2113B10M00000BDX datasheet, PDF

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2113B10M00000BDX: DescriptionSine Output Oscillator,; CategoryPassive components oscillator; File Size449KB，20 Pages; ManufacturerVectron International, Inc.; Websitehttp://www.vectron.com/

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2113B10M00000BDX Overview

Sine Output Oscillator,

2113B10M00000BDX Parametric

Parameter Name	Attribute value
Maker	Vectron International, Inc.
package instruction	FLAT PACK, 24 PIN
Reach Compliance Code	compli
Ageing	1 PPM/FIRST YEAR
Frequency Adjustment - Mechanical	NO
frequency stability	1%
Installation features	SURFACE MOUNT
Nominal operating frequency	10 MHz
Maximum operating temperature	50 °C
Minimum operating temperature
Oscillator type	SINE
Output impedance	50 Ω
Output level	1.416 V
physical size	35.56mm x 25.91mm x 7.62mm
Maximum supply voltage	15.75 V
Minimum supply voltage	14.25 V
Nominal supply voltage	15 V
surface mount	YES
Base Number Matches	1

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REV

DESCRIPTION

CO-24284

DATE

11/5/14

PREP

HLW

APPD

Specification, Hybrid TCXO

MOUNT HOLLY SPRINGS, PA 17065

THE RECORD OF APPROVAL FOR THIS

DOCUMENT IS MAINTAINED ELECTRONICALLY

WITHIN THE ERP SYSTEM

CODE IDENT NO

Hi-Rel Standard

SIZE

DWG. NO.

REV

00136

DOC200103

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 20

VECTRON INTERNATIONAL PROPRIETARY

1.1

SCOPE

General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid TCXOs produced by Vectron International. Devices delivered to this

specification represent the standardized Parts, Materials and Processes (PMP) Program

developed, implemented and certified for advanced applications and extended environments.

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within DOC200103 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military, Ruggedized COTS or Commercial environments.

1.2

2.1

APPLICABLE DOCUMENTS

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Standards

MIL-STD-202

MIL-STD-883

MIL-STD-1686

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Electrostatic Discharge Control Program for Protection of Electrical and

Electronic Parts, Assemblies and Equipment

Vectron International

QSP-90100

Quality Systems Manual, Vectron International

VL-65339

Identification Common Documents, Materials and Processes, Hi-Rel XO

3.1

GENERAL REQUIREMENTS

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 3, Class 2 of MIL-PRF-55310. Devices carry a Class 1C ESDS classification per

MIL-PRF-38534 and are marked with a single equilateral triangle at pin 1 per MIL-PRF-

55310.

Item Identification. External packaging choices are either metal flatpacks or DDIP with either

Sinewave or CMOS logic output. Unique Model Number Series’ are utilized to identify device

package configurations and output waveform as listed in Table 1.

UNSPECIFIED TOLERANCES

3.2

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

VECTRON INTERNATIONAL PROPRIETARY

3.3

Absolute Maximum Ratings.

a. Supply Voltage Range (V

b. Storage Temperature Range (T

STG

c. Junction Temperature (T

d. Lead Temperature (soldering, 10 seconds):

-0.5Vdc to +7.0Vdc (+5V CMOS)

-0.5Vdc to +5.0Vdc (+3.3V CMOS)

Contact factory for sinewave output

-65°C to +125°C

+150C

+300°C

3.4

3.4.1

Design, Parts, Materials and Processes, Assembly, Inspection and Test.

Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. All designs utilize a 4-point crystal mount.

For radiation characteristics, see paragraph 4.1.3. For all Class S and Class B products,

components meet the Element Evaluation requirements of MIL-PRF-55310, Appendix B. If

Design Pedigree Code “E” is chosen, Enhanced Element Evaluation per Appendix A herein

will be performed.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310. These designs have also passed extended dynamic levels of at least:

Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)

Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms)

Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)

3.4.2

Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

Assembly. Manufacturing utilizes standardized procedures, processes and verification

methods to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices.

MIL-PRF-38534 Group B Option 1 in-line inspection is included on levels E and R per

paragraph 7.1 to further verify lot pedigree. Traceability of all components and production lots

are in accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a

part of the deliverable data package.

3.4.3

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

VECTRON INTERNATIONAL PROPRIETARY

3.4.4

Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 derived system of QSP-90100.

Test. The Screening test matrix of Table 4 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs as the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified componentry noted in paragraphs 3.4.3 and 4.1.

DETAIL REQUIREMENTS

Components

Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. Premium Q swept quartz is standard for all Class S level products because of its

superior radiation tolerance. For Class B level products, swept quartz is optional, as required

by the customer. In accordance with MIL-PRF-55310, the manufacturer has a documented

crystal evaluation program.

Passive Components. Where possible, for Design Pedigrees ‘E’ & ‘R’, Established Reliability

(ER) failure level R and S passive components are employed. Otherwise, all components

comply with the Element Evaluation requirements of MIL-PRF-55310, Appendix B, or

Enhanced Element Evaluation as specified in Appendix A herein.

Class S Microcircuits. Microcircuits are procured from wafer lots that have passed MIL-PRF-

55310 Lot Acceptance Tests for Class S devices. Although radiation testing is not performed

at the oscillator level, Design Pedigree Codes E and R versions of this TCXO are acceptable

for use in environments of up to 100 krads total dose by analysis of the individual components.

Sinewave devices are assembled with all bipolar semiconductors. ACMOS devices are

assembled with all bipolar semiconductors with the exception of the ACMOS chip used to

provide the CMOS output. An ACMOS die from a radiation tested and certified wafer lot will

be provided for all Class S versions of this TCXO. This microcircuit is certified for

100krads(Si) total ionizing dose (TID), RHA level R (2X minimum margin). NSC, as the

54ACT designer, rates the SET LET at > 33MeV and SEL at >120MeV for the FACT™

family (AN-932). Vectron has conducted additional SEE testing in 2008 to verify this

performance since our lot wafer testing does not include these parameters and determinations.

A copy of the parts list and materials can be provided for customer review upon request.

3.4.5

3.4.6

3.4.7

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1 Class B Microcircuits. When specified, microcircuits assembled into Pedigree Codes B and C

devices (¶ 5.2a) are procured from wafer lots that have passed MIL-PRF-55310 element

evaluations for Class B devices.

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

VECTRON INTERNATIONAL PROPRIETARY

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. Package lots are evaluated in accordance with the requirements

of MIL-PRF-38534 as applicable.

Traceability. Class S active device lots are homogenous and traceable to the manufacturer’s

individual wafer. Swept Quartz Crystals are traceable to the quartz bar and the processing

details of the autoclave lot, as applicable. All other elements and materials are traceable to

their manufacturing lots. Manufacturing lot and date code information shall be recorded, by

TCXO serial number, of every component and all materials used in the manufacture of that

TCXO. All semiconductors used in the manufacture of a given production lot of TCXOs shall

be from the same wafer and have the same manufacturing lot date code. A production lot, as

defined by Vectron, is all oscillators that have been kitted and assembled as a single group.

After the initial kitting and assembly, this production lot may be divided into multiple sublots

to facilitate alignment and test capacity and may be sealed at multiple times within a 13 week

window.

Mechanical.

Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found

in the referenced Figure.

Thermal Characteristics. Because these TCXOs are multichip hybrid designs, the actual

any one given semiconductor die will vary, but the combined average for all active devices

results in a

of approximately 40°C/W. The typical die temperature rise at any one given

semiconductor is 2°C to 4°C. With the oscillator operating at +125°C, the average junction

temperature is approximately +129°C and under no circumstance will it ever exceed the

maximum manufacturer’s rated junction temperature.

Electrical.

Input Power. CMOS devices are designed for 3.3 ±5% or 5.0 volt ±5% DC operation.

Sinewave devices are designed for 3.3, 5.0, 12.0 or 15.0 volt dc operation with ±5% tolerance.

Temperature Range. Operating range is IAW the chosen temperature stability code.

Frequency Tolerance. Temperature stability includes initial accuracy at +25°C (with EFC),

load ±10% and supply ±5%.

All devices include an External Frequency Control (EFC) pin for the purpose of externally

setting each TCXO to its nominal frequency. The EFC shall be accomplished by connecting a

resistor or trimmer potentiometer from that Pin to GND. The EFC resistance adjustment range

is 0Ω or GND to 20KΩ max with Nominal frequency typically occurring in the 7KΩ to 13KΩ

range.

UNSPECIFIED TOLERANCES

4.1.5

4.2

4.2.1

4.2.2

4.3

4.3.1

4.3.2

4.3.3

4.3.4

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

DOC200103

VECTRON INTERNATIONAL PROPRIETARY

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