REVISIONS
LTR
A
B
C
D
DESCRIPTION
Changes in accordance with NOR 5962-R251-94.
Add case outlines T, U, Y, and Z.
Update drawing boilerplate.
Add device type 02, Add paragraph 1.5 and footnote 2/. Table I add
footnote 1/. Table I add footnote 2/ for enhanced low dose rate
effects. Add paragraph 3.2.3 for Radiation exposure circuit. Update
paragraph 4.3.5 for Rad Hard devices.
Add RHA levels P and L to device type 02 in paragraphs 1.3,
4.3.5 (table), table I, and SMD bulletin. -gz
Added footnote 1 to table II, under group C end-point electricals.
Updated drawing paragraphs. -sld
Figure 1, Case outline X; Changed dimension from "E1" to "E" and the
dimension from "E2" to "E1". Updated drawing paragraphs. -sld
Updated to current RHA format. Paragraph 1.3: correct max input
voltage range (V
IN
) from “+50” to “+80” V. Corrections throughout.
-gc
DATE (YR-MO-DA)
94-07-25
98-02-23
04-07-28
07-04-03
APPROVED
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
Robert M. Heber
E
F
G
07-07-02
09-09-08
12-06-01
17-10-03
Robert M. Heber
Charles F. Saffle
Charles F. Saffle
Charles F. Saffle
H
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
H
15
H
16
H
17
H
18
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Michael Jones
H
19
H
20
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
10
H
11
H
12
H
13
H
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, LINEAR, 12 VOLT,
DUAL CHANNEL, DC-DC CONVERTER
DRAWING APPROVAL DATE
94-05-26
REVISION LEVEL
H
SIZE
A
SHEET
CAGE CODE
67268
1 of
20
5962-93192
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
5962-E596-17
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962
Federal
stock class
designator
\
R
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels
and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
Generic number
MFL2812D/883
SMFL2812D
Circuit function
DC-DC converter, 60 W,
±12
V outputs
DC-DC converter, 60 W,
±12
V outputs
93192
02
Device
type
(see 1.2.2)
H
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
A
Lead
finish
(see 1.2.5)
/
1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-93192
SHEET
H
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
T
U
X
Y
Z
Descriptive designator
See figure 1
See figure 1
See figure 1
See figure 1
See figure 1
Terminals
12
12
12
12
12
Package style
Tabbed flange mount, lead formed up
Flange mount, lead formed down
Flange mount, short lead
Tabbed flange mount, short lead
Tabbed flange mount, lead formed down
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Input voltage range (V
IN
) 2/ .......................................................................
Power dissipation (P
D
):
Device types 01 and 02 (non-RHA) ......................................................
Device type 02 (RHA levels P, L, and R) ...............................................
Lead soldering temperature (10 seconds) ................................................
Storage temperature range .......................................................................
1.4 Recommended operating conditions.
Input voltage range (V
IN
) ...........................................................................
Output power ............................................................................................
Case operating temperature range (T
C
) ....................................................
1.5 Radiation features. 3/ 4/
Device type 02:
Maximum total dose available (dose rate = 50 - 300 rad(Si)/s): ...............
Maximum total dose available (dose rate ≤ 10 mrad(Si)/s): ......................
Single event phenomenon (SEP) effective linear energy transfer (LET):
No SEL, SEB, SEGR, SEFI ...................................................................
SEU .......................................................................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
100 krad(Si) 5/
100 krad(Si) 5/
< 86 MeV-cm
2
/mg 6/
< 86 MeV-cm
2
/mg 7/
+16 V dc to +40 V dc
≤
60 W
-55°C to +125°C
-0.5 V dc to +80 V dc
16 W
18 W
+300°C
-65°C to +150°C
1/
2/
3/
4/
5/
6/
7/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Input voltage transients up to
80 volts are allowed for no more than 50 milliseconds. Extended operation at the.. maximum levels may degrade
performance and affect reliability.
An undervoltage lockout circuit shuts the unit off when the input voltage drops to approximately 12 volts. Operation of the
unit between 12 volts and 16 volts is nondestructive. At reduced output power, regulation may be maintained but
performance is not guaranteed.
See 4.3.5 for the manufacturer’s radiation hardness assurance analysis and testing.
Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. These device
types have not been characterized for displacement damage.
A representative device was initially High Dose Rate (HDR) tested using condition A of method 1019 of MIL-STD-883 to 150
krad(Si) to ensure RHA designator level “R” (100 krad(Si)). A representative device has also been Low Dose Rate (LDR)
tested using condition D of method 1019 of MIL-STD-883 to 100 krad(Si). A representative device will be re-tested after
design or process changes that can affect RHA response of this device.
Single event testing was performed on a representative device to 86 MeV-cm
2
/mg with no latch-up, burn-out, functional
interrupts, or gate ruptures exhibited.
Single event upsets (transient voltages) were exhibited to the limit specified. See table IB.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-93192
SHEET
H
3
DSCC FORM 2234
APR 97
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification for
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM F1192
- Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by
Heavy Ion Irradiation of Semiconductor Devices.
(Copies of these documents are available online at
https://www.astm.org/)
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table IA and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-93192
SHEET
H
4
DSCC FORM 2234
APR 97
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime-VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
5962-93192
SHEET
H
5
DSCC FORM 2234
APR 97
ADI Reference Circuit
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