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TN1037: Descriptionnano mounting instructions and heatsink; File Size1MB，24 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/

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TN1037 Overview

nano mounting instructions and heatsink

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TN1037

Technical note

SLLIMM™- nano mounting instructions and heatsink

By Agatino Minotti, Massimiliano Fiorito, Alessio Corsaro and Carmelo Parisi

Introduction

SLLIMM™-nano (Small Low-Losses Intelligent Molded Module) is a very compact, high

efficiency, dual-in-line intelligent power module with optional extra features for motor drive

applications. Thanks to its high electrical performance and very compact size, the fully

isolated SLLIMM-nano package (NDIP) is the ideal solution for applications requiring

reduced assembly space, without sacrificing thermal performance and reliability.

This technical note provides the main recommendations to properly handle, assemble and

rework the SLLIMM-nano devices in addition to some guidelines to improve its thermal

management. Some basic mounting instructions are suggested either to limit thermal and

mechanical stresses or assure the best thermal conduction and electrical insulation.

Figure 1. SLLIMM-nano images

Pin 26

Pin 16

Pin 1

Pin 17

AM17195v1

August 2013

DocID024655 Rev 3

1/24

www.st.com

Contents

TN1037

Contents

Heatsink mounting information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1

1.2

1.3

Main specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Thermal conductive media . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Safe distances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Cooling techniques and heatsink mounting proposals . . . . . . . . . . . . 7

2.1

2.2

2.3

2.4

2.5

Copper plate on the PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Heatsink pasted on the package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Heatsink bonded on the PCB by mounting screws . . . . . . . . . . . . . . . . . . 9

Heatsink bonded on the package by plastic screws . . . . . . . . . . . . . . . . . 10

Al-plate heatsink bonded on the PCB by mounting screws . . . . . . . . . . . .11

General handling precautions and storage notices . . . . . . . . . . . . . . . 13

3.1

3.2

3.3

3.4

3.5

Transportation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Electrical damage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Packaging specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

4.1

4.2

4.3

4.4

Selective wave soldering of SLLIMM-nano . . . . . . . . . . . . . . . . . . . . . . . 17

Other soldering techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Pin-in-paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Heatsink mounting by reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5.1

5.2

5.3

5.4

Device removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Site redressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Reassembly and reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Coating of assembled PCBs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

2/24

DocID024655 Rev 3

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