EEWORLDEEWORLDEEWORLD

Part Number

Search

APM2600-P29_13

Description
Low Noise and High OIP3 Medium Power Amplifier Module
File Size724KB,5 Pages
ManufacturerASB [Advanced Semiconductor Business Inc.]
Download Datasheet View All

APM2600-P29_13 Overview

Low Noise and High OIP3 Medium Power Amplifier Module

plerow
TM
APM2600-P29
Low Noise & High OIP3
Medium Power Amplifier Module
Features
·
S
21
= 28.7 dB @ 2500 MHz
= 27.3 dB @ 2700 MHz
·
NF fo 2.5 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3 @ Low Current
Description
The plerow
TM
APM-Series is an internally matched
amplifier mini-module for such application band in
SMD package with the output P1dB of 29 dBm. It is
compactly designed for low current consumption and
high OIP3. Integrating all the components for biasing
and matching within the module enhances production
yield and throughput as well. It passes through the
stringent DC, RF, and reliability tests. Not sample test
but 100% quality control test is made before packing.
C
C
C
o
o
o
u
u
u
pl
pl
pl
er
er
er
C
o
o
u
u
pl
pl
er
Specifications (in Production)
Typ. @ T = 25C, V
s
= 5 V, Freq. = 2600 MHz, Z
o.sys
= 50 ohm
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
(1)
Unit
MHz
dB
dB
dB
dBm
dB
dBm
sec
mA
V
dBm
mm
Specifications
Min
2500
27
28
0.7
2.5
44
47
-18 / -12
28
29
-
460
5
50
C.W 23 ~ 25 (before fail)
Surface Mount Type, 13Wx13Lx3.8H
1
500
0.8
2.6
Typ
Max
2700
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
S11 / S22
(2)
Output P1dB
Switching Time
(3)
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
Operating temperature is -40C to +85C.
1) OIP3 is measured with two tones at an output power of 15 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V
S
.
Outline Drawing (Unit: mm)
plerow
APM2600-P29
ASB Inc.
(Top View)
Solder Stencil Area
(Bottom View)
Pin Number
3
8
10
Others
Function
RF In
RF Out
Vs
Ground
(Side View)
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
Ø
0.3 plated thru holes to ground plane
2 x
Ø
2.0 plated thru holes to screw on heat sinker
(Recommended Footprint)
1/5
www.asb.co.kr
February 2009

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1064  1210  166  345  2121  22  25  4  7  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号