KSMD24N08 / KSMU24N08
80V N-Channel MOSFET
Features
•
•
•
•
•
•
19.6A, 80V, R
DS(on)
= 0.06Ω @V
GS
= 10 V
Low gate charge ( typical 19 nC)
Low Crss ( typical 50 pF)
Fast switching
100% avalanche tested
Improved dv/dt capability
TO-252
TO-251
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Kersemi proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for low voltage applications such as automotive, high
efficiency switching for DC/DC converters, and DC motor
control.
D
!
"
G
!
! "
"
"
!
S
Absolute Maximum Ratings
Symbol
V
DSS
I
D
I
DM
V
GSS
E
AS
I
AR
E
AR
dv/dt
P
D
T
C
= 25°C unless otherwise noted
Parameter
Drain-Source Voltage
- Continuous (T
C
= 25°C)
Drain Current
- Continuous (T
C
= 100°C)
Drain Current
- Pulsed
(Note 1)
KSMD24N08 / KSMU24N08
80
19.6
12.4
78.4
±
25
(Note 2)
(Note 1)
(Note 1)
(Note 3)
Units
V
A
A
A
V
mJ
A
mJ
V/ns
W
W
W/°C
°C
°C
Gate-Source Voltage
Single Pulsed Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (T
A
= 25°C) *
Power Dissipation (T
C
= 25°C)
230
19.6
5.0
6.5
2.5
50
0.4
-55 to +150
300
T
J
, T
STG
T
L
- Derate above 25°C
Operating and Storage Temperature Range
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
Thermal Characteristics
Symbol
R
θJC
R
θJA
R
θJA
Parameter
Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient *
Thermal Resistance, Junction-to-Ambient
Typ
--
--
--
Max
2.5
50
110
Units
°C/W
°C/W
°C/W
* When mounted on the minimum pad size recommended (PCB Mount)
2014-7-18
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KSMD24N08 / KSMU24N08
Electrical Characteristics
Symbol
Parameter
T
C
= 25°C unless otherwise noted
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV
DSS
∆BV
DSS
/
∆T
J
I
DSS
I
GSSF
I
GSSR
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate-Body Leakage Current, Forward
Gate-Body Leakage Current, Reverse
V
GS
= 0 V, I
D
= 250
µA
I
D
= 250
µA,
Referenced to 25°C
V
DS
= 80 V, V
GS
= 0 V
V
DS
= 64 V, T
C
= 125°C
V
GS
= 25 V, V
DS
= 0 V
V
GS
= -25 V, V
DS
= 0 V
80
--
--
--
--
--
--
0.08
--
--
--
--
--
--
1
10
100
-100
V
V/°C
µA
µA
nA
nA
On Characteristics
V
GS(th)
R
DS(on)
g
FS
Gate Threshold Voltage
Static Drain-Source
On-Resistance
Forward Transconductance
V
DS
= V
GS
, I
D
= 250
µA
V
GS
= 10 V, I
D
= 9.8 A
V
DS
= 30 V, I
D
= 9.8 A
(Note 4)
2.0
--
--
--
0.048
11.5
4.0
0.06
--
V
Ω
S
Dynamic Characteristics
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
V
DS
= 25 V, V
GS
= 0 V,
f = 1.0 MHz
--
--
--
580
210
50
750
270
65
pF
pF
pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gs
Q
gd
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V
DS
= 64 V, I
D
= 24 A,
V
GS
= 10 V
(Note 4, 5)
V
DD
= 40 V, I
D
= 24 A,
R
G
= 25
Ω
(Note 4, 5)
--
--
--
--
--
--
--
10
105
30
35
19
4.2
9.6
30
220
70
80
25
--
--
ns
ns
ns
ns
nC
nC
nC
Drain-Source Diode Characteristics and Maximum Ratings
I
S
I
SM
V
SD
t
rr
Q
rr
Maximum Continuous Drain-Source Diode Forward Current
Maximum Pulsed Drain-Source Diode Forward Current
V
GS
= 0 V, I
S
= 19.6 A
Drain-Source Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
GS
= 0 V, I
S
= 24 A,
dI
F
/ dt = 100 A/µs
(Note 4)
--
--
--
--
--
--
--
--
63
130
19.6
78.4
1.5
--
--
A
A
V
ns
nC
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 0.82mH, I
AS
= 19.6A, V
DD
= 25V, R
G
= 25
Ω,
Starting T
J
= 25°C
3. I
SD
≤
24A, di/dt
≤
300A/µs, V
DD
≤
BV
DSS,
Starting T
J
= 25°C
4. Pulse Test : Pulse width
≤
300µs, Duty cycle
≤
2%
5. Essentially independent of operating temperature
2014-7-18
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KSMD24N08 / KSMU24N08
Typical Characteristics
10
1
I
D
, Drain Current [A]
I
D
, Drain Current [A]
V
GS
15.0 V
10.0 V
8.0 V
7.0 V
6.0 V
5.5 V
5.0 V
Bottom : 4.5 V
Top :
10
1
150℃
10
0
10
0
25℃
-55℃
※
Notes :
1. V
DS
= 30V
2. 250μ Pulse Test
s
※
Notes :
1. 250μ Pulse Test
s
2. T
C
= 25℃
10
-1
10
-1
10
0
10
1
10
-1
2
4
6
8
10
V
DS
, Drain-Source Voltage [V]
V
GS
, Gate-Source Voltage [V]
Figure 1. On-Region Characteristics
Figure 2. Transfer Characteristics
0.20
R
DS(on)
[
Ω
],
Drain-Source On-Resistance
0.16
I
DR
, Reverse Drain Current [A]
V
GS
= 10V
0.12
V
GS
= 20V
0.08
10
1
10
0
0.04
※
Note : T
J
= 25℃
150℃
25℃
※
Notes :
1. V
GS
= 0V
2. 250μ Pulse Test
s
0.00
0
20
40
60
80
100
10
-1
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
I
D
, Drain Current [A]
V
SD
, Source-Drain voltage [V]
Figure 3. On-Resistance Variation vs.
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current
and Temperature
1600
1400
C
iss
= C
gs
+ C
gd
(C
ds
= shorted)
C
oss
= C
ds
+ C
gd
C
rss
= C
gd
12
C
oss
10
V
DS
= 40V
V
DS
= 64V
V
GS
, Gate-Source Voltage [V]
1200
1000
800
600
400
200
0
-1
10
C
iss
※
Notes :
1. V
GS
= 0 V
2. f = 1 MHz
8
Capacitance [pF]
6
C
rss
4
2
※
Note : I
D
= 24A
0
10
0
10
1
0
2
4
6
8
10
12
14
16
18
20
V
DS
, Drain-Source Voltage [V]
Q
G
, Total Gate Charge [nC]
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
2014-7-18
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KSMD24N08 / KSMU24N08
Typical Characteristics
1.2
3.0
(Continued)
2.5
BV
DSS
, (Normalized)
Drain-Source Breakdown Voltage
R
DS(ON)
, (Normalized)
Drain-Source On-Resistance
1.1
2.0
1.0
1.5
1.0
0.9
※
Notes :
1. V
GS
= 0 V
A
2. I
D
= 250
μ
0.5
※
Notes :
1. V
GS
= 10 V
2. I
D
= 9.8 A
0.8
-100
-50
0
50
100
o
150
200
0.0
-100
-50
0
50
100
o
150
200
T
J
, Junction Temperature [ C]
T
J
, Junction Temperature [ C]
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On-Resistance Variation
vs. Temperature
20
Operation in This Area
is Limited by R
DS(on)
10
2
16
I
D
, Drain Current [A]
I
D
, Drain Current [A]
2
100
µ
s
1 ms
10
1
10
µ
s
12
10 ms
DC
8
10
0
※
Notes :
1. T
C
= 25 C
2. T
J
= 150 C
3. Single Pulse
o
o
4
10
-1
10
0
10
1
10
0
25
50
75
100
125
150
V
DS
, Drain-Source Voltage [V]
T
C
, Case Temperature [℃]
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
( t) , T h e r m a l R e s p o n s e
10
0
D = 0 .5
0 .2
0 .1
0 .0 5
※
N o te s :
1 . Z
θ
J C
( t) = 2 .5
℃
/W M a x .
2 . D u ty F a c to r , D = t
1
/t
2
3 . T
J M
- T
C
= P
D M
* Z
θ
J C
( t)
10
-1
0 .0 2
0 .0 1
s in g le p u ls e
P
DM
t
1
t
2
Z
θ
JC
10
-2
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
1
, S q u a r e W a v e P u ls e D u r a t io n [ s e c ]
Figure 11. Transient Thermal Response Curve
2014-7-18
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KSMD24N08 / KSMU24N08
Gate Charge Test Circuit & Waveform
50KΩ
12V
200nF
300nF
Same Type
as DUT
V
DS
V
GS
Q
g
10V
Q
gs
Q
gd
V
GS
DUT
3mA
Charge
Resistive Switching Test Circuit & Waveforms
V
DS
V
GS
R
G
R
L
V
DD
V
DS
90%
10V
DUT
V
GS
10%
t
d(on)
t
on
t
r
t
d(off)
t
off
t
f
Unclamped Inductive Switching Test Circuit & Waveforms
L
V
DS
I
D
R
G
DUT
t
p
BV
DSS
1
E
AS
= ---- L I
AS2
--------------------
2
BV
DSS
- V
DD
BV
DSS
I
AS
V
DD
V
DD
t
p
I
D
(t)
V
DS
(t)
Time
10V
2014-7-18
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