
2,000
400
800
1,200
V
F
, INSTANTANEOUS FORWARD VOLTAGE (mV)
Figure 2 Typical Forward Characteristics, Per Element
0
120
160
40
80
200
T
A
, AMBIENT TEMPERATURE (ºC)
Figure 1 Power Derating Curve, Total Package
MMBD2004S
Document number: DS30281 Rev. 12 - 2
2 of 4
www.diodes.com
August 2012
© Diodes Incorporated
MMBD2004S
1,000
1.1
C
T
, TOTAL CAPACITANCE (pF)
100
1.0
10
1.0
0.9
0.1
0.8
0.01
0.001
0
100
150
300 350
50
200 250
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Figure 3 Typical Reverse Characteristics, Per Element
0.7
0.01
100
0.1
10
1.0
V
R
, DC REVERSE VOLTAGE (V)
Figure 4 Total Capacitance vs. Reverse Voltage
Per Element
Package Outline Dimensions
A
B C
H
K
D
J
F
G
L
M
K1
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03 0.915
F
0.45
0.60 0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013 0.10
0.05
K
0.903 1.10
1.00
K1
-
-
0.400
L
0.45
0.61
0.55
M
0.085 0.18
0.11
0°
8°
-
α
All Dimensions in mm
Suggested Pad Layout
Y
Z
C
Dimensions Value (in mm)
Z
2.9
X
0.8
Y
0.9
2.0
C
1.35
E
X
E
MMBD2004S
Document number: DS30281 Rev. 12 - 2
3 of 4
www.diodes.com
August 2012
© Diodes Incorporated
MMBD2004S
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
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LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
MMBD2004S
Document number: DS30281 Rev. 12 - 2
4 of 4
www.diodes.com
August 2012
© Diodes Incorporated
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