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IRLR2703

Description
Logic-Level Gate Drive
File Size931KB,10 Pages
ManufacturerKersemi Electronic
Websitehttp://www.kersemi.com
Download Datasheet View All

IRLR2703 Overview

Logic-Level Gate Drive

IRLR/U2703
D-Pak
TO-252AA
I-Pak
TO-251AA
l
l
l
l
l
l
l
Logic-Level Gate Drive
Ultra Low On-Resistance
Surface Mount (IRLR2703)
Straight Lead (IRLU2703)
Advanced Process Technology
Fast Switching
Fully Avalanche Rated
Description
The D-PAK is designed for surface mounting
using vapor phase, infrared, or wave solde
ring techniques. The straight lead version
(IRFU series) is for through-hole mounting
applications. Power dissipation levels up to
1.5 watts are possible in typical surface
mount applications.
D
V
DSS
= 30V
G
S
R
DS(on)
= 0.045Ω
I
D
= 23A…
Absolute Maximum Ratings
Parameter
I
D
@ T
C
= 25°C
I
D
@ T
C
= 100°C
I
DM
P
D
@T
C
= 25°C
V
GS
E
AS
I
AR
E
AR
dv/dt
T
J
T
STG
Continuous Drain Current, V
GS
@ 10V
Continuous Drain Current, V
GS
@ 10V
Pulsed Drain Current

Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy‚
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
ƒ
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Max.
23
…
16
96
45
0.30
± 16
77
14
4.5
5.0
-55 to + 175
300 (1.6mm from case )
Units
A
W
W/°C
V
mJ
A
mJ
V/ns
°C
Thermal Resistance
Parameter
R
θJC
R
θJA
R
θJA
Junction-to-Case
Case-to-Ambient (PCB mount)**
Junction-to-Ambient
Typ.
–––
–––
–––
Max.
3.3
50
110
Units
°C/W
2014-8-26
1
www.kersemi.com
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