FTF512K8-60CC5 datasheet, PDF - EEWORLD Datasheet

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FTF512K8-60CC5: DescriptionFlash, 512KX8, 60ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32; Categorystorage storage; File Size341KB，11 Pages; ManufacturerForce Technologies Ltd.

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FTF512K8-60CC5 Overview

Flash, 512KX8, 60ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32

FTF512K8-60CC5 Parametric

Parameter Name	Attribute value
Objectid	2038293674
Parts packaging code	DIP
package instruction	DIP, DIP32,.6
Contacts	32
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum access time	60 ns
command user interface	NO
Data polling	YES
JESD-30 code	R-CDIP-T32
length	42.4 mm
memory density	4194304 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of departments/size	8
Number of terminals	32
word count	524288 words
character code	512000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Encapsulate equivalent code	DIP32,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
power supply	5 V
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	4.34 mm
Department size	64K
Maximum standby current	0.0016 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
switch bit	NO
type	NOR TYPE
width	15.24 mm

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FTF512K8-XXX5

512Kx8 MONOLITHIC FLASH

FEATURES

■

Access Times of 60, 70, 90, 120, 150ns

■

Packaging

32 pin, Hermetic Ceramic, 0.600" DIP

32 lead, Hermetic Ceramic, 0.400" SOJ

32 pin, Rectangular Ceramic Leadless Chip

Carrier

32 lead Flatpack

■

1,000,000 Erase/Program Cycles Minimum

■

Sector Erase Architecture

8 equal size sectors of 64K bytes each

Any combination of sectors can be concurrently

erased. Also supports full chip erase

PIN CONFIGURATION

32 DIP

32 CSOJ

32 Flatpack

■

Organized as 512Kx8

■

Commercial, Industrial and Military Temperature

Ranges

■

5 Volt Programming. 5V ± 10% Supply.

■

Low Power CMOS

■

Embedded Erase and Program Algorithms

■

TTL Compatible Inputs and CMOS Outputs

■

Page Program Operation and Internal Program

Control Time.

32 CLCC

IEW

A12

A18

A16

A15

A12

I/O0

I/O1

I/O2

IEW

A15

A16

A18

A17

A14

A13

A11

A10

I/O7

I/O6

I/O5

I/O4

I/O3

I/O1

I/O2

I/O3

I/O4

I/O5

ESCRIPTION

I/O

0-7

Address Inputs

Data Input/Output

Chip Select

Output Enable

Write Enable

+5.0V Power

Ground

I/O6

4 3 2 1 32 31 30

I/O

14 15 16 17 18 19 20

A14

A13

A11

A10

I/O7

A17

FTF512K8-60CC5 Related Products

	FTF512K8-60CC5	FTF512K8-60CM5	FTF512K8-90CM5	FTF512K8-90CM5A
Description	Flash, 512KX8, 60ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32	Flash, 512KX8, 60ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32	Flash, 512KX8, 90ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32	Flash, 512KX8, 90ns, CDIP32, SIDE BRAZED, CERAMIC, DIP-32
Objectid	2038293674	2038293704	2038293848	2038293845
Parts packaging code	DIP	DIP	DIP	DIP
package instruction	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6	DIP, DIP32,.6
Contacts	32	32	32	32
Reach Compliance Code	compliant	compliant	compliant	compliant
ECCN code	EAR99	3A001.A.2.C	3A001.A.2.C	3A001.A.2.C
Maximum access time	60 ns	60 ns	90 ns	90 ns
command user interface	NO	NO	NO	NO
Data polling	YES	YES	YES	YES
JESD-30 code	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32	R-CDIP-T32
length	42.4 mm	42.4 mm	42.4 mm	42.4 mm
memory density	4194304 bit	4194304 bit	4194304 bit	4194304 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of departments/size	8	8	8	8
Number of terminals	32	32	32	32
word count	524288 words	524288 words	524288 words	524288 words
character code	512000	512000	512000	512000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-55 °C	-55 °C	-55 °C
organize	512KX8	512KX8	512KX8	512KX8
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP32,.6	DIP32,.6	DIP32,.6	DIP32,.6
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V
Programming voltage	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.34 mm	4.34 mm	4.34 mm	4.34 mm
Department size	64K	64K	64K	64K
Maximum standby current	0.0016 A	0.0016 A	0.0016 A	0.0016 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
switch bit	NO	NO	NO	NO
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	15.24 mm	15.24 mm	15.24 mm	15.24 mm

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