5962F9568701V9X datasheet, PDF

Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> 5962F9568701V9X

5962F9568701V9X: DescriptionOP-AMP, UUC8, 0.068 X 0.055 INCH, 0.021 INCH HEIGHT, DIE-8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size3MB，939 Pages; ManufacturerIntersil ( Renesas ); Websitehttp://www.intersil.com/cda/home/

Download Datasheet Parametric View All

5962F9568701V9X Overview

OP-AMP, UUC8, 0.068 X 0.055 INCH, 0.021 INCH HEIGHT, DIE-8

5962F9568701V9X Parametric

Parameter Name	Attribute value
Objectid	2081049712
Parts packaging code	DIE
package instruction	DIE,
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Amplifier type	OPERATIONAL AMPLIFIER
JESD-30 code	R-XUUC-N8
Nominal Negative Supply Voltage (Vsup)	-3 V
Number of functions	1
Number of terminals	8
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Certification status	Not Qualified
Filter level	MIL-PRF-38535 Class V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal location	UPPER
total dose	300k Rad(Si) V

Preview

Download Datasheet

View All

NOT MEASUREMENT

SENSITIVE

MIL-HDBK-103AP

6 MARCH 2014

SUPERSEDING

MIL-HDBK-103AN

12 SEPTEMBER 2013

DEPARTMENT OF DEFENSE

HANDBOOK

LIST OF STANDARD MICROCIRCUIT DRAWINGS

This handbook is for guidance only. Do not cite this document

as a requirement.

AMSC N/A

FSC 5962

MIL-HDBK-103AP

CONTENTS

PARAGRAPH

1.1

1.2

1.2.1

1.2.2

1.2.3

1.2.4

4.1

4.2

4.3

4.4

4.5

4.6

5.1

5.2

6.1

6.1.1

6.1.2

6.2

7.1

7.2

TABLE 1

SECTION 1

Part I

Part II

Part III

PAGE

SCOPE .......................................................................................................................................... 1

Purpose...................................................................................................................................... 1

Part or identifying number (PIN) ................................................................................................ 1

Drawing number......................................................................................................................... 1

Device class designator ............................................................................................................. 1

Case outline / lead finish ............................................................................................................ 2

Substitutability ............................................................................................................................ 2

APPLICABLE DOCUMENTS ......................................................................................................... 2

DEFINITIONS ................................................................................................................................ 2

REQUIREMENTS .......................................................................................................................... 2

Drawing requirements ................................................................................................................ 2

Preparation procedures ............................................................................................................. 2

Drawing effectivity and duration ................................................................................................. 2

Approved sources of supply....................................................................................................... 2

Radiation hardness assurance (RHA) levels ............................................................................. 2

Electrostatic discharge sensitivity (ESD) listing ......................................................................... 3

CONFIGURATION MANAGEMENT .............................................................................................. 3

Configuration management of SMDs ......................................................................................... 3

Record of users.......................................................................................................................... 3

DISTRIBUTION and REQUESTS .................................................................................................. 4

Distribution ................................................................................................................................. 4

Automatic distribution ................................................................................................................ 4

Electronic distribution ................................................................................................................. 4

Requests .................................................................................................................................... 4

NOTES .......................................................................................................................................... 4

Intended use .............................................................................................................................. 4

Subject item (key word) listing ................................................................................................... 4

Noun code descriptions ................................................................................................................. 5

Microcircuits................................................................................................................................... 12

Listed by SMD PIN .....................................................................................................................

Listed by generic PIN .................................................................................................................

714

Listed approved sources ............................................................................................................

932

Concluding material ...................................................................................................................

936

iii

MIL-HDBK-103AP

1.2.3 Case outline/lead finish. Case outline and lead finish are as described in each SMD. The lead finish indicated in the

section 1 Part I listing is the most readily available from the manufacturer listed for the part. The manufacturer is authorized to

supply other lead finishes than what is listed provided that further testing/qualification is performed by the manufacturer on the

other lead finish(es). The user needs to contact the manufacturer to determine the availability of other lead finishes not listed

herein.

1.2.4 Substitutability. Device-class-Q devices will replace device-class-M devices.

2. APPLICABLE DOCUMENTS This section is not applicable to the handbook.

3. DEFINITIONS This section is not applicable to the handbook.

4. REQUIREMENTS

4.1 Drawing requirements. SMD's will be prepared in accordance with ASME Y14.100 and DOD directives.

4.2 Preparation procedures. The procedures for the generation of an SMD are provided in MIL-HDBK-780.

4.3 Drawing effectivity and duration. SMD's and device class M one part - one part number SMDs which have become

inactive for new design are reflected in section 1, part 1 of the appendix of this document with an "I" in the status column.

4.4 Approved sources of supply. The approved sources of supply list in this handbook supersedes the approved sources

formerly listed in each individual SMD/DLA Land and Maritime Drawing. This handbook is the official list of approved sources

of supply for non-one part - one part number SMD PIN's and for device class M one part - one part number SMD PIN's. Device

classes B, S, Q, V, T, N (monolithic) and H, K, D, G, E (hybrid) one part - one part number SMD PIN's are listed for the

convenience of the users. Official listing for B, S, Q, V, T, N, H, K, D, G, and E levels are available in the applicable QML.

Manufacturers should notify DLA Land and Maritime-VA in writing if they no longer wish to be listed as an approved source of

supply for any device listed herein. This letter will be used by DSCC to remove the manufacturer from MIL-HDBK-103 for

those devices that the manufacturer specifies that he will no longer supply.

4.5 Radiation hardness assurance (RHA) levels. SMD devices which meet the RHA requirements of MIL-PRF-38535 or

MIL-PRF-38534 will be marked with the appropriate RHA designator M, D, P, L, R, F, G, or H replacing the dash (-) in the PIN

as indicated in the following example:

5962(M, D, P, L, R, F, G, or H)8999901EA

Only the highest RHA level for which the device is qualified will be listed in Section 1, Part I of the appendix of this document;

however, at the request of the customer, the manufacturer is authorized to supply any lower RHA level device. At the request

of the customer, the non-RHA PIN designated with a dash (-) may be supplied at the option of the manufacturer. The

manufacturer may also opt to submit a certificate of compliance to have the non-RHA PIN listed in addition to the RHA PIN in

Section 1, Part I of the appendix of this document.

Recommended Resources

μPC1230H2 audio IC circuit diagram

555 DC boost conversion circuit diagram

Tianjin ZT-2 hearing aid circuit

radio timing circuit

Fuse blown music alarm

Voltage reference using op amp

Samsung Display initialization SPI communication issues: Samsung's LCD driver uses SPI to initialize the controller when initializing LTV350. Its SPI is simulated by GPIO, and there is a SPI 'write' function --- Write_LDI_LTV350. There are several questions...; XX糖WL Embedded System

How to do aging test on circuit board: The power supply equipment in my company is damaged in batches within a year of use. The power supply is 9 volts and 0.6A, and it works continuously for 24 hours. I designed a linear power supply, and...; houn LED Zone

Serial port oscilloscope based on ZX-2 FPGA development board (I): [align=left][size=10.5000pt]This experiment[/size][size=10.5000pt]is a comprehensive[/size][size=10.5000pt]experiment of the[font=Calibri]ZX-2[/font][/size][size=10.5000pt]development board[/size][siz...; 小梅哥 FPGA/CPLD

About the development of fingerprint recognition device biokey 3.8: I use the URU4000B device and have downloaded the Biokey 3.8 standard SDK. I followed the steps in the CD to install the driver and registered the Biokey.ocx control. When I use VC to develop and read...; xuliqun Embedded System

[Share] The meaning of a good circuit ~~ an excellent man: [font=宋体][size=10.5pt][size=3]Many engineers have experienced this difficult process: the initial enthusiasm for work was worn away by one [u][b]design[/b][/u] problem after another, and the lack of g...; wanggq FPGA/CPLD

Yesterday I posted a thread and found that everyone didn't understand the significance of 2538 Zigbee running 6 lowpan, roll, and finally using CoAP. Let me explain: [i=s]This post was last edited by dan158185 on 2015-12-2 14:32[/i] [b][size=3]First[/size][/b] take a look at the basic picture: [size=3][b]Or go to [url=https://bbs.eeworld.com.cn/thread-478272-1-1.h...; dan158185 RF/Wirelessly

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components