The ECG006F is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG006F typically provides
15 dB of gain, +32 dBm Output IP3, and +15.5 dBm
P1dB.
The ECG006F consists of a Darlington-pair amplifier
using the high reliability InGaP/GaAs HBT process
technology and only requires DC-blocking capacitors, a
bias resistor, and an inductive RF choke for operation.
The device is ideal for wireless applications and is
available in low-cost, surface-mountable plastic lead-
free/RoHS-compliant SOT-363 packages. All devices
are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied
to various current and next generation wireless
technologies such as GPRS, GSM, CDMA, and W-
CDMA. In addition, the ECG006F will work for other
various applications within the DC to 4.5 GHz frequency
range such as CATV and mobile wireless.
Functional Diagram
GND
1
6
RF OUT
GND
2
5
GND
RF IN
3
4
GND
Function
Input
Output/Bias
Ground
Pin No.
3
6
1, 2, 4, 5
Applications
Mobile Infrastructure
CATV / FTTX
WLAN / ISM
RFID
WiMAX / WiBro
Specifications
(1)
Parameter
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3
(2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3
(2)
Noise Figure
Device Voltage
Device Current
Typical Performance
(1)
Units
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
Min
DC
Typ
1000
15.5
+15.5
+32
2000
15
14
14
+15
+32
4.0
3.9
45
Max
4500
Parameter
Frequency
S21
S11
S22
Output P1dB
Output IP3
(2)
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
500
15.6
-15
-13
+15.8
+32
3.7
Typical
900
15.5
-16.5
-14
+15.4
+32
3.7
1900
14.8
-14
-13.5
+15
+30
3.7
2140
14.7
-14
-13.5
+15
+30
3.7
13.8
17.2
+12
3.5
4.3
Not Recommended for
New Designs
Recommended Replacement
Part: TQP369181
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +5 V, Rbias = 24.3
,
50
System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Rating
Parameter
Storage Temperature
Device Current
RF Input Power (continuous)
Thermal Resistance, Rth
For 10
6
hours MTTF
Rating
-55 to +150
C
150 mA
+12 dBm
233
C/W
+160
C
Ordering Information
Part No.
ECG006F-G
Description
InGaP HBT Gain Block
(lead-free/RoHS-compliant SOT-363 package)
Junction Temperature
Junction Temperature for >10
6
hours MTTF
Standard T/R size = 3000 pieces on a 7” reel.
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
Phone +1-503-615-9000
FAX: +1-503-615-8900
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Page 1 of 4 March 2012
ECG006F
InGaP HBT Gain Block
Typical Device Data
Supply Bias = +5 V, R
bias
= 24.3
,
I
cc
= 45 mA
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
15.7
-16
-14
+15.8
+31
3.8
500
15.6
-15
-13
+15.4
+31.5
3.7
900
15.5
-16.5
-14
+15.2
+32
3.6
1900
14.8
-14
-13.5
+15.0
+30
3.6
2140
14.7
-14
-13.5
+14.9
+30
3.6
2400
14.5
-13
-13
+14.6
+29.6
3.6
3500
13.9
-12
-12
+14
4500
13.0
-10.5
-9.5
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24.3
,
Icc = 45 mA typical, 50
System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
18
16
S11, S22 (dB)
Gain
S11, S22 vs. Frequency
0
-5
-10
-15
-20
S11
Icc (mA)
Vde vs. Icc
90
80
70
60
50
40
30
20
10
0
3.00
14
12
10
+25C
8
500
1000
-40C
+85C
S22
+25C
-25
1500
2000
Frequency (MHz)
2500
3000
0
1
2
3
4
Frequency (GHz)
5
6
3.20
3.40
3.60
3.80
4.00
4.20
4.40
Vde (V)
OIP3 vs. Frequency
35
30
OIP3 (dBm)
Noise Figure vs. Frequency
4
3.5
NF (dB)
P1dB vs. Frequency
18
16
P1dB (dBm)
14
12
10
25
20
+25°C
15
500
1000
-40°C
+85°C
2500
3000
3
2.5
2
500
+25°C
1000
1500
2000
8
500
1000
-40°C
+85°C
2500
3000
1500
2000
Frequency (MHz)
Frequency (MHz)
1500
2000
Frequency (MHz)
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
Phone +1-503-615-9000
FAX: +1-503-615-8900
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Page 2 of 4 March 2012
ECG006F
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 45 mA
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
ECG006
C1
Blocking
Capacitor
C2
Blocking
Capacitor
RF OUT
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018
F
chip capacitor
Do Not Place
24.3 1% tolerance
Size
0603
0603
0603
0805
Recommended Bias Resistor Values
Supply
R1 value
Size
Voltage
5V
24.4 ohms
0805
6V
46.7 ohms
0805
8V
91 ohms
1210
9V
113 ohms
1210
10 V
136 ohms
2010
12 V
180 ohms
2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
Typical Device S-Parameters
S-Parameters (V
device
= +3.9 V, I
CC
= 45 mA, T = 25C, calibrated to device leads)
Freq (MHz)
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
-16.22
-14.87
-16.45
-16.41
-14.08
-12.50
-12.18
-11.70
-10.97
-10.24
-9.06
-8.32
-7.84
-0.52
-18.97
-51.46
-95.69
-118.65
-114.48
-126.96
-139.53
-158.51
178.62
161.58
150.77
140.56
15.96
15.43
15.31
15.17
15.01
14.48
14.14
13.94
13.57
13.03
12.33
11.60
10.95
178.32
165.77
151.31
137.15
123.39
112.93
100.74
88.52
75.28
62.14
51.12
42.08
33.72
-18.82
-18.87
-18.40
-18.07
-17.74
-17.16
-16.80
-16.16
-15.72
-15.50
-15.19
-15.22
-15.14
-0.82
1.49
1.44
0.35
-1.31
-2.57
-4.49
-8.66
-12.48
-19.07
-24.71
-28.00
-30.97
-14.16
-12.83
-14.19
-14.59
-13.52
-13.05
-12.19
-11.93
-11.00
-9.10
-7.50
-6.87
-6.78
-2.06
-24.91
-55.98
-93.37
-120.99
-122.53
-138.80
-159.41
174.63
151.63
139.14
136.14
137.51
Device S-parameters are available for download from the website at: http://www.TriQuint.com
Specifications and information are subject to change without notice
TriQuint Semiconductor, Inc
Phone +1-503-615-9000
FAX: +1-503-615-8900
e-mail: info-sales@tqs.com
Web site: www.TriQuint.com
Page 3 of 4 March 2012
ECG006F
InGaP HBT Gain Block
Mechanical Information
This This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible
with both lead-free (maximum 260
C
reflow temperature) and leaded (maximum 245
C
reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a two-digit
numeric lot code (shown as “XX”) followed with a “7”
designator on the top surface of the package.
XX7
ESD / MSL Information
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260
C
convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this device.
Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the part to
ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a heatsink.
Ensure that the ground / thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the region where
the board contacts the heatsink.
5. RF trace width depends upon the PC board material and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
Specifications and information are subject to change without notice
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