DIM400GDM33-F000
Dual Switch IGBT Module
Replaces DS5616-2.1
DS5616-3 February 2014 (LN31315)
FEATURES
10µs Short Circuit Withstand
High Thermal Cycling Capability
Soft Punch Through Silicon
Isolated AlSiC Base with AlN Substrates
Lead Free construction
KEY PARAMETERS
V
CES
V
CE(sat)
* (typ)
I
C
(max)
I
C(PK)
(max)
3300V
2.8V
400A
800A
* Measured at the auxiliary terminals
1(E1)
2(C)
APPLICATIONS
High Reliability Inverters
Motor Controllers
Traction Drives
Choppers
7(E )
6(G )
1
1
10(C
2
)
9(G
2
)
The Powerline range of high power modules includes
half bridge, chopper, dual, single and bi-directional
switch configurations covering voltages from 1200V to
6500V and currents up to 2400A.
The DIM400GDM33-F000 is a single switch 3300V, n-
channel enhancement mode, insulated gate bipolar
transistor (IGBT) module. The IGBT has a wide
reverse bias safe operating area (RBSOA) plus 10μs
short circuit withstand. This device is optimised for
traction drives and other applications requiring high
thermal cycling capability.
The module incorporates an electrically isolated base
plate and low inductance construction enabling circuit
designers to optimise circuit layouts and utilise
grounded heat sinks for safety
.
5(C )
3(C1)
4(E2)
1
8(E
2
)
Fig. 1 Circuit configuration
ORDERING INFORMATION
Order As:
DIM400GDM33-F000
Outline type code: G
Note: When ordering, please use the complete part
number
(See Fig. 11 for further information)
Fig. 2 Package
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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DIM400GDM33-F000
ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device. In
extreme conditions, as with all semiconductors, this may include potentially hazardous rupture of the package.
Appropriate safety precautions should always be followed. Exposure to Absolute Maximum Ratings may affect
device reliability.
T
case
= 25°C unless stated otherwise
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
It
V
isol
*
Q
PD
2
Parameter
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Diode I t value
Isolation voltage – per module
Partial discharge – per module
2
Test Conditions
V
GE
= 0V
Max.
3300
±20
Units
V
V
A
A
kW
kA s
V
pC
2
T
case
= 90°C
1ms, T
case
= 115°C
T
case
= 25°C, T
j
= 150°C
V
R
= 0, t
p
= 10ms, T
j
= 125ºC
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
IEC1287, V
1
= 3500V, V
2
= 2600V, 50Hz RMS
400
800
5.2
80
6000
10
THERMAL AND MECHANICAL RATINGS
Internal insulation material:
Baseplate material:
Creepage distance:
Clearance:
CTI (Comparative Tracking Index):
AlN
AlSiC
33mm
20mm
>600
Symbol
R
th(j-c)
R
th(j-c)
R
th(c-h)
T
j
T
stg
Parameter
Thermal resistance – transistor
Thermal resistance – diode
Thermal resistance –
case to heatsink (per module)
Junction temperature
Diode
Storage temperature range
-
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Min
-
-
-
-
-
-40
-
-
-
Typ.
-
-
-
-
-
-
-
-
-
Max
24
48
8
125
125
125
5
2
10
Units
°C/kW
°C/kW
°C/kW
°C
°C
°C
Nm
Nm
Nm
Mounting – M6
Screw torque
Electrical connections – M4
Electrical connections – M8
2/8
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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DIM400GDM33-F000
ELECTRICAL CHARACTERISTICS
T
case
= 25°C unless stated otherwise.
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
†
†
Parameter
Collector cut-off current
Test Conditions
V
GE
= 0V, V
CE
= V
CES
V
GE
= 0V, V
CE
= V
CES
, T
case
= 125°C
Min
Typ
Max
2
30
1
Units
mA
mA
μA
V
V
V
A
A
V
V
nF
μC
nF
nH
μ
Gate leakage current
Gate threshold voltage
Collector-emitter
saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
V
GE
= ± 20V, V
CE
= 0V
I
C
= 40mA, V
GE
= V
CE
V
GE
= 15V, I
C
= 400A
V
GE
= 15V, I
C
= 400A, T
j
= 125°C
DC
t
p
= 1ms
I
F
= 400A
I
F
= 400A, T
j
= 125°C
5.5
6.5
2.8
3.6
400
800
2.9
3.0
72
10
1.1
25
260
T
j
= 125°C, V
CC
= 2500V
t
p
≤ 10μs, V
GE
≤ 15V
V
CE (max)
= V
CES
– L x dI/dt
IEC 60747-9
*
7.0
C
ies
Q
g
C
res
L
M
R
INT
Input capacitance
Gate charge
Reverse transfer capacitance
Module inductance
Internal transistor resistance
V
CE
= 25V, V
GE
= 0V, f = 1MHz
±15V
V
CE
= 25V, V
GE
= 0V, f = 1MHz
SC
Data
Short circuit current, I
SC
1850
A
Note:
† Measured at the power busbars, not the auxiliary terminals
* L is the circuit inductance + L
M
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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DIM400GDM33-F000
ELECTRICAL CHARACTERISTICS
T
case
= 25°C unless stated otherwise
Symbol
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
rr
I
rr
E
rec
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse recovery current
Diode reverse recovery energy
Test Conditions
I
C
= 400A
V
GE
= ±15V
V
CE
= 1800V
R
G(ON)
= 8.2
R
G(OFF)
= 5.6
C
ge
= 110nF
L
S
~ 100nH
I
F
= 400A
V
CE
= 1800V
dI
F
/dt = 2000A/μs
Min
Typ.
2100
210
520
1130
245
620
160
330
150
Max
Units
ns
ns
mJ
ns
ns
mJ
μC
A
mJ
T
case
= 125°C unless stated otherwise
Symbol
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse recovery current
Diode reverse recovery energy
Test Conditions
I
C
= 400A
V
GE
= ±15V
V
CE
= 1800V
R
G(ON)
= 8.2
R
G(OFF)
= 5.6
C
ge
= 110nF
L
S
~ 100nH
I
F
= 400A
V
CE
= 1800V
dI
F
/dt = 2000A/μs
Min
Typ.
2150
220
600
1160
285
870
300
400
300
Max
Units
ns
ns
mJ
ns
ns
mJ
μC
A
mJ
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
rr
I
rr
E
rec
4/8
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
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DIM400GDM33-F000
Fig. 3 Typical output characteristics
Fig. 4 Typical output characteristics
Fig. 5 Typical switching energy vs collector current
Fig. 6 Typical switching energy vs gate resistance
Caution:
This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures
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