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341800F00000G

Description
LOW PROFILE COPPER HEAT SINKS IDEAL FOR PCI AND AGP CHIP SETS
File Size484KB,2 Pages
ManufacturerAavid Thermalloy
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341800F00000G Overview

LOW PROFILE COPPER HEAT SINKS IDEAL FOR PCI AND AGP CHIP SETS

Thin-Fin™ Heat Sinks
For computers and custom applications
LOW PROFILE COPPER HEAT SINKS
IDEAL FOR PCI AND AGP CHIP SETS
When space is at a premium, Aavid’s Thin-fin heat sinks
reduce package case temperature by as much as 20ºC.
These flexible, copper spreaders attach to the electronic
package using pre-applied adhesive, providing an off-the-
shelf solution for PCI and AGP chip sets. A laminated
dielectric coating prevents shorting, making the Thin-Fin
ideal for BGA devices and multimedia applications.
FEATURES:
• Offer significant cooling with limited headroom
• Pre-applied adhesive for rapid assembly
• Dielectric coating prevents shorting
• Fits many IC package styles
APPLICATIONS:
• Graphics Processors
• FPGA’s
• Embedded Processors
• DSP’s
• Any device using a BGA, PGA,
or a QFP package
ORDERING INFORMATION:
Part Number
341600F00000G
341700F00000G
341800F00000G
341900F00000G*
342000F00000G
342100F00000G
“A”
50.8 (2.00)
76.2 (3.00)
76.2 (3.00)
76.2 (3.00)
101.6 (4.00)
101.6 (4.00)
“B”
12.7 (0.50)
12.7 (0.50)
19.1 (0.75)
25.4 (1.00)
25.4 (1.00)
38.1 (1.50)
“C”
12.7 (0.50)
12.7 (0.50)
19.1 (0.75)
25.4 (1.00)
25.4 (1.00)
38.1 (1.50)
0.0015 in. Black PVF
0.007 in. RA Copper
0.0015 in. Black PVF
B
A
C
Folding Scores
* Recommended for use in cooling microprocessor chip sets, such as PCI and AGP.
Notes: Dimensions are in mm (inches) Contact our Applications Engineering Department
for custom configurations
Release Liner
0.002 in. Thermattach PSA
FOR MORE INFORMATION, VISIT OUR WEB SITE:
WWW.AAVIDTHERMALLOY.COM
TEL:
(603) 224-9988

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