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Mount Chip Resistors, VSMP Z-Foil Technology Configuration)
Screen/Test Flow in Compliance with EEE-INST-002,
(Tables 2A and 3A, Film/Foil, Level 1) and MIL-PRF-55342
FEATURES
• Temperature coefficient of resistance (TCR):
0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Tolerance: to ±0.01%
• Power coefficient “∆R due to self heating”: 5 ppm at
rated power
• Power rating: to 400 mW at +70°C
• Load-life stability: to ±0.03% at 70°C, 2000 h at rated
power
• Resistance range: 10 Ω to 75 kΩ
• Bulk Metal
®
Foil resistors are not restricted to standard
values, we can supply specific “as required” values at
no extra cost or delivery (e.g. 1K2345 vs. 1K)
• Fast thermal stabilization <1 s
•
Electrostatic discharge (ESD) up to 25 000 V
• Short-time overload: ≤0.02%
• Non-inductive, non-capacitive design
• Rise time: 1 ns effectively no ringing
• Current noise: –42 dB
• Non-inductive: <0.08 μH
• Non-hot-spot design
• Terminal finish: tin/lead alloy
• Matched sets are available on request
• For prototype units, append a “U” to the model number
(example: 303134U). These units have all of the table
2A (page 4) 100% tests performed, with no destructive
qualification testing required (table 3A, page 4). For
more information, please contact
foil@vpgsensors.com
Top View
INTRODUCTION
The 303133 through to 303138 series is the first surface
mount device to provide high rated power, excellent
load-life stability along with extremely low TCR all in one
resistor.
One of the most important parameters influencing
stability is the temperature coefficient of resistance (TCR).
Although the TCR of foil resistors is considered extremely
low, this characteristic has been further refined over the
years. The 303133 through to 303138 series utilizes ultra
high-precision Bulk Metal
®
Z-Foil. The Z-Foil technology
provides a significant reduction of the resistive element’s
sensitivity to ambient temperature variations (TCR) and
to self-heating when power is applied (power coefficient).
Along with the inherently low PCR and TCR, Z-Foil
technology also provides remarkably improved load-life
stability, low noise and availability of tight tolerance.
The 303133 through to 303138 series has a full
wraparound termination which ensures safe handling
during the manufacturing process, as well as providing
stability during multiple thermal cyclings.
Our application engineering department is available to
advise and make recommendations.
Table 1 – Tolerance and TCR vs. Resistance
Value
(–55°C to +125°C, +25°C ref.)
RESISTANCE
VALUE
(Ω)
250 to 75K
100 to <250
50 to <100
25 to <50
10 to <25
TOLERANCE
(%)
±0.01
±0.05
±0.1
±0.25
±0.5
MAXIMUM TCR
(ppm/°C)
±3
±3
±4
±5
±5
Figure 1 – Power Derating Curve
Percent of Rated Power
100
75
50
25
0
–75
–55°C
+70°C
–50
–25
Ambient Temperature (°C)
0
+25
+50
+75 +100 +125 +150 +175
4188-EN
Rev 01-Oct-2020
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
1
303133, 303134, 303135, 303136, 303137, 303138
Figure 2 – Trimming to Values
(Conceptual Illustration)
Interloop
capacitance
reduction
in series
Mutual
inductance
reduction
due to change
in current
direction
Current path
before trimming
Current path after trimming
Figure 3 – Typical Resistance/Temperature
Curve
+500
TCR Values for Different Temperature Ranges
+400
+300
Note
To acquire a precision resistance value, the Bulk Metal
®
Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked
areas are cut, producing progressively smaller increases in
resistance. This method reduces the effect of “hot spots” and
improves the long-term stability of Bulk Metal
®
Foil resistors.
Trimming process
removes this material
from shorting strip area
changing current path
and increasing
resistance
Foil shown in black, etched spaces in white
+100
R
0
R
(ppm)
–100
–200
–300
–500
+200
0.05 ppm/°C
–0.1 ppm/°C
–0.16 ppm/°C
–55
–25
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
+100
+125
–400
0
+25
+60 +75
Ambient Temperature (°C)
Note
The TCR values for <100 Ω are influenced by the termination
composition and result in deviation from this curve.
Table 2 – Dimensions and Land Pattern
in inches (millimeters)
Top View
L
Recommended Land Pattern
X
T
D
MODEL
(CHIP SIZE)
303133 (0603)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
303138 (2512)
L
±0.005 (0.13)
0.063 (1.60)
0.080 (2.03)
0.126 (3.20)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
W
±0.005 (0.13)
0.032 (0.81)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.23)
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
±0.005 (0.13)
0.011 (0.28)
0.015 (0.38)
0.020 (0.51)
0.020 (0.51)
0.025 (0.64)
0.032 (0.81)
Z
(1)
0.102 (2.59)
0.122 (3.10)
0.175 (4.45)
0.199 (5.05)
0.247 (6.27)
0.291 (7.39)
G
(1)
0.031 (0.78)
0.028 (0.71)
0.059 (1.50)
0.083 (2.11)
0.115 (2.92)
0.150 (3.81)
X
(1)
0.031 (0.78)
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.62)
0.127 (3.23)
W
G
Z
Footprint
Note
(1)
Land pattern dimensions are per IPC-7351A
Table 3 – Specifications
MODEL
(CHIP SIZE)
303133 (0603)
303134 (0805)
303135 (1206)
303136 (1506)
303137 (2010)
303138 (2512)
RATED POWER (mW)
at + 70 °C
50
100
150
200
300
400
MAX. WORKING VOLTAGE
(≤ √P ×
R
)
14 V
22 V
46 V
57 V
102 V
173 V
RESISTANCE RANGE
(Ω)
100 to 2K
10 to 5K
10 to 14K
10 to 16K
10 to 35K
10 to 75K
MAXIMUM WEIGHT
(mg)
4
6
12
13
27
40
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2
For any questions, contact
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4188-EN
Rev 01-Oct-2020
303133, 303134, 303135, 303136, 303137, 303138
Table 4 – Performances
TEST OR CONDITIONS
Thermal Shock,
100 x (–65°C to +150°C)
Low-Temperature Operation,
–65°C, 45 min at rated power
Short-Time Overload,
6.25 x rated power, 5 s
High-Temperature Exposure,
+150°C, 100 h
Resistance to Soldering Heat
Moisture Resistance
Load-Life Stability
+70°C for 2,000 h at rated power
+70°C for 10,000 h at rated power
Note
(1)
As shown +0.01 Ω to allow for measurement errors at low values
MIL-PRF-55342
CHARACTERISTIC E ∆R LIMITS
±0.1%
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
TYPICAL
∆R LIMITS
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.01% (100 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.01% (100ppm)
MAXIMUM
∆R LIMITS
(1)
±0.01% (100 ppm)
±0.02% (200 ppm)
±0.02% (200 ppm)
±0.03% (300 ppm)
±0.02% (200 ppm)
±0.04% (400 ppm)
±0.03% (300 ppm)
±0.05% (500ppm)
Figure 4 – Recommended Mounting
1. IR and vapor phase reflow are recommended.
2. Avoid the use of cleaning agents that attack epoxy resins, which form part of the
resistor construction.
3. Vacuum pick up is recommended for handling.
4. If the use of a soldering iron becomes necessary, precautionary measures should be
taken to avoid any possible damage/overheating of the resistor.
* Recommendation: The solder fillet profile should be such as to avoid running over the
top metallization.
*
Model Number
Chip Size
Value Range
(Space Applications)
Rated Power at 70°C
303133
0603
100 Ω to 2 kΩ
50 mW
303134
0805
10 Ω to 5 kΩ
100 mW
303135
1206
10 Ω to 14 kΩ
150 mW
303136
1506
10 Ω to 16 kΩ
200 mW
303137
2010
10 Ω to 35 kΩ
300 mW
303138
2512
10 Ω to 75 kΩ
400 mW
Notes
1. Measurement error allowed for ∆R limits: 0.01 Ω.
2. An additional 54 sample units per lot which successfully pass 100% screening are to be used for destructive testing and are to be
kept on file at the plant of manufacture.
3. Lot definition (1 lot = 1 primary flowcard): Each value per chip size should be qualified individually. Contact Vishay Foil Resistors
application engineering for alternative lot definitions.
4. For prototype units, append a “U” to the model number (example: 303134U). These units have all of the table 2A 100% tests
performed, with no destructive qualification testing required.
4188-EN
Rev 01-Oct-2020
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
3
303133, 303134, 303135, 303136, 303137, 303138
Table 5 – EEE-INST-002 (Table 2A Film/Foil, Level 1) 100% Tests/Inspections
Pre-cap Visual Inspection
RC Record
Thermal Shock
Power Conditioning
RC Record
Final Inspection
Visual Inspection
Mechanical Inspection
Performed in production flow prior overcoating
In tolerance
25
×
(–65°C to +150°C)
70°C, 100 h, 1.5 rated power—not to exceed max. voltage
In tolerance ∆R = 0.05% for thermal shock and conditioning combined
5% PDA on ∆R and 10% PDA for final resistance for tolerance ≥0.1%;
5% PDA on ∆R for tolerance <0.1%
Materials, design, etc.
Physical dimensions, sample size: 3 units, zero failure
TABLE 6—EEE-INST-002 (TABLE 3A FILM/FOIL, LEVEL 1) DESTRUCTIVE TESTS
Group 2
Sample size: 3, zero failure
Solderability
Sample size: 10, zero failure—mounted on FR4
TCR
(–55°C/+25°C/+125°C)
Values
≥100 Ω
50 Ω to <100 Ω
10 Ω to <50 Ω
∆R = 0.02%
Low temperature storage
Group 3
–65°C no load dwell for 24 h ±4 h
+25°C ambient no load dwell for 2 h to 8 h
∆R = 0.015%
Low temperature operation
–65°C no load dwell for 1 h
rated power for 45 min
+25°C ambient no load dwell for 2 h to 8 h
Short time overload
∆R = 0.02%
6.25 x rated power, 5 s—no “I” limitation: not to exceed twice the max. voltage
∆R = 0.02%
Performed per MIL-PRF-55342 para. 4.8.8.1
∆R = 0.02%
2000 h, +70°C, rated power, 1.5 hours “on” and 0.5 hour “off” cycle
Performed per MIL-PRF-55342
Solder mounting integrity
Force applied: for 0630—1 kg, 30 s / for 0805, 1206, and 1506—2 kg, 30 s
For 2010, 2512: force applied: 3 kg, 30 s
Sample size: 5, zero failure—chips not mounted
Group 8
0603: 12 ppm/V; 0805: 5 ppm/V; 1206, 1506, 2010, 2512: 3 ppm/V
Voltage coefficient
Applicable resistors ≥1k
Performed per MIL-STD-202 method 309
Sample size: 5, zero failure—mounted on FR4
Group 9
∆R = 0.015%
High temperature exposure
Performed per MIL-PRF-55342
100 h at +150°C ±5°C
TCR Limits
±3 ppm/°C
±4 ppm/°C
±5 ppm/°C
Sample size: 9, zero failure—mounted on FR4
Group 4
Resistance to soldering
heat
Sample size: 12, zero failure—mounted on FR4
Group 6
Life
Sample size: 10, zero failure—mounted on FR4
Group 7B
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4
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4188-EN
Rev 01-Oct-2020
303133, 303134, 303135, 303136, 303137, 303138
Table 7 – Part Number Identification
Model #
Chip Size
Value Range
(Space Application)
Part Number:
303133
0603
100
to 2 kΩ
303134
0805
10 Ω to 5 kΩ
303135
1206
10 Ω to 14 kΩ
303136
1506
10 Ω to 16 kΩ
303137
2010
10 Ω to 35 kΩ
303138
2512
10 Ω to 75 kΩ
{Model} - {Value} - {Tolerance} - {Termination} - {Packaging}
Termination
Tin/lead
Resistance Value
100R to <250R
50R to <100R
10R to <25R
Example:
303135 - 10K025 - DBW
1206 chip size, 10.025 kΩ, 0.5%, tin/lead termination, waffle packaging
25R <50R
250R to 75K
Tolerance (Tightest)
0.01%/0.02%/0.05%/0.1%/0.25%/0.5%
0.05%/0.1%/0.25%/0.5%
0.1%/0.25%/0.5%
0.25%/0.5%
0.5%
Code
T/Q/A/B/C/D
A/B/C/D
B/C/D
C/D
D
Code
B
Packaging
Tape and reel
Waffle
Code
W
T
4188-EN
Rev 01-Oct-2020
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
5
Embedded System
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