TI201209 (0805) Series
SMD MULTILAYER FERRITE CHIP BEADS (HIGH CURRENT)
Rev. A
A. Electrical Specifications:
P/N
TI201209B070
TI201209G050
TI201209G070
TI201209G300
TI201209G600
TI201209G800
TI201209G121
TI201209G151
TI201209G221
TI201209G301
TI201209G601
TI201209U070
TI201209U100
TI201209U110
TI201209U150
TI201209U170
TI201209U200
TI201209U260
TI201209U300
TI201209U310
TI201209U400
TI201209U470
TI201209U600
TI201209U700
TI201209U800
TI201209U101
TI201209U121
TI201209U151
TI201209U181
TI201209U221
TI201209U301
TI201209U471
TI201209U601
TI201209U102
TI201209Z110
TI201209Z300
TI201209Z600
TI201209Z800
TI201209Z121
TI201209Z181
TI201209Z221
TI201209Z301
TI201209Z601
TI201209Z102
Impedance (Ω) ±25% @100MHz
7
5
7
30
60
80
120
150
220
300
600
7
10
11
15
17
20
26
30
31
40
47
60
70
80
100
120
150
180
220
300
470
600
1000
11
30
60
80
120
180
220
300
600
1000
DCR Max.(Ω)
0.010
0.040
0.040
0.040
0.040
0.060
0.080
0.080
0.100
0.100
0.150
0.010
0.010
0.010
0.025
0.025
0.010
0.020
0.010
0.010
0.025
0.050
0.050
0.060
0.060
0.040
0.040
0.060
0.080
0.080
0.100
0.150
0.150
0.300
0.010
0.020
0.020
0.030
0.060
0.080
0.080
0.100
0.150
0.300
I rms. Max.(A)
6.0
2.2
2.2
3.0
3.0
3.0
3.0
3.0
2.5
2.5
2.0
6.0
6.0
6.0
3.0
4.0
6.0
5.0
6.0
6.0
4.0
3.0
3.0
3.0
3.0
4.0
4.0
3.0
3.0
3.0
2.5
2.0
2.0
1.0
6.0
5.0
5.0
5.0
3.0
3.0
3.0
2.0
2.0
1.0
B. Part Number Key:
TI
20
12
09
Y
XXX
IMPEDANCE VALUE
MATERIAL CODE: L, U, Z, B or G
DIMENSIONS:
LENGTH (a) x WIDTH (b) x THICKNESS (c)
FAMILY: TI
C. Dimensions: mm (Inch)
Series
TI201209(0805 )
Tol.
a
2.0
( 0.079)
± 0.2
(0.008 )
b
1.2
( 0.047)
± 0.2
(0.008 )
c
0.9
(0.035)
± 0.2
(0.008 )
d
0.5
( 0.020)
± 0.3
(0.012 )
e
3.20
(0.126)
Typ.
f
1.50
(0.059)
Typ.
g
0.60
(0.024)
Typ.
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®
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667 E. Cochran St., Simi Valley, CA 93065
Phone: 1-805-522-9998, Fax: 1-805-522-9989
TI201209 (0805) Series
SMD MULTILAYER FERRITE CHIP BEADS (HIGH CURRENT)
Rev. A
D. Materials:
ITEM
Initial Permeability (µiac):
Maximum Permeability (µm):
Saturation Flux Density at 10 Oe:
Curie Temperature(Tc):
Volume Resistivity (ρ):
Temperature Coefficient:
Density:
a.
b.
c.
d.
e.
f.
UNIT
----
----
Gauss
°C
Ω-m
1/10000°C
g/cm³
L
25
125
2000
>200
100000
10
4.8
B
45
125
2000
>200
100000
10
4.8
Material Code
G
110
250
1700
>130
100000
13
4.8
U
200
450
1400
>100
100000
5
4.8
Z
500
900
1500
>130
100000
12
4.8
E. Impedance Characteristics of Materials:
Z Material is for applications whose blocking regions are near 100 MHz.
L Material, an improvement of B Material has sharp impedance characteristic at high frequency.
G Material is for application whose signal frequency is far from the cut off region. Suitable for application requires low
insertion loss at high frequency.
Different materials are available for different application range.
With one material, higher impedance has sharper characteristics.
Please confirm the signal wave form to choose suitable products.
F. General Information:
TI201209-yxxx, “TI” = Type, “20” = Length, “12” = Width, “09” = Thickness, “y” = Material, “xxx”= Impedance.
Tolerance: ±25%
Small and lightweight surface mounting type
High-density packaging with a pitch of 2.54 mm (0.1 inch) max. is possible. This series requires less space and
have greater EMI suppression effects.
5. Excellent in physical properties, such as terminal strength, flexure strength, soldering resistance and solder-ability.
6. Applicable to both flow and IR reflow soldering.
7. High impedance covers wide frequency ranges.
8. TI series can be used in high current circuits due to its low DC resistance.
9. Operating temperature: -40°C to +125ºC
10. Impedance and Current range: From 5
Ω
(2200 mA) to 1000
Ω
(1000 mA)
11. Unspecified values available on request.
12. MSL: Level 1.
1.
2.
3.
4.
G. Applications:
1.
2.
3.
4.
5.
Game Consoles
Set Top Boxes
Cables Modems
Computers
Mobile Communication Devices (Cell Phones, Radios, etc.)
Frontier Electronics Corp.
®
http://www.frontierusa.com
Page
2
of
2
667 E. Cochran St., Simi Valley, CA 93065
Phone: 1-805-522-9998, Fax: 1-805-522-9989
Analog electronics
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