5962-9951501QPX datasheet, PDF

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5962-9951501QPX: DescriptionOperational Amplifier, 1 Func, 3000uV Offset-Max, CDIP8, DIP-8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size3MB，999 Pages; ManufacturerMicross; Websitehttps://www.micross.com

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5962-9951501QPX Overview

Operational Amplifier, 1 Func, 3000uV Offset-Max, CDIP8, DIP-8

5962-9951501QPX Parametric

Parameter Name	Attribute value
Objectid	7360839775
package instruction	DIP,
Reach Compliance Code	compliant
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum average bias current (IIB)	0.075 µA
Maximum bias current (IIB) at 25C	0.075 µA
Minimum Common Mode Rejection Ratio	80 dB
Nominal Common Mode Rejection Ratio	80 dB
frequency compensation	YES
Maximum input offset current (IIO)	0.01 µA
Maximum input offset voltage	3000 µV
JESD-30 code	R-GDIP-T8
low-bias	NO
low-dissonance	NO
micropower	YES
Negative supply voltage upper limit	-22 V
Nominal Negative Supply Voltage (Vsup)	-20 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
power	NO
Programmable power	NO
Filter level	MIL-PRF-38535 Class Q
minimum slew rate	0.3 V/us
Maximum slew rate	3 mA
Supply voltage upper limit	22 V
Nominal supply voltage (Vsup)	20 V
surface mount	NO
Temperature level	MILITARY
Terminal form	THROUGH-HOLE
Terminal location	DUAL
total dose	100k Rad(Si) V
Minimum voltage gain	10000

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NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103BG

16 OCTOBER 2020

SUPERSEDING

MIL-HDBK-103BF

11 MARCH 2020

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

DISTRIBUTION STATEMENT A.

Approved for public release.

FSC 5962

Distribution is unlimited.

MIL-HDBK-103BG

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

APPENDIX

SECTION 1

Part I

Part II

Part III

Microcircuits ................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

760

Listed approved sources ............................................................................................................

992

Concluding material ...................................................................................................................

996

PAGE

SCOPE .......................................................................................................................................... 1

Purpose ...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................. 1

Drawing number ......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures .............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply ....................................................................................................... 2

Radiation hardness assurance (RHA) levels .............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing .......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users .......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................. 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing .................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

iii

MIL-HDBK-103BG

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources of

supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for those

devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request of

the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

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