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IC218-0804-002

Description
IC Socket, QFP80, 80 Contact(s), 1.6002mm Term Pitch, Solder
CategoryThe connector    socket   
File Size597KB,6 Pages
ManufacturerYamaichi Electronics Co., Ltd.
Websitehttp://www.yamaichi.com/
Download Datasheet Parametric View All

IC218-0804-002 Overview

IC Socket, QFP80, 80 Contact(s), 1.6002mm Term Pitch, Solder

IC218-0804-002 Parametric

Parameter NameAttribute value
Objectid1471272447
Reach Compliance Codeunknown
ECCN codeEAR99
body width1.268 inch
subject depth0.61 inch
body length1.504 inch
Contact to complete cooperationAU ON NI
Contact materialBE-CU
Contact styleSINGLE PRONG
Device slot typeIC SOCKET
Type of equipment usedQFP80
Dielectric withstand voltage700VAC V
Shell materialPOLYETHERIMIDE
Insulation resistance1000000000 Ω
Manufacturer's serial numberIC218
Plug contact pitch0.031 inch
Installation methodSTRAIGHT
Number of contacts80
Maximum operating temperature170 °C
Minimum operating temperature-40 °C
PCB contact patternSTAGGERED
Terminal pitch1.6002 mm
Termination typeSOLDER
SMT Devices
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
®
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Part Number (Details)
Mating Cycles:
1,000MΩ min. at 100V DC
for 1 minute (socket depended)
30mΩ max. at 10mA/20mV max.
–40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
10,000 insertions min.
IC51
Series No.
-
064
4
-
807
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As speci cations for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Materials and Finish
Housing: Polysulphone (PSF), glass- lled
Polyethersulphone (PES), glass- lled
Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC51 (Clamshell)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Current Rating:
Operating Temperature Range:
Mating Cycles:
Contact Force:
1,000MΩ min. at 500V DC
700V AC for 1 minute
30mΩ max. at 10mA/20mV max.
1A max.
–55°C to +170°C
25,000 insertions min.
50g to 150g per pin
0.635mm Pitch
Part Number (Details)
IC51
Series No.
-
100
4
-
827
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Series IC211 (Open Top)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Contact Force:
Mating Cycles:
1,000MΩ min. at 500V DC
500V AC for 1 minute
30mΩ max. at 10mA/20mV max.
–40°C to +170°C
20g to 80g per pin
10,000 insertions min.
0.635mm Pitch
Part Number (Details)
IC211
Series No.
-
132
4
-
002
*
-
*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Protection Key*
*
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
..
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
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