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S2010CPG1182F30

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 11800ohm, 150V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size122KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance
Related ProductsFound9parts with similar functions to S2010CPG1182F30
Download Datasheet Parametric View All

S2010CPG1182F30 Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 11800ohm, 150V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

S2010CPG1182F30 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerState of the Art Inc.
package instructionSMT, 2010
Reach Compliance Codecompli
ECCN codeEAR99
structureChi
JESD-609 codee4
Manufacturer's serial number2010
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.71 mm
Package length5.13 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.38 mm
method of packingBULK
Rated power dissipation(P)1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance11800 Ω
Resistor typeFIXED RESISTOR
series2010(STD)-THICKFILM
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au)
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage150 V
Base Number Matches1
2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08

S2010CPG1182F30 Similar Products

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